ITMI922679A0 - Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare - Google Patents

Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare

Info

Publication number
ITMI922679A0
ITMI922679A0 IT92MI2679A ITMI922679A ITMI922679A0 IT MI922679 A0 ITMI922679 A0 IT MI922679A0 IT 92MI2679 A IT92MI2679 A IT 92MI2679A IT MI922679 A ITMI922679 A IT MI922679A IT MI922679 A0 ITMI922679 A0 IT MI922679A0
Authority
IT
Italy
Prior art keywords
opposed
treated
continuous supply
electrolytic cells
galvanic system
Prior art date
Application number
IT92MI2679A
Other languages
English (en)
Inventor
Sergio Sala
Original Assignee
Sergio Sala
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sergio Sala filed Critical Sergio Sala
Priority to ITMI922679A priority Critical patent/IT1256443B/it
Publication of ITMI922679A0 publication Critical patent/ITMI922679A0/it
Priority to ES93203246T priority patent/ES2089701T3/es
Priority to DE69302663T priority patent/DE69302663T2/de
Priority to EP93203246A priority patent/EP0599416B1/en
Priority to US08/156,096 priority patent/US5417828A/en
Publication of ITMI922679A1 publication Critical patent/ITMI922679A1/it
Application granted granted Critical
Publication of IT1256443B publication Critical patent/IT1256443B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
ITMI922679A 1992-11-23 1992-11-23 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare IT1256443B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ITMI922679A IT1256443B (it) 1992-11-23 1992-11-23 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare
ES93203246T ES2089701T3 (es) 1992-11-23 1993-11-19 Instalacion de electrodeposicion con celdas electroliticas opuestas y alimentacion continua de superficie a tratar.
DE69302663T DE69302663T2 (de) 1992-11-23 1993-11-19 Elektroplattierungsanlage mit gegenüberliegenden elektrolytischen Zellen und kontinuierlicher Beschickung mit den zu behandelnden Oberflächen
EP93203246A EP0599416B1 (en) 1992-11-23 1993-11-19 Electroplating plant with opposed electrolitic cells and continuous feed of the surfaces to be treated
US08/156,096 US5417828A (en) 1992-11-23 1993-11-22 Electroplating plant with opposed electrolitic cells and continuous feed of the workpieces to be plated

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI922679A IT1256443B (it) 1992-11-23 1992-11-23 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare

Publications (3)

Publication Number Publication Date
ITMI922679A0 true ITMI922679A0 (it) 1992-11-23
ITMI922679A1 ITMI922679A1 (it) 1994-05-23
IT1256443B IT1256443B (it) 1995-12-05

Family

ID=11364336

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI922679A IT1256443B (it) 1992-11-23 1992-11-23 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare

Country Status (5)

Country Link
US (1) US5417828A (it)
EP (1) EP0599416B1 (it)
DE (1) DE69302663T2 (it)
ES (1) ES2089701T3 (it)
IT (1) IT1256443B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5833816A (en) * 1994-05-11 1998-11-10 Siemens S.A. Apparatus for treating printed circuit boards
JP3043319B2 (ja) * 1998-09-25 2000-05-22 栄電子工業株式会社 連続メッキ装置
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
US6676820B2 (en) 2001-03-02 2004-01-13 Ppg Industries Ohio, Inc. Process for electrocoating metal blanks and coiled metal substrates
US7204918B2 (en) * 2003-03-10 2007-04-17 Modular Components National, Inc. High efficiency plating apparatus and method
CN114540933B (zh) * 2022-03-03 2023-04-25 常熟市新达模塑成型有限公司 一种无测量装置可连续控制电解液深度的电解池及其调节方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401522A (en) * 1980-09-29 1983-08-30 Micro-Plate, Inc. Plating method and apparatus
US4402800A (en) * 1981-10-02 1983-09-06 Ash James J Apparatus and method of treating tabs of printed circuit boards and the like
US4587000A (en) * 1984-11-19 1986-05-06 Pellegrino Peter P Electroplating method and apparatus for electroplating high aspect ratio thru-holes
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten
JPH0765209B2 (ja) * 1985-12-06 1995-07-12 ヤマハ発動機株式会社 電気めっき装置
US4761213A (en) * 1986-07-28 1988-08-02 Siemens Aktiengesellschaft Treatment facility particularly for printed circuit boards to be treated while in a horizontal plane
US4755271A (en) * 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4871435A (en) * 1988-10-14 1989-10-03 Charles Denofrio Electroplating apparatus

Also Published As

Publication number Publication date
IT1256443B (it) 1995-12-05
ITMI922679A1 (it) 1994-05-23
EP0599416A1 (en) 1994-06-01
EP0599416B1 (en) 1996-05-15
ES2089701T3 (es) 1996-10-01
DE69302663T2 (de) 1996-12-05
DE69302663D1 (de) 1996-06-20
US5417828A (en) 1995-05-23

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19951129