JP1659287S - - Google Patents
Info
- Publication number
- JP1659287S JP1659287S JPD2019-23330F JP2019023330F JP1659287S JP 1659287 S JP1659287 S JP 1659287S JP 2019023330 F JP2019023330 F JP 2019023330F JP 1659287 S JP1659287 S JP 1659287S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-23330F JP1659287S (fr) | 2019-10-18 | 2019-10-18 | |
| TW109302067F TWD210379S (zh) | 2019-10-18 | 2020-04-16 | 電漿處理裝置用保護環 |
| US29/731,604 USD954986S1 (en) | 2019-10-18 | 2020-04-16 | Electrode cover for a plasma processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-23330F JP1659287S (fr) | 2019-10-18 | 2019-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1659287S true JP1659287S (fr) | 2020-05-11 |
Family
ID=70483560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2019-23330F Active JP1659287S (fr) | 2019-10-18 | 2019-10-18 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD954986S1 (fr) |
| JP (1) | JP1659287S (fr) |
| TW (1) | TWD210379S (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1005245S1 (en) | 2021-04-19 | 2023-11-21 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11996315B2 (en) | 2020-11-18 | 2024-05-28 | Applied Materials, Inc. | Thin substrate handling via edge clamping |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4579354A (en) * | 1984-12-05 | 1986-04-01 | Vassallo Research And Development Corporation | Gasket |
| USD638550S1 (en) * | 2009-11-13 | 2011-05-24 | 3M Innovative Properties Company | Sample processing disk cover |
| USD667561S1 (en) * | 2009-11-13 | 2012-09-18 | 3M Innovative Properties Company | Sample processing disk cover |
| JP1546800S (fr) * | 2015-06-12 | 2016-03-28 | ||
| JP1545406S (fr) * | 2015-06-16 | 2016-03-14 | ||
| JP1545407S (fr) * | 2015-06-16 | 2016-03-14 | ||
| USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
| USD830434S1 (en) * | 2015-12-28 | 2018-10-09 | Ntn Corporation | Inner ring for tapered roller bearing |
| JP1584906S (fr) * | 2017-01-31 | 2017-08-28 | ||
| JP1584241S (fr) * | 2017-01-31 | 2017-08-21 | ||
| JP1598984S (fr) * | 2017-07-31 | 2018-03-05 | ||
| JP1598997S (fr) * | 2017-08-31 | 2018-03-05 | ||
| JP1598996S (fr) * | 2017-08-31 | 2018-03-05 | ||
| JP1598998S (fr) * | 2017-08-31 | 2018-03-05 | ||
| JP1605832S (fr) * | 2017-11-06 | 2018-06-04 | ||
| JP1640255S (fr) * | 2018-10-25 | 2019-09-02 | ||
| USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD917026S1 (en) * | 2019-09-12 | 2021-04-20 | S & B Technical Products, Inc. | Pipe sealing gasket |
-
2019
- 2019-10-18 JP JPD2019-23330F patent/JP1659287S/ja active Active
-
2020
- 2020-04-16 US US29/731,604 patent/USD954986S1/en active Active
- 2020-04-16 TW TW109302067F patent/TWD210379S/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1005245S1 (en) | 2021-04-19 | 2023-11-21 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD210379S (zh) | 2021-03-11 |
| USD954986S1 (en) | 2022-06-14 |