ITUB20160759A1 - Sensore di pressione incapsulato in materiale elastomerico, e sistema includente il sensore di pressione - Google Patents
Sensore di pressione incapsulato in materiale elastomerico, e sistema includente il sensore di pressioneInfo
- Publication number
- ITUB20160759A1 ITUB20160759A1 ITUB2016A000759A ITUB20160759A ITUB20160759A1 IT UB20160759 A1 ITUB20160759 A1 IT UB20160759A1 IT UB2016A000759 A ITUB2016A000759 A IT UB2016A000759A IT UB20160759 A ITUB20160759 A IT UB20160759A IT UB20160759 A1 ITUB20160759 A1 IT UB20160759A1
- Authority
- IT
- Italy
- Prior art keywords
- pressure sensor
- system including
- elastomeric material
- encapsulated
- encapsulated pressure
- Prior art date
Links
- 239000013536 elastomeric material Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L15/00—Devices or apparatus for measuring two or more fluid pressure values simultaneously
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
- G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUB2016A000759A ITUB20160759A1 (it) | 2016-02-15 | 2016-02-15 | Sensore di pressione incapsulato in materiale elastomerico, e sistema includente il sensore di pressione |
US15/337,701 US20170233245A1 (en) | 2016-02-15 | 2016-10-28 | Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor |
EP17156382.8A EP3205997B1 (en) | 2016-02-15 | 2017-02-15 | Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor |
CN201710081763.7A CN107084806B (zh) | 2016-02-15 | 2017-02-15 | 包封在弹性材料中的压力传感器与包括压力传感器的系统 |
CN201720136466.3U CN207081503U (zh) | 2016-02-15 | 2017-02-15 | 封装压力传感器、电子组件、电子系统和电子设备 |
US15/884,624 US10549982B2 (en) | 2016-02-15 | 2018-01-31 | Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor |
US16/730,480 US11254561B2 (en) | 2016-02-15 | 2019-12-30 | Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUB2016A000759A ITUB20160759A1 (it) | 2016-02-15 | 2016-02-15 | Sensore di pressione incapsulato in materiale elastomerico, e sistema includente il sensore di pressione |
Publications (1)
Publication Number | Publication Date |
---|---|
ITUB20160759A1 true ITUB20160759A1 (it) | 2017-08-15 |
Family
ID=55861058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITUB2016A000759A ITUB20160759A1 (it) | 2016-02-15 | 2016-02-15 | Sensore di pressione incapsulato in materiale elastomerico, e sistema includente il sensore di pressione |
Country Status (4)
Country | Link |
---|---|
US (1) | US20170233245A1 (it) |
EP (1) | EP3205997B1 (it) |
CN (2) | CN207081503U (it) |
IT (1) | ITUB20160759A1 (it) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114993548A (zh) * | 2022-05-30 | 2022-09-02 | 无锡胜脉电子有限公司 | 一种高压硅mems压力传感器及制备方法 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10353503B2 (en) * | 2015-10-29 | 2019-07-16 | Texas Instruments Incorporated | Integrated force sensing element |
ITUB20160759A1 (it) * | 2016-02-15 | 2017-08-15 | St Microelectronics Srl | Sensore di pressione incapsulato in materiale elastomerico, e sistema includente il sensore di pressione |
JP6654161B2 (ja) * | 2016-09-05 | 2020-02-26 | オムロンヘルスケア株式会社 | 力検出装置 |
CN116907693A (zh) | 2017-02-09 | 2023-10-20 | 触控解决方案股份有限公司 | 集成数字力传感器和相关制造方法 |
WO2018148510A1 (en) | 2017-02-09 | 2018-08-16 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
US11243126B2 (en) | 2017-07-27 | 2022-02-08 | Nextinput, Inc. | Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture |
US11579028B2 (en) | 2017-10-17 | 2023-02-14 | Nextinput, Inc. | Temperature coefficient of offset compensation for force sensor and strain gauge |
WO2019099821A1 (en) * | 2017-11-16 | 2019-05-23 | Nextinput, Inc. | Force attenuator for force sensor |
US10837852B2 (en) * | 2017-12-29 | 2020-11-17 | Honeywell International Inc | Pressure sensor media interface with integrated seal and diaphragm |
TWI668419B (zh) * | 2018-03-26 | 2019-08-11 | 創為精密材料股份有限公司 | 具有多氣室結構之壓力感應模組 |
CN108477750A (zh) * | 2018-05-31 | 2018-09-04 | 西南大学 | 一种电热鞋底 |
DE102018114077B4 (de) | 2018-06-13 | 2020-02-13 | Danfoss A/S | Drucksensoranordnung |
IT201800006827A1 (it) * | 2018-06-29 | 2019-12-29 | Metodo di test della chiusura ermetica di un incapsulamento | |
US11851319B2 (en) * | 2018-09-20 | 2023-12-26 | Stmicroelectronics S.R.L. | High-range semiconductor load sensor device |
DE102018222781A1 (de) * | 2018-12-21 | 2020-06-25 | Robert Bosch Gmbh | Drucksensoranordnung |
US11060929B2 (en) * | 2019-03-04 | 2021-07-13 | Silicon Microstructures, Inc. | Pressure sensor die attach |
US11118990B2 (en) | 2019-06-21 | 2021-09-14 | Honeywell International Inc. | Micro-molded fluid pressure sensor housing |
EP3770112A1 (en) * | 2019-07-22 | 2021-01-27 | Infineon Technologies AG | Pressure sensor |
IT201900017546A1 (it) * | 2019-09-30 | 2021-03-30 | St Microelectronics Srl | Dispositivo a pulsante mems resistente all'acqua, dispositivo di ingresso comprendente il dispositivo a pulsante mems e apparecchio elettronico |
IT201900019169A1 (it) * | 2019-10-17 | 2021-04-17 | St Microelectronics Srl | Interruttore impermeabile azionabile da un fluido quale aria e utilizzabile in particolare per l'attivazione di un apparecchio inalatore, quale una sigaretta elettronica |
DE102020108775B4 (de) | 2020-03-30 | 2022-08-18 | Infineon Technologies Ag | Sensorpackages und verfahren zur herstellung von sensorpackages |
DE102020205490A1 (de) * | 2020-04-30 | 2021-11-04 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer Drucksensoreinrichtung und Drucksensoreinrichtung |
US11945714B2 (en) | 2020-07-30 | 2024-04-02 | Stmicroelectronics S.R.L. | Electronic device and corresponding method |
CN112885789A (zh) * | 2021-01-07 | 2021-06-01 | 浙江荷清柔性电子技术有限公司 | 柔性气动压力测量装置及其制作方法 |
DE102021113914A1 (de) | 2021-05-28 | 2022-12-01 | Endress+Hauser SE+Co. KG | Messgerät zum Bestimmen und/oder Überwachen zumindest einer physikalischen und/oder chemischen Messgröße |
DE102022200186A1 (de) | 2022-01-11 | 2023-07-13 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Umverpackung eines Halbleiterbauelements sowie ein derartig hergestelltes Halbleiterbauelement |
US20230400373A1 (en) * | 2022-06-14 | 2023-12-14 | Honeywell International Inc. | Pre-formed solid as coupling mechanism in media-isolated pressure sensors |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4842685A (en) * | 1986-04-22 | 1989-06-27 | Motorola, Inc. | Method for forming a cast membrane protected pressure sensor |
DE102004035545A1 (de) * | 2004-07-22 | 2006-02-16 | Siemens Ag | Drucksensor und Verfahren zu dessen Herstellung |
US20060201255A1 (en) * | 2005-03-10 | 2006-09-14 | Walter Czarnocki | Media isolated absolute pressure sensor |
EP1707931A1 (en) * | 2005-03-31 | 2006-10-04 | STMicroelectronics S.r.l. | Analog data-input device provided with a microelectromechanical pressure sensor |
WO2007010570A1 (en) * | 2005-07-22 | 2007-01-25 | Stmicroelectronics S.R.L. | Integrated pressure sensor with double measuring scale and a high full-scale value |
US20150369680A1 (en) * | 2014-06-19 | 2015-12-24 | Fuji Electric Co., Ltd. | Double diaphragm type pressure sensor |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US7014888B2 (en) * | 2002-12-23 | 2006-03-21 | Freescale Semiconductor, Inc. | Method and structure for fabricating sensors with a sacrificial gel dome |
US20060185429A1 (en) * | 2005-02-21 | 2006-08-24 | Finemems Inc. | An Intelligent Integrated Sensor Of Tire Pressure Monitoring System (TPMS) |
US8359927B2 (en) * | 2009-08-12 | 2013-01-29 | Freescale Semiconductor, Inc. | Molded differential PRT pressure sensor |
DE102009051611A1 (de) * | 2009-11-02 | 2011-05-05 | Vega Grieshaber Kg | Messzelle |
US8178961B2 (en) * | 2010-04-27 | 2012-05-15 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and package process |
US8551799B2 (en) * | 2010-05-06 | 2013-10-08 | Stmicroelectronics S.R.L. | Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer |
CN104850289B (zh) * | 2014-02-17 | 2018-01-09 | 新益先创科技股份有限公司 | 无线控制系统、触控感应电极整合模块、触控感应模块及其制造方法 |
ITUB20160759A1 (it) * | 2016-02-15 | 2017-08-15 | St Microelectronics Srl | Sensore di pressione incapsulato in materiale elastomerico, e sistema includente il sensore di pressione |
-
2016
- 2016-02-15 IT ITUB2016A000759A patent/ITUB20160759A1/it unknown
- 2016-10-28 US US15/337,701 patent/US20170233245A1/en not_active Abandoned
-
2017
- 2017-02-15 CN CN201720136466.3U patent/CN207081503U/zh active Active
- 2017-02-15 EP EP17156382.8A patent/EP3205997B1/en active Active
- 2017-02-15 CN CN201710081763.7A patent/CN107084806B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4842685A (en) * | 1986-04-22 | 1989-06-27 | Motorola, Inc. | Method for forming a cast membrane protected pressure sensor |
DE102004035545A1 (de) * | 2004-07-22 | 2006-02-16 | Siemens Ag | Drucksensor und Verfahren zu dessen Herstellung |
US20060201255A1 (en) * | 2005-03-10 | 2006-09-14 | Walter Czarnocki | Media isolated absolute pressure sensor |
EP1707931A1 (en) * | 2005-03-31 | 2006-10-04 | STMicroelectronics S.r.l. | Analog data-input device provided with a microelectromechanical pressure sensor |
WO2007010570A1 (en) * | 2005-07-22 | 2007-01-25 | Stmicroelectronics S.R.L. | Integrated pressure sensor with double measuring scale and a high full-scale value |
US20150369680A1 (en) * | 2014-06-19 | 2015-12-24 | Fuji Electric Co., Ltd. | Double diaphragm type pressure sensor |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114993548A (zh) * | 2022-05-30 | 2022-09-02 | 无锡胜脉电子有限公司 | 一种高压硅mems压力传感器及制备方法 |
CN114993548B (zh) * | 2022-05-30 | 2023-09-01 | 无锡胜脉电子有限公司 | 一种高压硅mems压力传感器及制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3205997B1 (en) | 2019-06-19 |
US20170233245A1 (en) | 2017-08-17 |
EP3205997A1 (en) | 2017-08-16 |
CN207081503U (zh) | 2018-03-09 |
CN107084806A (zh) | 2017-08-22 |
CN107084806B (zh) | 2020-03-06 |
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