JP1700006S - - Google Patents

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Publication number
JP1700006S
JP1700006S JPD2021-4172F JP2021004172F JP1700006S JP 1700006 S JP1700006 S JP 1700006S JP 2021004172 F JP2021004172 F JP 2021004172F JP 1700006 S JP1700006 S JP 1700006S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2021-4172F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP1700006S publication Critical patent/JP1700006S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2021-4172F 2021-02-23 2021-02-26 Active JP1700006S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20210008923 2021-02-23

Publications (1)

Publication Number Publication Date
JP1700006S true JP1700006S (en) 2021-11-22

Family

ID=78604409

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2021-4172F Active JP1700006S (en) 2021-02-23 2021-02-26

Country Status (2)

Country Link
US (1) USD973030S1 (en)
JP (1) JP1700006S (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1712327S (en) * 2021-06-18 2022-04-12 Semiconductor element

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD523403S1 (en) * 2004-09-09 2006-06-20 Kabushiki Kaisha Toshiba Substrate for a semiconductor device
JP2008066655A (en) * 2006-09-11 2008-03-21 Matsushita Electric Ind Co Ltd Semiconductor device, manufacturing method of the semiconductor device, and electrical apparatus system
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
JP1578686S (en) * 2016-10-31 2017-06-12
JP6827776B2 (en) * 2016-11-15 2021-02-10 ローム株式会社 Semiconductor device
WO2018142464A1 (en) * 2017-01-31 2018-08-09 堺ディスプレイプロダクト株式会社 Production method for vapor deposition mask, vapor deposition mask, and production method for organic semiconductor element
US10605828B2 (en) * 2017-03-30 2020-03-31 Advanced Semiconductor Engineering, Inc. Device for attaching a semiconductor device to a circuit board
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
US10418255B2 (en) * 2017-12-01 2019-09-17 Micron Technology, Inc. Semiconductor device packages and related methods
JP7113221B2 (en) * 2018-02-08 2022-08-05 パナソニックIpマネジメント株式会社 Silicon carbide semiconductor device
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
JP1669329S (en) * 2020-03-13 2020-10-05
USD916039S1 (en) * 2020-03-20 2021-04-13 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
JP1684023S (en) * 2020-04-01 2021-04-26
JP1712327S (en) * 2021-06-18 2022-04-12 Semiconductor element

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Publication number Publication date
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