ITMI20050690A1 - Procedimento ed un dispositivo per l'applicazione di masse a piu'componenti - Google Patents

Procedimento ed un dispositivo per l'applicazione di masse a piu'componenti

Info

Publication number
ITMI20050690A1
ITMI20050690A1 IT000690A ITMI20050690A ITMI20050690A1 IT MI20050690 A1 ITMI20050690 A1 IT MI20050690A1 IT 000690 A IT000690 A IT 000690A IT MI20050690 A ITMI20050690 A IT MI20050690A IT MI20050690 A1 ITMI20050690 A1 IT MI20050690A1
Authority
IT
Italy
Prior art keywords
procedure
components
masses
applying
applying masses
Prior art date
Application number
IT000690A
Other languages
English (en)
Inventor
Siegfried Holder
Gerhard Koelle
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20050690A1 publication Critical patent/ITMI20050690A1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
IT000690A 2004-04-21 2005-04-19 Procedimento ed un dispositivo per l'applicazione di masse a piu'componenti ITMI20050690A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004019161A DE102004019161A1 (de) 2004-04-21 2004-04-21 Verfahren und eine Vorrichtung zum Auftragen von mehrkomponentigen Auftragmassen

Publications (1)

Publication Number Publication Date
ITMI20050690A1 true ITMI20050690A1 (it) 2005-10-22

Family

ID=35140056

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000690A ITMI20050690A1 (it) 2004-04-21 2005-04-19 Procedimento ed un dispositivo per l'applicazione di masse a piu'componenti

Country Status (3)

Country Link
DE (1) DE102004019161A1 (it)
FR (1) FR2869453B1 (it)
IT (1) ITMI20050690A1 (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101972733B (zh) * 2010-08-18 2013-05-29 济南德佳玻璃机器有限公司 胶体比例输送装置
DE102021210708A1 (de) 2021-09-24 2022-11-24 Carl Zeiss Smt Gmbh Dosiervorrichtung und verfahren zum herstellen einer lithographieanlage
CN114887831B (zh) * 2022-05-12 2023-07-14 成都泰美克晶体技术有限公司 一种晶圆自动涂胶设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8202164A (nl) * 1982-05-27 1983-12-16 Philips Nv Werkwijze en inrichting voor het transproteren en afzetten van viskeuze stoffen.
US5681757A (en) * 1996-04-29 1997-10-28 Microfab Technologies, Inc. Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
EP0901155B1 (de) * 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
US6564979B2 (en) * 2001-07-18 2003-05-20 Micron Technology, Inc. Method and apparatus for dispensing adhesive on microelectronic substrate supports

Also Published As

Publication number Publication date
FR2869453A1 (fr) 2005-10-28
DE102004019161A1 (de) 2005-11-10
FR2869453B1 (fr) 2007-06-29

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