IT986562B - Dispositivo semiconduttore - Google Patents

Dispositivo semiconduttore

Info

Publication number
IT986562B
IT986562B IT68852/73A IT6885273A IT986562B IT 986562 B IT986562 B IT 986562B IT 68852/73 A IT68852/73 A IT 68852/73A IT 6885273 A IT6885273 A IT 6885273A IT 986562 B IT986562 B IT 986562B
Authority
IT
Italy
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
IT68852/73A
Other languages
English (en)
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT986562B publication Critical patent/IT986562B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
IT68852/73A 1972-06-23 1973-06-20 Dispositivo semiconduttore IT986562B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2951572 1972-06-23

Publications (1)

Publication Number Publication Date
IT986562B true IT986562B (it) 1975-01-30

Family

ID=10292759

Family Applications (1)

Application Number Title Priority Date Filing Date
IT68852/73A IT986562B (it) 1972-06-23 1973-06-20 Dispositivo semiconduttore

Country Status (5)

Country Link
JP (1) JPS4964373A (enFirst)
DE (1) DE2328798A1 (enFirst)
FR (1) FR2189868A1 (enFirst)
IT (1) IT986562B (enFirst)
NL (1) NL7308408A (enFirst)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748858B2 (enFirst) * 1974-09-06 1982-10-19
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS55107251A (en) * 1979-02-09 1980-08-16 Hitachi Ltd Electronic part and its packaging construction
JPS55107250A (en) * 1979-02-09 1980-08-16 Hitachi Ltd Electronic part, electronic part module and lead frame used for them
FR2488445A1 (fr) * 1980-08-06 1982-02-12 Efcis Boitier plastique pour circuits integres
US4331831A (en) * 1980-11-28 1982-05-25 Bell Telephone Laboratories, Incorporated Package for semiconductor integrated circuits
JPS56107566A (en) * 1980-12-03 1981-08-26 Hitachi Ltd Resin sealing method for semiconductor device
JPS57103341A (en) * 1981-11-02 1982-06-26 Hitachi Ltd Resin sealed semiconductor device
JPS62261165A (ja) * 1986-05-08 1987-11-13 Seikosha Co Ltd 時計などの駆動回路ユニツト
US5394607A (en) * 1993-05-20 1995-03-07 Texas Instruments Incorporated Method of providing low cost heat sink

Also Published As

Publication number Publication date
FR2189868A1 (enFirst) 1974-01-25
NL7308408A (enFirst) 1973-12-27
DE2328798A1 (de) 1974-01-17
JPS4964373A (enFirst) 1974-06-21

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