JP1643135S - - Google Patents
Info
- Publication number
- JP1643135S JP1643135S JPD2019-5630F JP2019005630F JP1643135S JP 1643135 S JP1643135 S JP 1643135S JP 2019005630 F JP2019005630 F JP 2019005630F JP 1643135 S JP1643135 S JP 1643135S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-5630F JP1643135S (zh) | 2019-03-15 | 2019-03-15 | |
US29/704,641 USD911987S1 (en) | 2019-03-15 | 2019-09-05 | Semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-5630F JP1643135S (zh) | 2019-03-15 | 2019-03-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1643135S true JP1643135S (zh) | 2019-10-07 |
Family
ID=68095734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JPD2019-5630F Active JP1643135S (zh) | 2019-03-15 | 2019-03-15 |
Country Status (2)
Country | Link |
---|---|
US (1) | USD911987S1 (zh) |
JP (1) | JP1643135S (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1643024S (zh) * | 2019-03-15 | 2019-10-07 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD317592S (en) * | 1987-01-19 | 1991-06-18 | Canon Kabushiki Kaisha | Semiconductor element |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
JP2891665B2 (ja) * | 1996-03-22 | 1999-05-17 | 株式会社日立製作所 | 半導体集積回路装置およびその製造方法 |
USD401567S (en) * | 1997-04-25 | 1998-11-24 | Micron Technology, Inc. | Temporary package for semiconductor dice |
EP0884781A3 (en) * | 1997-06-12 | 1999-06-30 | Hitachi, Ltd. | Power semiconductor module |
US6268650B1 (en) * | 1999-05-25 | 2001-07-31 | Micron Technology, Inc. | Semiconductor device, ball grid array connection system, and method of making |
USD441726S1 (en) * | 1999-07-14 | 2001-05-08 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Semiconductor element |
JP4151209B2 (ja) * | 2000-08-29 | 2008-09-17 | 三菱電機株式会社 | 電力用半導体装置 |
US6774465B2 (en) * | 2001-10-05 | 2004-08-10 | Fairchild Korea Semiconductor, Ltd. | Semiconductor power package module |
USD522470S1 (en) * | 2004-09-09 | 2006-06-06 | Kabushiki Kaisha Toshiba | Portion of a semiconductor device |
JP5041798B2 (ja) * | 2006-12-15 | 2012-10-03 | 三菱電機株式会社 | 半導体装置 |
USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
USD686174S1 (en) * | 2011-08-12 | 2013-07-16 | Fuji Electric Co., Ltd | Semiconductor device |
USD774479S1 (en) * | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD748595S1 (en) * | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
USD766851S1 (en) * | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
USD799439S1 (en) * | 2016-05-31 | 2017-10-10 | Rohm Co., Ltd. | Power converting semiconductor module |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
-
2019
- 2019-03-15 JP JPD2019-5630F patent/JP1643135S/ja active Active
- 2019-09-05 US US29/704,641 patent/USD911987S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD911987S1 (en) | 2021-03-02 |