JP1519750S - - Google Patents

Info

Publication number
JP1519750S
JP1519750S JPD2014-10413F JP2014010413F JP1519750S JP 1519750 S JP1519750 S JP 1519750S JP 2014010413 F JP2014010413 F JP 2014010413F JP 1519750 S JP1519750 S JP 1519750S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2014-10413F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2014-10413F priority Critical patent/JP1519750S/ja
Priority to US29/500,867 priority patent/USD730304S1/en
Application granted granted Critical
Publication of JP1519750S publication Critical patent/JP1519750S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2014-10413F 2014-05-15 2014-05-15 Active JP1519750S (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2014-10413F JP1519750S (enrdf_load_stackoverflow) 2014-05-15 2014-05-15
US29/500,867 USD730304S1 (en) 2014-05-15 2014-08-29 Substrate for an electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2014-10413F JP1519750S (enrdf_load_stackoverflow) 2014-05-15 2014-05-15

Publications (1)

Publication Number Publication Date
JP1519750S true JP1519750S (enrdf_load_stackoverflow) 2015-03-23

Family

ID=53176777

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2014-10413F Active JP1519750S (enrdf_load_stackoverflow) 2014-05-15 2014-05-15

Country Status (2)

Country Link
US (1) USD730304S1 (enrdf_load_stackoverflow)
JP (1) JP1519750S (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD754083S1 (en) 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
JP1528936S (enrdf_load_stackoverflow) * 2015-01-14 2015-07-13
JP1528485S (enrdf_load_stackoverflow) * 2015-01-14 2015-07-13
JP1528484S (enrdf_load_stackoverflow) * 2015-01-14 2015-07-13
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD942974S1 (en) 2018-11-20 2022-02-08 Thales Dis Ais Deutschland Gmbh Cellular module
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
USD264963S (en) * 1979-06-01 1982-06-15 Perception Electronics, Inc. Component mounting plate for a PC board indicator and control device
JP3983387B2 (ja) * 1998-09-29 2007-09-26 日本碍子株式会社 静電チャック
US6500059B2 (en) * 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US7430104B2 (en) * 2003-03-11 2008-09-30 Appiled Materials, Inc. Electrostatic chuck for wafer metrology and inspection equipment
TWD110148S1 (zh) * 2004-10-14 2006-04-11 東芝照明技術股份有限公司 照明用發光體
TWD110150S1 (zh) * 2004-10-14 2006-04-11 東芝照明技術股份有限公司 照明用發光體
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
USD670917S1 (en) * 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD637193S1 (en) 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD702445S1 (en) * 2012-05-11 2014-04-15 Columbia Sportswear North America, Inc. Printed cooling material
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module

Also Published As

Publication number Publication date
USD730304S1 (en) 2015-05-26

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