IT974360B - Apparecchio di polverizzazione per rivestire oggetti - Google Patents
Apparecchio di polverizzazione per rivestire oggettiInfo
- Publication number
- IT974360B IT974360B IT55084/72A IT5508472A IT974360B IT 974360 B IT974360 B IT 974360B IT 55084/72 A IT55084/72 A IT 55084/72A IT 5508472 A IT5508472 A IT 5508472A IT 974360 B IT974360 B IT 974360B
- Authority
- IT
- Italy
- Prior art keywords
- polverization
- coating objects
- objects
- coating
- polverization apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB6050171 | 1971-12-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT974360B true IT974360B (it) | 1974-06-20 |
Family
ID=10485691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT55084/72A IT974360B (it) | 1971-12-29 | 1972-12-28 | Apparecchio di polverizzazione per rivestire oggetti |
Country Status (5)
Country | Link |
---|---|
US (1) | US3838028A (it) |
JP (1) | JPS4873380A (it) |
DE (1) | DE2263737A1 (it) |
FR (1) | FR2170570A5 (it) |
IT (1) | IT974360B (it) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4109157A (en) * | 1975-12-18 | 1978-08-22 | Kawasaki Jukogyo Kabushiki Kaisha | Apparatus for ion-nitriding |
US4298444A (en) * | 1978-10-11 | 1981-11-03 | Heat Mirror Associates | Method for multilayer thin film deposition |
US4204942A (en) * | 1978-10-11 | 1980-05-27 | Heat Mirror Associates | Apparatus for multilayer thin film deposition |
US5024747A (en) * | 1979-12-21 | 1991-06-18 | Varian Associates, Inc. | Wafer coating system |
US4756815A (en) * | 1979-12-21 | 1988-07-12 | Varian Associates, Inc. | Wafer coating system |
US4333814A (en) * | 1979-12-26 | 1982-06-08 | Western Electric Company, Inc. | Methods and apparatus for improving an RF excited reactive gas plasma |
DE4302851A1 (de) * | 1993-02-02 | 1994-08-04 | Leybold Ag | Vorrichtung zum Anbringen und/oder Entfernen einer Maske an einem Substrat |
JP3973112B2 (ja) * | 1995-06-07 | 2007-09-12 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | ウェーハの向き整合システム |
US5985115A (en) * | 1997-04-11 | 1999-11-16 | Novellus Systems, Inc. | Internally cooled target assembly for magnetron sputtering |
CN104404463B (zh) * | 2014-11-14 | 2017-02-22 | 河海大学 | 一种平面磁控溅射靶 |
-
1972
- 1972-12-27 FR FR7246309A patent/FR2170570A5/fr not_active Expired
- 1972-12-28 JP JP47130359A patent/JPS4873380A/ja active Pending
- 1972-12-28 IT IT55084/72A patent/IT974360B/it active
- 1972-12-28 DE DE2263737A patent/DE2263737A1/de active Pending
- 1972-12-29 US US00319390A patent/US3838028A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS4873380A (it) | 1973-10-03 |
FR2170570A5 (it) | 1973-09-14 |
DE2263737A1 (de) | 1973-07-12 |
US3838028A (en) | 1974-09-24 |
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