JP1648519S - - Google Patents

Info

Publication number
JP1648519S
JP1648519S JPD2018-21799F JP2018021799F JP1648519S JP 1648519 S JP1648519 S JP 1648519S JP 2018021799 F JP2018021799 F JP 2018021799F JP 1648519 S JP1648519 S JP 1648519S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-21799F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-21799F priority Critical patent/JP1648519S/ja
Priority to TW108301945F priority patent/TWD203027S/zh
Priority to US35/355,090 priority patent/USD935425S1/en
Application granted granted Critical
Publication of JP1648519S publication Critical patent/JP1648519S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4585Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
JPD2018-21799F 2018-10-04 2018-10-04 Active JP1648519S (enrdf_load_stackoverflow)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2018-21799F JP1648519S (enrdf_load_stackoverflow) 2018-10-04 2018-10-04
TW108301945F TWD203027S (zh) 2018-10-04 2019-04-03 基座
US35/355,090 USD935425S1 (en) 2018-10-04 2019-04-04 Susceptor for use in production of a semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-21799F JP1648519S (enrdf_load_stackoverflow) 2018-10-04 2018-10-04

Publications (1)

Publication Number Publication Date
JP1648519S true JP1648519S (enrdf_load_stackoverflow) 2019-12-23

Family

ID=68916791

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-21799F Active JP1648519S (enrdf_load_stackoverflow) 2018-10-04 2018-10-04

Country Status (3)

Country Link
US (1) USD935425S1 (enrdf_load_stackoverflow)
JP (1) JP1648519S (enrdf_load_stackoverflow)
TW (1) TWD203027S (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD975665S1 (en) * 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
USD965044S1 (en) * 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
USD1012873S1 (en) 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
USD980813S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
JP1711119S (ja) * 2021-10-22 2022-03-29 サセプタリング
JP1741173S (ja) * 2022-10-20 2023-04-06 半導体ウェハ及びサセプタ加熱用ヒータ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7122844B2 (en) * 2002-05-13 2006-10-17 Cree, Inc. Susceptor for MOCVD reactor
US8366830B2 (en) * 2003-03-04 2013-02-05 Cree, Inc. Susceptor apparatus for inverted type MOCVD reactor
EP1790757B1 (en) * 2004-07-22 2013-08-14 Toyo Tanso Co., Ltd. Susceptor
US20100055318A1 (en) 2008-08-29 2010-03-04 Veeco Instruments Inc. Wafer carrier with varying thermal resistance
US8801857B2 (en) * 2008-10-31 2014-08-12 Asm America, Inc. Self-centering susceptor ring assembly
JP1438319S (enrdf_load_stackoverflow) * 2011-09-20 2015-04-06
JP1438320S (enrdf_load_stackoverflow) * 2011-09-20 2015-04-06
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition

Also Published As

Publication number Publication date
USD935425S1 (en) 2021-11-09
TWD203027S (zh) 2020-03-01

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