|
EP1926142A1
(en)
*
|
2005-09-15 |
2008-05-28 |
Mitsubishi Materials Corporation |
Insulating circuit board and insulating circuit board provided with cooling sink section
|
|
USD601515S1
(en)
*
|
2008-12-17 |
2009-10-06 |
Celsia Technologies Taiwan, Inc. |
Heat sink
|
|
JP5120284B2
(ja)
*
|
2009-02-04 |
2013-01-16 |
株式会社豊田自動織機 |
半導体装置
|
|
JP6189015B2
(ja)
*
|
2012-04-19 |
2017-08-30 |
昭和電工株式会社 |
放熱装置および放熱装置の製造方法
|
|
KR20130139011A
(ko)
*
|
2012-06-12 |
2013-12-20 |
한국전자통신연구원 |
Ｄｂｃ 기판 및 전력 반도체 모듈
|
|
KR101766552B1
(ko)
*
|
2012-07-06 |
2017-08-08 |
닛폰 하츠죠 가부시키가이샤 |
회로 기판용 적층판, 금속 베이스 회로 기판 및 파워 모듈
|
|
EP2922090B1
(en)
*
|
2012-11-20 |
2019-07-31 |
Dowa Metaltech Co., Ltd. |
Metal-ceramic bonded substrate and method for producing same
|
|
US20160014878A1
(en)
*
|
2014-04-25 |
2016-01-14 |
Rogers Corporation |
Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
|
|
EP3208839B1
(en)
*
|
2014-10-16 |
2021-07-28 |
Mitsubishi Materials Corporation |
Substrate with cooler for power modules and method for producing same
|
|
WO2017060224A1
(de)
*
|
2015-10-07 |
2017-04-13 |
Ceramtec Gmbh |
Zweiseitig gekühlter schaltkreis
|
|
JP6137267B2
(ja)
*
|
2015-10-08 |
2017-05-31 |
三菱マテリアル株式会社 |
ヒートシンク付きパワーモジュール用基板及びパワーモジュール
|
|
US20170205149A1
(en)
*
|
2016-01-15 |
2017-07-20 |
Hamilton Sundstrand Corporation |
Heat exchanger channels
|
|
JP6754973B2
(ja)
*
|
2017-02-02 |
2020-09-16 |
パナソニックＩｐマネジメント株式会社 |
グラファイト放熱板
|