ITTO20010086A0 - Procedimento per sigillare e connettere parti di microsistemi elettromeccanici, fluidi, ottici e dispositivo cosi' ottenuto. - Google Patents
Procedimento per sigillare e connettere parti di microsistemi elettromeccanici, fluidi, ottici e dispositivo cosi' ottenuto.Info
- Publication number
- ITTO20010086A0 ITTO20010086A0 IT2001TO000086A ITTO20010086A ITTO20010086A0 IT TO20010086 A0 ITTO20010086 A0 IT TO20010086A0 IT 2001TO000086 A IT2001TO000086 A IT 2001TO000086A IT TO20010086 A ITTO20010086 A IT TO20010086A IT TO20010086 A0 ITTO20010086 A0 IT TO20010086A0
- Authority
- IT
- Italy
- Prior art keywords
- electromechanical
- fluids
- sealing
- procedure
- connecting parts
- Prior art date
Links
- 239000012530 fluid Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/093—Conductive package seal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/07—Structure, shape, material or disposition of the bonding areas after the connecting process
- H01L2224/08—Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area
- H01L2224/081—Disposition
- H01L2224/0812—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/08121—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the connected bonding areas being not aligned with respect to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
- H01L2224/10135—Alignment aids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/10165—Alignment aids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/80138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
- H01L2224/8014—Guiding structures outside the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
- H01L2224/81139—Guiding structures on the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
- H01L2224/8114—Guiding structures outside the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
- Fluid-Pressure Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT2001TO000086A ITTO20010086A1 (it) | 2001-01-30 | 2001-01-30 | Procedimento per sigillare e connettere parti di microsistemi elettromeccanici, fluidi, ottici e dispositivo cosi' ottenuto. |
US10/060,068 US7531897B2 (en) | 2001-01-30 | 2002-01-29 | Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby |
US12/417,461 US8050011B2 (en) | 2001-01-30 | 2009-04-02 | Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT2001TO000086A ITTO20010086A1 (it) | 2001-01-30 | 2001-01-30 | Procedimento per sigillare e connettere parti di microsistemi elettromeccanici, fluidi, ottici e dispositivo cosi' ottenuto. |
Publications (2)
Publication Number | Publication Date |
---|---|
ITTO20010086A0 true ITTO20010086A0 (it) | 2001-01-30 |
ITTO20010086A1 ITTO20010086A1 (it) | 2002-07-30 |
Family
ID=11458481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT2001TO000086A ITTO20010086A1 (it) | 2001-01-30 | 2001-01-30 | Procedimento per sigillare e connettere parti di microsistemi elettromeccanici, fluidi, ottici e dispositivo cosi' ottenuto. |
Country Status (2)
Country | Link |
---|---|
US (2) | US7531897B2 (it) |
IT (1) | ITTO20010086A1 (it) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1894155A (zh) * | 2003-12-19 | 2007-01-10 | 国际商业机器公司 | 用于自对准微机电系统中的部件的方法和系统 |
DE102005027276B3 (de) * | 2005-06-08 | 2007-01-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung einer Stapelanordnung |
EP1911078A1 (en) * | 2005-07-25 | 2008-04-16 | Koninklijke Philips Electronics N.V. | Interconnection and packaging method for biomedical devices with electronic and fluid functions |
KR20120091691A (ko) * | 2011-02-09 | 2012-08-20 | 삼성전자주식회사 | 휨 방지용 접합패턴을 갖는 반도체 소자 및 그 제조방법 |
WO2012171663A1 (en) * | 2011-06-15 | 2012-12-20 | Eth Zurich | Low-temperature wafer-level packaging and direct electrical interconnection |
US9570421B2 (en) | 2013-11-14 | 2017-02-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure |
DE102014210852B4 (de) * | 2014-06-06 | 2022-10-06 | Robert Bosch Gmbh | Bauteil mit zwei Halbleiter-Bauelementen, die über eine strukturierte Bond-Verbindungsschicht miteinander verbunden sind, und Verfahren zum Herstellen eines solchen Bauteils |
ITUA20164673A1 (it) | 2016-06-27 | 2017-12-27 | St Microelectronics Srl | Dispositivo mems formato da almeno due strati strutturali incollati reciprocamente e relativo processo di fabbricazione |
CN108100986B (zh) * | 2016-11-24 | 2020-01-31 | 上海新微技术研发中心有限公司 | 一种共晶键合方法和半导体器件 |
US10381330B2 (en) * | 2017-03-28 | 2019-08-13 | Silicon Storage Technology, Inc. | Sacrificial alignment ring and self-soldering vias for wafer bonding |
US10998480B2 (en) * | 2018-09-19 | 2021-05-04 | Facebook Technologies, Llc | Light-emitting structure alignment preservation in display fabrication |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4784970A (en) * | 1987-11-18 | 1988-11-15 | Grumman Aerospace Corporation | Process for making a double wafer moated signal processor |
US5343064A (en) * | 1988-03-18 | 1994-08-30 | Spangler Leland J | Fully integrated single-crystal silicon-on-insulator process, sensors and circuits |
US5236118A (en) * | 1992-05-12 | 1993-08-17 | The Regents Of The University Of California | Aligned wafer bonding |
JP3151956B2 (ja) * | 1992-09-04 | 2001-04-03 | 株式会社村田製作所 | 加速度センサ |
US6570221B1 (en) * | 1993-07-27 | 2003-05-27 | Hyundai Electronics America | Bonding of silicon wafers |
FR2718571B1 (fr) * | 1994-04-08 | 1996-05-15 | Thomson Csf | Composant hybride semiconducteur. |
US5633535A (en) * | 1995-01-27 | 1997-05-27 | Chao; Clinton C. | Spacing control in electronic device assemblies |
US6137164A (en) * | 1998-03-16 | 2000-10-24 | Texas Instruments Incorporated | Thin stacked integrated circuit device |
US6291875B1 (en) * | 1998-06-24 | 2001-09-18 | Analog Devices Imi, Inc. | Microfabricated structures with electrical isolation and interconnections |
AU5215099A (en) * | 1998-07-07 | 2000-01-24 | Goodyear Tire And Rubber Company, The | Method of fabricating silicon capacitive sensor |
US6238946B1 (en) * | 1999-08-17 | 2001-05-29 | International Business Machines Corporation | Process for fabricating single crystal resonant devices that are compatible with integrated circuit processing |
US6759332B2 (en) * | 2001-01-31 | 2004-07-06 | International Business Machines Corporation | Method for producing dual damascene interconnections and structure produced thereby |
JP4890689B2 (ja) * | 2001-07-24 | 2012-03-07 | オリンパス株式会社 | 三次元構造体の製造方法及び揺動体の製造方法 |
US6887769B2 (en) * | 2002-02-06 | 2005-05-03 | Intel Corporation | Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same |
-
2001
- 2001-01-30 IT IT2001TO000086A patent/ITTO20010086A1/it unknown
-
2002
- 2002-01-29 US US10/060,068 patent/US7531897B2/en not_active Expired - Lifetime
-
2009
- 2009-04-02 US US12/417,461 patent/US8050011B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ITTO20010086A1 (it) | 2002-07-30 |
US7531897B2 (en) | 2009-05-12 |
US20020119597A1 (en) | 2002-08-29 |
US20090186447A1 (en) | 2009-07-23 |
US8050011B2 (en) | 2011-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2002313020A1 (en) | Improved device for exchange and/or reaction between fluids | |
BR0207483B1 (pt) | "fluido viscoelÁstico aquoso". | |
NO20034241D0 (no) | Fremgangsmåte for forhindring av kritisk trykkökning | |
ITTO20010086A0 (it) | Procedimento per sigillare e connettere parti di microsistemi elettromeccanici, fluidi, ottici e dispositivo cosi' ottenuto. | |
ITRM20020476A0 (it) | Procedimento e sistema di configurazione di prodotti. | |
SG99961A1 (en) | Room temperature wafer-to-wafer bonding by polydimethylsiloxane | |
NO20034182L (no) | Kjemiske forbindelser | |
ITRE20030009A0 (it) | "dispositivo separatore di fluidi" | |
ITUD20000155A0 (it) | Dispositivo per la produzione di pannelli di mosaico, relativo procedimento e pannelli di mosaico cosi' ottenuti | |
FR2821398B1 (fr) | Disque d'embrayage | |
DE60231396D1 (de) | Mikropumpe | |
NO20010668D0 (no) | Kobling til overföring av fluider | |
ITRM20020517A1 (it) | Dispositivo magnetico per il trattamento di fluidi. | |
ITTO960171V0 (it) | Dispositivo attuatore elettromeccanico, particolarmente per l'azionamento di valvole fluidiche. | |
ITMI20022599A1 (it) | Valvola per l'intercettazione di fluidi, ad elevata | |
ITRM20010283A1 (it) | Dispositivo meccanico chirurgico. | |
DK1423187T3 (da) | Faststof/væske-reaktion | |
ITVR20010009A0 (it) | Procedimento di rivestimento di manufatti particolarmente per l'ottenimento di superfici riflettenti. | |
ITTO20010147A0 (it) | Dispositivo per l'applicazione di protesi fonatorie. | |
ITBO20000451A0 (it) | Dispositivo di contenimento e di applicazione di prodotti fluidi . | |
ITMO20010070A0 (it) | Contenitore per fluidi, relativo dispositivo e metodo di apertura e-ochiusura | |
UA4936S (uk) | Орденський знак «за розбудову україни» ім. михайла грушевського, (iv-го ступеня) | |
ITMI20010196U1 (it) | Apparato per l' effettuazione di idromassaggi. | |
ITPI20010055A0 (it) | Dispositivo per l'applicazione di protesi vascolari e protesi vascolare cosi' utilizzata | |
ITTO20010788A0 (it) | Procedimento per incrementare la stabilita' termica di siliciuri su silicio. |