JP1669329S - - Google Patents
Info
- Publication number
- JP1669329S JP1669329S JPD2020-5015F JP2020005015F JP1669329S JP 1669329 S JP1669329 S JP 1669329S JP 2020005015 F JP2020005015 F JP 2020005015F JP 1669329 S JP1669329 S JP 1669329S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2020-5015F JP1669329S (en) | 2020-03-13 | 2020-03-13 | |
| US29/749,132 USD949807S1 (en) | 2020-03-13 | 2020-09-03 | Semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2020-5015F JP1669329S (en) | 2020-03-13 | 2020-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1669329S true JP1669329S (en) | 2020-10-05 |
Family
ID=72665496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2020-5015F Active JP1669329S (en) | 2020-03-13 | 2020-03-13 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD949807S1 (en) |
| JP (1) | JP1669329S (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD933618S1 (en) * | 2018-10-31 | 2021-10-19 | Asahi Kasei Microdevices Corporation | Semiconductor module |
| JP1659675S (en) * | 2019-08-29 | 2020-05-18 | ||
| JP1659676S (en) * | 2019-08-29 | 2020-05-18 | ||
| JP1659678S (en) * | 2019-08-29 | 2020-05-18 | ||
| TWD206651S (en) * | 2020-04-24 | 2020-08-21 | 財團法人工業技術研究院 | Power module |
| JP1700006S (en) * | 2021-02-23 | 2021-11-22 | ||
| USD1034490S1 (en) * | 2022-05-09 | 2024-07-09 | Shenzhen Deruisi Electronic Technology Co., Ltd. | Bracket for heat sink of CPU |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD441726S1 (en) * | 1999-07-14 | 2001-05-08 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Semiconductor element |
| CN103210489B (en) * | 2010-11-16 | 2016-06-15 | 富士电机株式会社 | Semiconductor device |
| EP2804212A4 (en) * | 2012-03-28 | 2015-12-09 | Fuji Electric Co Ltd | Semiconductor device |
| USD703625S1 (en) * | 2012-12-06 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Power semiconductor module |
| USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| JP6176320B2 (en) * | 2013-04-25 | 2017-08-09 | 富士電機株式会社 | Semiconductor device |
| JP6171586B2 (en) * | 2013-06-04 | 2017-08-02 | 富士電機株式会社 | Semiconductor device |
| JP1519306S (en) | 2014-07-16 | 2015-03-16 | ||
| JP6233528B2 (en) * | 2014-10-14 | 2017-11-22 | 富士電機株式会社 | Semiconductor device |
| JP1538035S (en) | 2015-03-05 | 2015-11-16 | ||
| JP6350765B2 (en) * | 2016-01-15 | 2018-07-04 | 富士電機株式会社 | Semiconductor device |
| JP1578686S (en) * | 2016-10-31 | 2017-06-12 | ||
| CN109417068B (en) * | 2017-01-17 | 2022-05-06 | 富士电机株式会社 | Semiconductor device with a plurality of semiconductor chips |
| WO2018142863A1 (en) * | 2017-02-06 | 2018-08-09 | 富士電機株式会社 | Semiconductor module, electric automobile and power control unit |
| JP1632173S (en) * | 2018-06-01 | 2019-05-27 |
-
2020
- 2020-03-13 JP JPD2020-5015F patent/JP1669329S/ja active Active
- 2020-09-03 US US29/749,132 patent/USD949807S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD949807S1 (en) | 2022-04-26 |