JP1519750S - - Google Patents
Info
- Publication number
- JP1519750S JP1519750S JPD2014-10413F JP2014010413F JP1519750S JP 1519750 S JP1519750 S JP 1519750S JP 2014010413 F JP2014010413 F JP 2014010413F JP 1519750 S JP1519750 S JP 1519750S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2014-10413F JP1519750S (enrdf_load_stackoverflow) | 2014-05-15 | 2014-05-15 | |
| US29/500,867 USD730304S1 (en) | 2014-05-15 | 2014-08-29 | Substrate for an electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2014-10413F JP1519750S (enrdf_load_stackoverflow) | 2014-05-15 | 2014-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1519750S true JP1519750S (enrdf_load_stackoverflow) | 2015-03-23 |
Family
ID=53176777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2014-10413F Active JP1519750S (enrdf_load_stackoverflow) | 2014-05-15 | 2014-05-15 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD730304S1 (enrdf_load_stackoverflow) |
| JP (1) | JP1519750S (enrdf_load_stackoverflow) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
| USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
| USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
| USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD754083S1 (en) | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
| USD770991S1 (en) * | 2013-11-05 | 2016-11-08 | Nok Corporation | Integrated circuit tag |
| USD764424S1 (en) * | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| USD776801S1 (en) * | 2014-06-24 | 2017-01-17 | Kobe Steel, Ltd | Heat exchanger tube |
| JP1528936S (enrdf_load_stackoverflow) * | 2015-01-14 | 2015-07-13 | ||
| JP1528485S (enrdf_load_stackoverflow) * | 2015-01-14 | 2015-07-13 | ||
| JP1528484S (enrdf_load_stackoverflow) * | 2015-01-14 | 2015-07-13 | ||
| USD780763S1 (en) * | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
| USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
| USD831009S1 (en) * | 2015-12-11 | 2018-10-16 | Gemalto M2M Gmbh | Radio module |
| USD942974S1 (en) | 2018-11-20 | 2022-02-08 | Thales Dis Ais Deutschland Gmbh | Cellular module |
| USD938925S1 (en) * | 2019-10-24 | 2021-12-21 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD934820S1 (en) | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4165584A (en) * | 1977-01-27 | 1979-08-28 | International Telephone And Telegraph Corporation | Apparatus for lapping or polishing materials |
| USD264963S (en) * | 1979-06-01 | 1982-06-15 | Perception Electronics, Inc. | Component mounting plate for a PC board indicator and control device |
| JP3983387B2 (ja) * | 1998-09-29 | 2007-09-26 | 日本碍子株式会社 | 静電チャック |
| US6500059B2 (en) * | 2000-12-01 | 2002-12-31 | Taiwan Semiconductor Manufacturing Company, Ltd | Apparatus and method for mounting a wafer in a polishing machine |
| USD459706S1 (en) | 2001-04-27 | 2002-07-02 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
| US7430104B2 (en) * | 2003-03-11 | 2008-09-30 | Appiled Materials, Inc. | Electrostatic chuck for wafer metrology and inspection equipment |
| TWD110148S1 (zh) * | 2004-10-14 | 2006-04-11 | 東芝照明技術股份有限公司 | 照明用發光體 |
| TWD110150S1 (zh) * | 2004-10-14 | 2006-04-11 | 東芝照明技術股份有限公司 | 照明用發光體 |
| US8177993B2 (en) * | 2006-11-05 | 2012-05-15 | Globalfoundries Singapore Pte Ltd | Apparatus and methods for cleaning and drying of wafers |
| USD670917S1 (en) * | 2011-02-18 | 2012-11-20 | Columbia Sportswear North America, Inc. | Heat reflective lining material |
| USD674759S1 (en) * | 2010-08-19 | 2013-01-22 | Epistar Corporation | Wafer carrier |
| USD637193S1 (en) | 2010-11-19 | 2011-05-03 | Apple Inc. | Electronic device |
| USD686175S1 (en) * | 2012-03-20 | 2013-07-16 | Veeco Instruments Inc. | Wafer carrier having pockets |
| USD686582S1 (en) * | 2012-03-20 | 2013-07-23 | Veeco Instruments Inc. | Wafer carrier having pockets |
| USD690671S1 (en) * | 2012-03-20 | 2013-10-01 | Veeco Instruments Inc. | Wafer carrier having pockets |
| USD702445S1 (en) * | 2012-05-11 | 2014-04-15 | Columbia Sportswear North America, Inc. | Printed cooling material |
| USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
-
2014
- 2014-05-15 JP JPD2014-10413F patent/JP1519750S/ja active Active
- 2014-08-29 US US29/500,867 patent/USD730304S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD730304S1 (en) | 2015-05-26 |