ITUA20162957A1 - Modulo di trasduzione multi-dispositivo, apparecchiatura includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione - Google Patents

Modulo di trasduzione multi-dispositivo, apparecchiatura includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione

Info

Publication number
ITUA20162957A1
ITUA20162957A1 ITUA2016A002957A ITUA20162957A ITUA20162957A1 IT UA20162957 A1 ITUA20162957 A1 IT UA20162957A1 IT UA2016A002957 A ITUA2016A002957 A IT UA2016A002957A IT UA20162957 A ITUA20162957 A IT UA20162957A IT UA20162957 A1 ITUA20162957 A1 IT UA20162957A1
Authority
IT
Italy
Prior art keywords
transduction module
module
manufacture
equipment including
transduction
Prior art date
Application number
ITUA2016A002957A
Other languages
English (en)
Inventor
Roberto Brioschi
Marco Omar Ghidoni
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITUA2016A002957A priority Critical patent/ITUA20162957A1/it
Priority to US15/377,627 priority patent/US10091587B2/en
Priority to CN201611182133.0A priority patent/CN107343249B/zh
Priority to CN201621402817.2U priority patent/CN206380092U/zh
Priority to EP17162651.8A priority patent/EP3240306B1/en
Publication of ITUA20162957A1 publication Critical patent/ITUA20162957A1/it
Priority to US16/137,439 priority patent/US10531204B2/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/04—Networks or arrays of similar microstructural devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/44—Special adaptations for subaqueous use, e.g. for hydrophone
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/005—Circuits for transducers, loudspeakers or microphones for combining the signals of two or more microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
ITUA2016A002957A 2016-04-28 2016-04-28 Modulo di trasduzione multi-dispositivo, apparecchiatura includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione ITUA20162957A1 (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ITUA2016A002957A ITUA20162957A1 (it) 2016-04-28 2016-04-28 Modulo di trasduzione multi-dispositivo, apparecchiatura includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione
US15/377,627 US10091587B2 (en) 2016-04-28 2016-12-13 Multi-device transducer module, apparatus including the transducer module and method of manufacturing the transducer module
CN201611182133.0A CN107343249B (zh) 2016-04-28 2016-12-20 多设备模块、包括该模块的装置和制造该模块的方法
CN201621402817.2U CN206380092U (zh) 2016-04-28 2016-12-20 多设备模块和包括该模块的装置
EP17162651.8A EP3240306B1 (en) 2016-04-28 2017-03-23 Multi-device transducer module, apparatus including the transducer module and method of manufacturing the transducer module
US16/137,439 US10531204B2 (en) 2016-04-28 2018-09-20 Multi-device transducer module, apparatus including the transducer module and method of manufacturing the transducer module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUA2016A002957A ITUA20162957A1 (it) 2016-04-28 2016-04-28 Modulo di trasduzione multi-dispositivo, apparecchiatura includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione

Publications (1)

Publication Number Publication Date
ITUA20162957A1 true ITUA20162957A1 (it) 2017-10-28

Family

ID=56555624

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUA2016A002957A ITUA20162957A1 (it) 2016-04-28 2016-04-28 Modulo di trasduzione multi-dispositivo, apparecchiatura includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione

Country Status (4)

Country Link
US (2) US10091587B2 (it)
EP (1) EP3240306B1 (it)
CN (2) CN206380092U (it)
IT (1) ITUA20162957A1 (it)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITUA20162957A1 (it) * 2016-04-28 2017-10-28 St Microelectronics Srl Modulo di trasduzione multi-dispositivo, apparecchiatura includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione
IT201600121210A1 (it) * 2016-11-30 2018-05-30 St Microelectronics Srl Modulo di trasduzione multi-dispositivo, apparecchiatura elettronica includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione
US11457299B2 (en) * 2018-06-19 2022-09-27 W. L. Gore & Associates, Inc. Protection of integrated low power system designed to monitor the acoustic environment
US11388530B2 (en) * 2018-07-19 2022-07-12 Cochlear Limited Sub-surface indicator lighting
CN110650418A (zh) * 2019-10-24 2020-01-03 朝阳聚声泰（信丰）科技有限公司 一种光敏智能mems麦克风
US11228846B2 (en) * 2020-02-14 2022-01-18 Apple Inc. Sensor assembly for electronic device
US20220009768A1 (en) * 2020-07-12 2022-01-13 xMEMS Labs, Inc. Sound producing package structure and manufacturing method thereof
TWI756976B (zh) * 2020-12-10 2022-03-01 美律實業股份有限公司 麥克風模組
US11758312B2 (en) * 2021-06-01 2023-09-12 Xmems Taiwan Co., Ltd. Sound producing package structure and manufacturing method thereof
US11760627B2 (en) 2021-06-10 2023-09-19 Invensense, Inc. MEMS stress reduction structure embedded into package
CN113301486B (zh) * 2021-06-17 2022-04-29 甬矽电子(宁波)股份有限公司 双硅麦封装结构和双硅麦封装结构的制备方法
CN215453270U (zh) * 2021-07-07 2022-01-07 瑞声声学科技(深圳)有限公司 麦克风
US11787551B1 (en) 2022-10-06 2023-10-17 Archer Aviation, Inc. Vertical takeoff and landing aircraft electric engine configuration

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2552127A1 (en) * 2010-06-01 2013-01-30 Funai Electric Co., Ltd. Microphone unit and audio input device provided with same
US20150023523A1 (en) * 2013-07-22 2015-01-22 Infineon Technologies Ag Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5742484A (en) * 1997-02-18 1998-04-21 Motorola, Inc. Flexible connector for circuit boards
US7429495B2 (en) * 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
US20070215962A1 (en) * 2006-03-20 2007-09-20 Knowles Elecronics, Llc Microelectromechanical system assembly and method for manufacturing thereof
CN201226592Y (zh) * 2008-06-23 2009-04-22 东莞泉声电子有限公司 软性线路板封装的硅麦克风
US8193596B2 (en) * 2008-09-03 2012-06-05 Solid State System Co., Ltd. Micro-electro-mechanical systems (MEMS) package
US8472648B2 (en) * 2009-01-20 2013-06-25 General Mems Corporation Miniature MEMS condenser microphone package and fabrication method thereof
US8199939B2 (en) * 2009-01-21 2012-06-12 Nokia Corporation Microphone package
EP2252077B1 (en) * 2009-05-11 2012-07-11 STMicroelectronics Srl Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof
DE112010002028T5 (de) * 2009-05-18 2012-08-02 Knowles Electronics, Llc Mikrofon mit verringerter Schwingungsempfindlichkeit
WO2011087770A2 (en) * 2009-12-22 2011-07-21 Mh Acoustics, Llc Surface-mounted microphone arrays on flexible printed circuit boards
US8577063B2 (en) * 2010-02-18 2013-11-05 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices
JP4947191B2 (ja) * 2010-06-01 2012-06-06 オムロン株式会社 マイクロフォン
KR20130057485A (ko) * 2010-09-18 2013-05-31 페어차일드 세미컨덕터 코포레이션 미세 전자 기계 시스템에 미치는 응력을 감소시키기 위한 패키징
US9276080B2 (en) * 2012-03-09 2016-03-01 Mcube, Inc. Methods and structures of integrated MEMS-CMOS devices
US8447057B2 (en) * 2011-03-18 2013-05-21 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices
US8804982B2 (en) 2011-04-02 2014-08-12 Harman International Industries, Inc. Dual cell MEMS assembly
JP6271887B2 (ja) * 2013-07-10 2018-01-31 キヤノン株式会社 静電容量型トランスデューサ、プローブ、及び被検体情報取得装置
US20160100256A1 (en) * 2013-10-30 2016-04-07 Knowles Electronics, Llc Acoustic Assembly and Method of Manufacturing The Same
DE102014100464B4 (de) 2014-01-16 2022-02-17 Tdk Corporation Multi-MEMS-Modul
US9497529B2 (en) * 2014-02-18 2016-11-15 Apple Inc. Microphone port with foreign material ingress protection
ITUA20162957A1 (it) * 2016-04-28 2017-10-28 St Microelectronics Srl Modulo di trasduzione multi-dispositivo, apparecchiatura includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2552127A1 (en) * 2010-06-01 2013-01-30 Funai Electric Co., Ltd. Microphone unit and audio input device provided with same
US20150023523A1 (en) * 2013-07-22 2015-01-22 Infineon Technologies Ag Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals

Also Published As

Publication number Publication date
EP3240306B1 (en) 2021-09-22
CN107343249B (zh) 2019-12-31
US20190028815A1 (en) 2019-01-24
US10091587B2 (en) 2018-10-02
CN206380092U (zh) 2017-08-04
US10531204B2 (en) 2020-01-07
US20170318396A1 (en) 2017-11-02
CN107343249A (zh) 2017-11-10
EP3240306A1 (en) 2017-11-01

Similar Documents

Publication Publication Date Title
ITUA20162957A1 (it) Modulo di trasduzione multi-dispositivo, apparecchiatura includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione
ITUA20162959A1 (it) Modulo di trasduzione multi-camera, apparecchiatura includente il modulo di trasduzione multi-camera e metodo di fabbricazione del modulo di trasduzione multi-camera
DK3224972T3 (da) Passive optiskbaserede datacenternetværk
JP1633292S (ja) イヤホン
DK3337185T3 (da) Knogleledningshøjtaler
DK3152956T4 (da) Systemer og metoder til kommunikation
ZA201901252B (en) Activity-triggered provisioning of portable wireless networks
FI20150334A (fi) Paranneltu puolijohdekokoonpano
DK3513569T3 (da) Øretelefon
DK3307515T3 (da) Forbedret barriereydeevne via blandinger af poly(ethylenfurandicarboxylat) og poly(ethylenterephthalat)
FI20165456A (fi) Kommunikaatiopalvelun hankinta
DK3179695T3 (da) Netværksautentifikation
DK3294893T3 (da) Bioproduktion af lentivirale vektorer
DK3421381T3 (da) Centreringsindretning
DK3225627T5 (da) Tripeptidforbindelse, fremgangsmåde til fremstilling deraf og anvendelse deraf
DK3229495T3 (da) Flere transmissionsnet
DK3360863T3 (da) Etomidatderivat og mellemprodukt, fremgangsmåde til fremstilling og anvendelse deraf
DE102018115474A8 (de) Halbleitervorrichtungen
DK3509791T3 (da) Vibrationspoleringsudstyr
ITUA20162560A1 (it) Modulo orientabile per apparecchiature video-fotografiche
DK3188747T3 (da) Behandling af forhøjet intrakranielt tryk
DK3668879T3 (da) Nye forbindelser
FI20165763A (fi) Taajuusselektiivinen rakenne
DE112016000596A5 (de) Elektrodynamischer Schallwandler
DK3227485T3 (da) Tekstilprodukt, fremgangsmåde til fremstilling af tekstilproduktet og anvendelse af tekstilproduktet