IT991477B - Procedimento per rimuovere selet tivamente una porzione di un substrato di poliimide - Google Patents

Procedimento per rimuovere selet tivamente una porzione di un substrato di poliimide

Info

Publication number
IT991477B
IT991477B IT26038/73A IT2603873A IT991477B IT 991477 B IT991477 B IT 991477B IT 26038/73 A IT26038/73 A IT 26038/73A IT 2603873 A IT2603873 A IT 2603873A IT 991477 B IT991477 B IT 991477B
Authority
IT
Italy
Prior art keywords
selectly
procedure
remove
polyimide substrate
polyimide
Prior art date
Application number
IT26038/73A
Other languages
English (en)
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Application granted granted Critical
Publication of IT991477B publication Critical patent/IT991477B/it

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B31/00—Compressor arrangements
    • F25B31/02—Compressor arrangements of motor-compressor units
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Structural Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
IT26038/73A 1972-09-05 1973-06-28 Procedimento per rimuovere selet tivamente una porzione di un substrato di poliimide IT991477B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00286344A US3833436A (en) 1972-09-05 1972-09-05 Etching of polyimide films

Publications (1)

Publication Number Publication Date
IT991477B true IT991477B (it) 1975-07-30

Family

ID=23098178

Family Applications (1)

Application Number Title Priority Date Filing Date
IT26038/73A IT991477B (it) 1972-09-05 1973-06-28 Procedimento per rimuovere selet tivamente una porzione di un substrato di poliimide

Country Status (9)

Country Link
US (1) US3833436A (it)
JP (1) JPS5635858B2 (it)
BE (1) BE804485A (it)
CA (1) CA997611A (it)
DE (1) DE2336511A1 (it)
FR (1) FR2198170B1 (it)
GB (1) GB1415083A (it)
IT (1) IT991477B (it)
NL (1) NL7311321A (it)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4093461A (en) * 1975-07-18 1978-06-06 Gaf Corporation Positive working thermally stable photoresist composition, article and method of using
US4426253A (en) 1981-12-03 1984-01-17 E. I. Du Pont De Nemours & Co. High speed etching of polyimide film
JPS58108229A (ja) 1981-12-21 1983-06-28 Hitachi Ltd ポリイミド系樹脂膜の選択エツチング方法
JPS604657A (ja) * 1983-06-22 1985-01-11 Aisin Seiki Co Ltd 自動変速機の変速制御装置
US4555302A (en) * 1984-08-24 1985-11-26 Urbanik John C Method and apparatus for ultrasonic etching of printing plates
JP2597396B2 (ja) * 1988-12-21 1997-04-02 ローム株式会社 シリコーンゴム膜のパターン形成方法
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US4911786A (en) * 1989-04-26 1990-03-27 International Business Machines Corporation Method of etching polyimides and resulting passivation structure
US5350487A (en) * 1993-05-03 1994-09-27 Ameen Thomas J Method of etching polyimide
US6680668B2 (en) * 2001-01-19 2004-01-20 Vishay Intertechnology, Inc. Fast heat rise resistor using resistive foil
US7000313B2 (en) * 2001-03-08 2006-02-21 Ppg Industries Ohio, Inc. Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
US6713587B2 (en) 2001-03-08 2004-03-30 Ppg Industries Ohio, Inc. Electrodepositable dielectric coating compositions and methods related thereto
US6951707B2 (en) * 2001-03-08 2005-10-04 Ppg Industries Ohio, Inc. Process for creating vias for circuit assemblies
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
US6824959B2 (en) * 2002-06-27 2004-11-30 Ppg Industries Ohio, Inc. Process for creating holes in polymeric substrates
EP1520454B1 (en) * 2002-06-27 2012-01-25 PPG Industries Ohio, Inc. Single or multi-layer printed circuit board with extended breakaway tabs and method of manufacture thereof
JP4950538B2 (ja) * 2006-04-03 2012-06-13 株式会社小森コーポレーション マグネットシリンダに装着されるプレート

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3395057A (en) * 1964-12-08 1968-07-30 G T Schjeladhl Company Method for etching polyiminde plastic film
US3554880A (en) * 1968-01-11 1971-01-12 Du Pont Process for electroplating polyoxymethylene resins
US3661660A (en) * 1968-02-21 1972-05-09 Grace W R & Co Method for ultrasonic etching of polymeric printing plates
US3594170A (en) * 1968-10-03 1971-07-20 Western Electric Co Additives to negative photoresists which increase the sensitivity thereof
US3645732A (en) * 1969-05-19 1972-02-29 Keuffel & Esser Co Etching alcohol-soluble nylon with aqueous solutions

Also Published As

Publication number Publication date
GB1415083A (en) 1975-11-26
CA997611A (en) 1976-09-28
JPS4967706A (it) 1974-07-01
JPS5635858B2 (it) 1981-08-20
BE804485A (nl) 1974-03-05
US3833436A (en) 1974-09-03
DE2336511A1 (de) 1974-03-14
NL7311321A (it) 1974-03-07
FR2198170A1 (it) 1974-03-29
FR2198170B1 (it) 1977-02-11

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