ITTO920613A0 - DIAMOND COATED SUPPORT. - Google Patents

DIAMOND COATED SUPPORT.

Info

Publication number
ITTO920613A0
ITTO920613A0 IT92TO613A ITTO920613A ITTO920613A0 IT TO920613 A0 ITTO920613 A0 IT TO920613A0 IT 92TO613 A IT92TO613 A IT 92TO613A IT TO920613 A ITTO920613 A IT TO920613A IT TO920613 A0 ITTO920613 A0 IT TO920613A0
Authority
IT
Italy
Prior art keywords
coated support
diamond coated
diamond
support
coated
Prior art date
Application number
IT92TO613A
Other languages
Italian (it)
Inventor
Kirk J Mikkelsen
John B Goodman
Original Assignee
Fluoroware Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fluoroware Inc filed Critical Fluoroware Inc
Publication of ITTO920613A0 publication Critical patent/ITTO920613A0/en
Publication of ITTO920613A1 publication Critical patent/ITTO920613A1/en
Application granted granted Critical
Publication of IT1257386B publication Critical patent/IT1257386B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H01L21/6733Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67366Closed carriers characterised by materials, roughness, coatings or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
ITTO920613A 1991-07-23 1992-07-17 SUPPORT COATED WITH DIAMOND. IT1257386B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73479491A 1991-07-23 1991-07-23

Publications (3)

Publication Number Publication Date
ITTO920613A0 true ITTO920613A0 (en) 1992-07-17
ITTO920613A1 ITTO920613A1 (en) 1994-01-17
IT1257386B IT1257386B (en) 1996-01-15

Family

ID=24953096

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO920613A IT1257386B (en) 1991-07-23 1992-07-17 SUPPORT COATED WITH DIAMOND.

Country Status (6)

Country Link
JP (1) JPH05198664A (en)
KR (1) KR930003300A (en)
DE (1) DE4223326A1 (en)
FR (1) FR2679524A1 (en)
GB (1) GB2257986A (en)
IT (1) IT1257386B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4300205A1 (en) * 1993-01-07 1994-07-14 Deutsche Bundespost Telekom Mounting for substrates in cassette form
US6039186A (en) * 1997-04-16 2000-03-21 Fluoroware, Inc. Composite transport carrier
JP3282584B2 (en) * 1998-06-02 2002-05-13 信越ポリマー株式会社 Storage container for precision parts
JP2002046793A (en) * 2000-04-26 2002-02-12 Asahi Glass Co Ltd Optical member storage case
DE10149037A1 (en) * 2001-10-05 2003-04-24 Infineon Technologies Ag Wafer rack for receiving and transporting wafers for semiconductor technology processing, comprises two opposing housing plates connected by lateral slats
DE10215283B4 (en) * 2002-04-05 2004-06-03 Astec Halbleitertechnologie Gmbh Device for receiving substrates
JP4616086B2 (en) * 2005-06-14 2011-01-19 東芝物流株式会社 Panel-shaped article storage tray
DE102010041230A1 (en) * 2010-09-23 2012-03-29 Evonik Degussa Gmbh Use of diamond like carbon layers in the application of metal ion-free semiconductor inks
CN111270218B (en) * 2020-01-23 2021-07-06 电子科技大学 Preparation method of chemical vapor deposition carbon-modified sheet FeSiAl alloy
EP3929969B1 (en) * 2020-06-22 2023-12-06 Siltronic AG Method for manufacturing a process container for semiconductor workpieces and process container
EP4068343A1 (en) * 2021-04-01 2022-10-05 Siltronic AG Device for transporting semiconductor wafers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2514743B1 (en) * 1981-10-21 1986-05-09 Rca Corp CARBON-BASED AMORPHOUS FILM OF THE DIAMOND TYPE AND MANUFACTURING METHOD THEREOF
US4872554A (en) * 1987-07-02 1989-10-10 Fluoroware, Inc. Reinforced carrier with embedded rigid insert
JPH01201095A (en) * 1988-02-04 1989-08-14 Idemitsu Petrochem Co Ltd Diamond carbon film and production thereof
JPH01259172A (en) * 1988-04-09 1989-10-16 Idemitsu Petrochem Co Ltd Member colliding with powder or granule
JPH02186656A (en) * 1989-01-13 1990-07-20 Hitachi Ltd Low dust device
JP2816864B2 (en) * 1989-07-07 1998-10-27 大塚化学株式会社 Transfer wafer basket and storage case

Also Published As

Publication number Publication date
ITTO920613A1 (en) 1994-01-17
IT1257386B (en) 1996-01-15
KR930003300A (en) 1993-02-24
DE4223326A1 (en) 1993-01-28
FR2679524A1 (en) 1993-01-29
JPH05198664A (en) 1993-08-06
GB9214697D0 (en) 1992-08-19
GB2257986A (en) 1993-01-27

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Legal Events

Date Code Title Description
0001 Granted