DE69302663D1 - Elektroplattierungsanlage mit gegenüberliegenden elektrolytischen Zellen und kontinuierlicher Beschickung mit den zu behandelnden Oberflächen - Google Patents

Elektroplattierungsanlage mit gegenüberliegenden elektrolytischen Zellen und kontinuierlicher Beschickung mit den zu behandelnden Oberflächen

Info

Publication number
DE69302663D1
DE69302663D1 DE69302663T DE69302663T DE69302663D1 DE 69302663 D1 DE69302663 D1 DE 69302663D1 DE 69302663 T DE69302663 T DE 69302663T DE 69302663 T DE69302663 T DE 69302663T DE 69302663 D1 DE69302663 D1 DE 69302663D1
Authority
DE
Germany
Prior art keywords
treated
electrolytic cells
electroplating system
continuous loading
opposite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69302663T
Other languages
English (en)
Other versions
DE69302663T2 (de
Inventor
Sergio Sala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of DE69302663D1 publication Critical patent/DE69302663D1/de
Publication of DE69302663T2 publication Critical patent/DE69302663T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08Electroplating with moving electrolyte e.g. jet electroplating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736Methods for applying liquids, e.g. spraying
    • H05K2203/0746Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1518Vertically held PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69302663T 1992-11-23 1993-11-19 Elektroplattierungsanlage mit gegenüberliegenden elektrolytischen Zellen und kontinuierlicher Beschickung mit den zu behandelnden Oberflächen Expired - Fee Related DE69302663T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI922679A IT1256443B (it) 1992-11-23 1992-11-23 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare

Publications (2)

Publication Number Publication Date
DE69302663D1 true DE69302663D1 (de) 1996-06-20
DE69302663T2 DE69302663T2 (de) 1996-12-05

Family

ID=11364336

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69302663T Expired - Fee Related DE69302663T2 (de) 1992-11-23 1993-11-19 Elektroplattierungsanlage mit gegenüberliegenden elektrolytischen Zellen und kontinuierlicher Beschickung mit den zu behandelnden Oberflächen

Country Status (5)

Country Link
US (1) US5417828A (de)
EP (1) EP0599416B1 (de)
DE (1) DE69302663T2 (de)
ES (1) ES2089701T3 (de)
IT (1) IT1256443B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5833816A (en) * 1994-05-11 1998-11-10 Siemens S.A. Apparatus for treating printed circuit boards
JP3043319B2 (ja) * 1998-09-25 2000-05-22 栄電子工業株式会社 連続メッキ装置
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
US6676820B2 (en) 2001-03-02 2004-01-13 Ppg Industries Ohio, Inc. Process for electrocoating metal blanks and coiled metal substrates
US7204918B2 (en) * 2003-03-10 2007-04-17 Modular Components National, Inc. High efficiency plating apparatus and method
CN114540933B (zh) * 2022-03-03 2023-04-25 常熟市新达模塑成型有限公司 一种无测量装置可连续控制电解液深度的电解池及其调节方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401522A (en) * 1980-09-29 1983-08-30 Micro-Plate, Inc. Plating method and apparatus
US4402800A (en) * 1981-10-02 1983-09-06 Ash James J Apparatus and method of treating tabs of printed circuit boards and the like
US4587000A (en) * 1984-11-19 1986-05-06 Pellegrino Peter P Electroplating method and apparatus for electroplating high aspect ratio thru-holes
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten
JPH0765209B2 (ja) * 1985-12-06 1995-07-12 ヤマハ発動機株式会社 電気めっき装置
US4761213A (en) * 1986-07-28 1988-08-02 Siemens Aktiengesellschaft Treatment facility particularly for printed circuit boards to be treated while in a horizontal plane
US4755271A (en) * 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4871435A (en) * 1988-10-14 1989-10-03 Charles Denofrio Electroplating apparatus

Also Published As

Publication number Publication date
ITMI922679A0 (it) 1992-11-23
IT1256443B (it) 1995-12-05
ITMI922679A1 (it) 1994-05-23
EP0599416A1 (de) 1994-06-01
EP0599416B1 (de) 1996-05-15
ES2089701T3 (es) 1996-10-01
DE69302663T2 (de) 1996-12-05
US5417828A (en) 1995-05-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee