JP1612685S - - Google Patents

Info

Publication number
JP1612685S
JP1612685S JPD2018-2527F JP2018002527F JP1612685S JP 1612685 S JP1612685 S JP 1612685S JP 2018002527 F JP2018002527 F JP 2018002527F JP 1612685 S JP1612685 S JP 1612685S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-2527F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-2527F priority Critical patent/JP1612685S/ja
Priority to TW107304496F priority patent/TWD197465S/zh
Priority to US35/355,064 priority patent/USD895075S1/en
Application granted granted Critical
Publication of JP1612685S publication Critical patent/JP1612685S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-2527F 2018-02-08 2018-02-08 Active JP1612685S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2018-2527F JP1612685S (enExample) 2018-02-08 2018-02-08
TW107304496F TWD197465S (zh) 2018-02-08 2018-08-02 半導體製造裝置用密封材
US35/355,064 USD895075S1 (en) 2018-02-08 2018-08-03 Seal member for semiconductor production apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-2527F JP1612685S (enExample) 2018-02-08 2018-02-08

Publications (1)

Publication Number Publication Date
JP1612685S true JP1612685S (enExample) 2018-09-03

Family

ID=63369077

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-2527F Active JP1612685S (enExample) 2018-02-08 2018-02-08

Country Status (3)

Country Link
US (1) USD895075S1 (enExample)
JP (1) JP1612685S (enExample)
TW (1) TWD197465S (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD895075S1 (en) 2018-02-08 2020-09-01 Valqua, Ltd. Seal member for semiconductor production apparatus
USD1036632S1 (en) 2021-12-23 2024-07-23 Daikin Finetech, Ltd. Seal member

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US11387134B2 (en) * 2018-01-19 2022-07-12 Applied Materials, Inc. Process kit for a substrate support
US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support
KR102851519B1 (ko) 2018-04-20 2025-08-27 램 리써치 코포레이션 에지 배제 제어
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD962904S1 (en) * 2019-09-18 2022-09-06 Shenzhen Chuang Jin Heng Electronic Technology Co., LTD Flat antenna
USD1031951S1 (en) * 2020-07-30 2024-06-18 Valqua, Ltd. Composite seal
USD986394S1 (en) * 2021-05-12 2023-05-16 S & B Technical Products, Inc. Pipe sealing gasket
JP1721880S (ja) * 2022-02-02 2022-08-08 シール材
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
KR20250034975A (ko) 2022-07-08 2025-03-11 토소우 에스엠디, 인크 물리적 기상 증착 스퍼터 애플리케이션을 위한 동적 진공 밀봉 시스템
JP1746769S (ja) * 2023-01-31 2023-06-20 複合シール材
USD1083043S1 (en) * 2023-03-28 2025-07-08 Mitsubishi Cable Industries, Ltd. Composite seal member for semiconductor production apparatus
USD1109856S1 (en) 2023-07-07 2026-01-20 Tosoh Smd, Inc. Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications
USD1105368S1 (en) * 2023-07-11 2025-12-09 Caterpillar Inc. Dual-peak annular seal
JP1760971S (enExample) * 2023-08-31 2024-01-10

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US4421330A (en) * 1982-02-08 1983-12-20 Greene, Tweed & Co., Inc. Antifriction fluid seal assembly
USD289078S (en) * 1984-10-26 1987-03-31 Vassallo Research And Development Corporation Gasket
US4582366A (en) * 1984-11-02 1986-04-15 Burfield Peter C Lubricant seal for track linkage
JPH0512844U (ja) * 1991-07-30 1993-02-19 日東工器株式会社 シ−ルリング
USD379493S (en) * 1994-12-19 1997-05-27 Greene, Tweed Of Delaware, Inc. Gasket seal
USD498826S1 (en) * 2003-02-13 2004-11-23 Nichias Co., Ltd Metal ring gasket
TWD150427S (zh) 2009-08-10 2012-11-21 日本華爾卡工業股份有限公司 複合密封材
USD646764S1 (en) * 2010-11-04 2011-10-11 Faster S.P.A. Sealing gasket
USD696751S1 (en) * 2011-10-27 2013-12-31 Mueller International, Llc Slip-on gasket
USD754308S1 (en) 2012-08-07 2016-04-19 Nippon Valqua Industries, Ltd. Composite sealing material
USD728757S1 (en) * 2013-01-04 2015-05-05 Michael Graham Gasket
JP6108527B2 (ja) * 2013-02-28 2017-04-05 Kyb株式会社 シール部材及びシール部材を備えるフロントフォーク
USD728182S1 (en) * 2013-04-15 2015-04-28 Robert Brian Cook Paint can gasket
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USD857859S1 (en) * 2017-07-12 2019-08-27 Mcwane, Inc. Restrained gasket
USD818089S1 (en) * 2016-09-14 2018-05-15 Nippon Valqua Industries, Ltd. Composite seal
JP1581994S (enExample) * 2016-11-29 2017-07-24
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USD852935S1 (en) * 2017-09-19 2019-07-02 Mcwane, Inc. Restrained gasket
USD846098S1 (en) * 2017-09-19 2019-04-16 Mcwane, Inc. Restrained gasket
USD846097S1 (en) * 2017-09-19 2019-04-16 Mcwane, Inc. Restrained gasket
USD846096S1 (en) * 2017-09-19 2019-04-16 Mcwane, Inc. Restrained gasket
USD852335S1 (en) * 2017-09-19 2019-06-25 Mcwane, Inc. Restrained gasket
JP1612685S (enExample) 2018-02-08 2018-09-03
JP1612684S (enExample) 2018-02-08 2018-09-03

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD895075S1 (en) 2018-02-08 2020-09-01 Valqua, Ltd. Seal member for semiconductor production apparatus
USD1036632S1 (en) 2021-12-23 2024-07-23 Daikin Finetech, Ltd. Seal member

Also Published As

Publication number Publication date
USD895075S1 (en) 2020-09-01
TWD197465S (zh) 2019-05-11

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