JP1685752S - - Google Patents

Info

Publication number
JP1685752S
JP1685752S JPD2020-23696F JP2020023696F JP1685752S JP 1685752 S JP1685752 S JP 1685752S JP 2020023696 F JP2020023696 F JP 2020023696F JP 1685752 S JP1685752 S JP 1685752S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2020-23696F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2020-23696F priority Critical patent/JP1685752S/ja
Priority to US35/355,127 priority patent/USD946540S1/en
Application granted granted Critical
Publication of JP1685752S publication Critical patent/JP1685752S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2020-23696F 2020-11-02 2020-11-02 Active JP1685752S (member.php)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2020-23696F JP1685752S (member.php) 2020-11-02 2020-11-02
US35/355,127 USD946540S1 (en) 2020-11-02 2021-04-22 Temporary protective film for manufacturing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2020-23696F JP1685752S (member.php) 2020-11-02 2020-11-02

Publications (1)

Publication Number Publication Date
JP1685752S true JP1685752S (member.php) 2021-05-24

Family

ID=75966648

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2020-23696F Active JP1685752S (member.php) 2020-11-02 2020-11-02

Country Status (2)

Country Link
US (1) USD946540S1 (member.php)
JP (1) JP1685752S (member.php)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2080052A (en) * 1936-02-04 1937-05-11 Lemaster Hager Adhesive tape box
US2082546A (en) * 1936-04-07 1937-06-01 Machate Fred Tape dispensing package
US2229961A (en) * 1938-10-04 1941-01-28 Gerard C Deane Shielded cutting device
US2414333A (en) * 1944-01-17 1947-01-14 Internat Plastic Corp Combined container and dispenser for tape
US2626666A (en) * 1949-04-16 1953-01-27 Scholl Mfg Co Inc Tape cutter
US2699251A (en) * 1952-06-25 1955-01-11 Frank E Rizza Dispenser for adhesive tape
US2694533A (en) * 1954-03-16 1954-11-16 Zucker Sam Adhesive tape dispenser
US3001306A (en) * 1956-02-20 1961-09-26 Walter B Wilkinson Index tabs and production thereof
US3237174A (en) * 1962-11-02 1966-02-22 Ex Cell O Corp Magnetic core memory matrix and process of manufacturing the same
US3187968A (en) * 1963-10-11 1965-06-08 Edward A Favre Tape dispenser
US3216634A (en) * 1963-11-18 1965-11-09 Johns Manville Tape dispenser
JP2509075Y2 (ja) * 1988-09-26 1996-08-28 北川工業株式会社 雑音電流吸収具
US5258888A (en) * 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
USD433061S (en) * 1999-05-26 2000-10-31 Dick Shen Pivot collar of adhesive tape
US7669631B2 (en) * 2004-04-02 2010-03-02 Shurtech Brands, Llc Adhesive tape dispenser
CN101451053A (zh) * 2004-05-18 2009-06-10 日立化成工业株式会社 粘接接合片与使用该粘接接合片的半导体装置以及其制造方法
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
JP5537789B2 (ja) * 2008-10-01 2014-07-02 日東電工株式会社 レーザー加工用粘着シート及びレーザー加工方法
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD656909S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656910S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD741406S1 (en) * 2014-09-25 2015-10-20 Jeremy Doucette Adhesive tape roll with non-adherent pull tab
USD847258S1 (en) * 2017-07-23 2019-04-30 Heejoong Kang Adhesive tape

Also Published As

Publication number Publication date
USD946540S1 (en) 2022-03-22

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