IT973915B - Procedimento per depositare strati di rame su corpi di materia plasti ca - Google Patents

Procedimento per depositare strati di rame su corpi di materia plasti ca

Info

Publication number
IT973915B
IT973915B IT5450572A IT5450572A IT973915B IT 973915 B IT973915 B IT 973915B IT 5450572 A IT5450572 A IT 5450572A IT 5450572 A IT5450572 A IT 5450572A IT 973915 B IT973915 B IT 973915B
Authority
IT
Italy
Prior art keywords
plasti
bodies
copper
procedure
deposit layers
Prior art date
Application number
IT5450572A
Other languages
English (en)
Italian (it)
Original Assignee
Kalle Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kalle Ag filed Critical Kalle Ag
Application granted granted Critical
Publication of IT973915B publication Critical patent/IT973915B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT5450572A 1971-12-08 1972-12-06 Procedimento per depositare strati di rame su corpi di materia plasti ca IT973915B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2160821A DE2160821C3 (de) 1971-12-08 1971-12-08 Verfahren zur Abscheidung von Kupferschichten auf Formkörpern aus Polyimiden

Publications (1)

Publication Number Publication Date
IT973915B true IT973915B (it) 1974-06-10

Family

ID=5827354

Family Applications (1)

Application Number Title Priority Date Filing Date
IT5450572A IT973915B (it) 1971-12-08 1972-12-06 Procedimento per depositare strati di rame su corpi di materia plasti ca

Country Status (10)

Country Link
US (1) US3881049A (de)
JP (1) JPS4866168A (de)
AT (1) AT322320B (de)
BE (1) BE792310A (de)
CA (1) CA990593A (de)
DE (1) DE2160821C3 (de)
FR (1) FR2162526B1 (de)
GB (1) GB1403219A (de)
IT (1) IT973915B (de)
NL (1) NL7216124A (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL176479C (nl) * 1971-12-08 1985-04-16 Hoechst Ag Werkwijze voor het bekleden van kunststofvoorwerpen met koper.
GB2040969B (en) * 1978-12-19 1983-04-13 Crown City Plating Co Conditioning of polyamides for electroless plating
DE3328765A1 (de) * 1983-08-05 1985-02-14 Schering AG, 1000 Berlin und 4709 Bergkamen Loesung zur vorbehandlung von polyimid
US4720401A (en) * 1985-01-11 1988-01-19 International Business Machines Corporation Enhanced adhesion between metals and polymers
DE3743780A1 (de) * 1987-12-23 1989-07-06 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
EP0341504A3 (de) * 1988-05-09 1991-01-16 General Electric Company Plastik-Chipträgerpackung und Verfahren zum Herstellen derselben
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
US5178956A (en) * 1989-10-03 1993-01-12 Shipley Company Inc. Pretreatment process for electroless plating of polyimides
ATE156867T1 (de) * 1990-05-04 1997-08-15 Battelle Memorial Institute Bildung eines dünnen keramischen oxidfilms durch niederschlagung auf modifizierten polymeroberflächen
US5187241A (en) * 1990-05-15 1993-02-16 International Business Machines Corporation Isoimide modifications of a polyimide and reaction thereof with nucleophiles
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
US5151304A (en) * 1991-01-22 1992-09-29 International Business Machines Corporation Structure and method for enhancing adhesion to a polyimide surface
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
US5290597A (en) * 1992-04-27 1994-03-01 General Electric Company Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon
JP4086946B2 (ja) * 1998-01-05 2008-05-14 日東電工株式会社 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法
JP4917841B2 (ja) * 2006-06-09 2012-04-18 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 樹脂表面への無電解めっき方法
US7981508B1 (en) 2006-09-12 2011-07-19 Sri International Flexible circuits
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
TWI595024B (zh) * 2016-06-23 2017-08-11 臻鼎科技股份有限公司 聚醯胺酸、覆銅板及電路板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3544432A (en) * 1968-03-19 1970-12-01 Chisso Corp Electroplating plastic articles
US3684572A (en) * 1970-07-13 1972-08-15 Du Pont Electroless nickel plating process for nonconductors
US3704156A (en) * 1970-07-13 1972-11-28 Du Pont Catalyst solution for electroless plating on nonconductors
DE2101049A1 (de) * 1971-01-11 1972-08-03 Siemens Ag Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall
US3736170A (en) * 1971-06-28 1973-05-29 Ibm Process for improved adhesion of electroless copper to a polyimide surface
US3791848A (en) * 1972-05-19 1974-02-12 Western Electric Co A method of improving the adherence of a metal deposit to a polyimide surface

Also Published As

Publication number Publication date
DE2160821C3 (de) 1979-02-08
FR2162526B1 (de) 1976-08-20
GB1403219A (en) 1975-08-28
FR2162526A1 (de) 1973-07-20
AT322320B (de) 1975-05-12
BE792310A (fr) 1973-06-05
NL7216124A (de) 1973-06-13
DE2160821A1 (de) 1973-06-20
CA990593A (en) 1976-06-08
US3881049A (en) 1975-04-29
JPS4866168A (de) 1973-09-11
DE2160821B2 (de) 1978-06-08

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