IT987625B - Dispositivi semiconduttori salda ti termoelettrostaticamente - Google Patents

Dispositivi semiconduttori salda ti termoelettrostaticamente

Info

Publication number
IT987625B
IT987625B IT2395673A IT2395673A IT987625B IT 987625 B IT987625 B IT 987625B IT 2395673 A IT2395673 A IT 2395673A IT 2395673 A IT2395673 A IT 2395673A IT 987625 B IT987625 B IT 987625B
Authority
IT
Italy
Prior art keywords
support member
semiconductor body
contacts
vitreous
metallized paths
Prior art date
Application number
IT2395673A
Other languages
English (en)
Italian (it)
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Application granted granted Critical
Publication of IT987625B publication Critical patent/IT987625B/it

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Joining Of Glass To Other Materials (AREA)
  • Measuring Magnetic Variables (AREA)
IT2395673A 1972-05-16 1973-05-11 Dispositivi semiconduttori salda ti termoelettrostaticamente IT987625B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25387972A 1972-05-16 1972-05-16

Publications (1)

Publication Number Publication Date
IT987625B true IT987625B (it) 1975-03-20

Family

ID=22962085

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2395673A IT987625B (it) 1972-05-16 1973-05-11 Dispositivi semiconduttori salda ti termoelettrostaticamente

Country Status (6)

Country Link
US (1) US3781978A (enExample)
JP (1) JPS4950871A (enExample)
DE (1) DE2324030A1 (enExample)
FR (1) FR2230076B3 (enExample)
GB (1) GB1377930A (enExample)
IT (1) IT987625B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953920A (en) * 1975-05-14 1976-05-04 International Telephone & Telegraph Corporation Method of making a transducer
US4142662A (en) * 1978-01-27 1979-03-06 Bell Telephone Laboratories, Incorporated Method of bonding microelectronic chips
JPS5787321A (en) 1980-11-21 1982-05-31 Nissan Motor Co Ltd Fusion-bonding method of skin material and foamed resin sheet
US4407440A (en) * 1981-02-23 1983-10-04 Mesa Technology Semiconductor die bonding machine
US5182424A (en) * 1989-10-31 1993-01-26 Vlastimil Frank Module encapsulation by induction heating
US5935462A (en) * 1994-10-24 1999-08-10 Matsushita Electric Industrial Co., Ltd. Repair of metal lines by electrostatically assisted laser ablative deposition
US5567336A (en) * 1994-10-24 1996-10-22 Matsushita Electric Industrial Co., Ltd. Laser ablation forward metal deposition with electrostatic assisted bonding
US5683601A (en) * 1994-10-24 1997-11-04 Panasonic Technologies, Inc. Laser ablation forward metal deposition with electrostatic assisted bonding
US6180912B1 (en) 1998-03-31 2001-01-30 Matsushita Electric Industrial Co., Ltd. Fan-out beams for repairing an open defect
US6060127A (en) * 1998-03-31 2000-05-09 Matsushita Electric Industrial Co., Ltd. Mechanically restricted laser deposition
US9776270B2 (en) * 2013-10-01 2017-10-03 Globalfoundries Inc. Chip joining by induction heating

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US27287A (en) * 1860-02-28 Pen hack
US3256598A (en) * 1963-07-25 1966-06-21 Martin Marietta Corp Diffusion bonding
GB1138401A (en) * 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
US3417459A (en) * 1965-05-06 1968-12-24 Mallory & Co Inc P R Bonding electrically conductive metals to insulators
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3506424A (en) * 1967-05-03 1970-04-14 Mallory & Co Inc P R Bonding an insulator to an insulator
US3589965A (en) * 1968-11-27 1971-06-29 Mallory & Co Inc P R Bonding an insulator to an insulator

Also Published As

Publication number Publication date
US3781978A (en) 1974-01-01
JPS4950871A (enExample) 1974-05-17
GB1377930A (en) 1974-12-18
FR2230076B3 (enExample) 1976-04-30
DE2324030A1 (de) 1973-11-29
FR2230076A1 (enExample) 1974-12-13

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