IT972620B - Componente a semiconduttori con contatto a pressione - Google Patents

Componente a semiconduttori con contatto a pressione

Info

Publication number
IT972620B
IT972620B IT3323472A IT3323472A IT972620B IT 972620 B IT972620 B IT 972620B IT 3323472 A IT3323472 A IT 3323472A IT 3323472 A IT3323472 A IT 3323472A IT 972620 B IT972620 B IT 972620B
Authority
IT
Italy
Prior art keywords
pressure contact
semiconductor component
semiconductor
component
contact
Prior art date
Application number
IT3323472A
Other languages
English (en)
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT972620B publication Critical patent/IT972620B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
IT3323472A 1972-01-31 1972-12-20 Componente a semiconduttori con contatto a pressione IT972620B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722204490 DE2204490A1 (de) 1972-01-31 1972-01-31 Halbleiterbauelement mit druckkontakt

Publications (1)

Publication Number Publication Date
IT972620B true IT972620B (it) 1974-05-31

Family

ID=5834583

Family Applications (1)

Application Number Title Priority Date Filing Date
IT3323472A IT972620B (it) 1972-01-31 1972-12-20 Componente a semiconduttori con contatto a pressione

Country Status (7)

Country Link
JP (1) JPS4885079A (de)
CH (1) CH541869A (de)
DE (1) DE2204490A1 (de)
FR (1) FR2169819B1 (de)
GB (1) GB1397430A (de)
IT (1) IT972620B (de)
NL (1) NL7217019A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727319A1 (de) * 1977-06-16 1979-01-04 Nippon Electric Co Halbleiteranordnung mit einer hoeckerfoermigen anschlusselektrode
JPS55121654A (en) * 1979-03-13 1980-09-18 Toshiba Corp Compression bonded semiconductor device
JPS5871633A (ja) * 1981-10-23 1983-04-28 Toshiba Corp 圧接型半導体装置
DE10330053A1 (de) * 2003-07-03 2005-02-10 Infineon Technologies Ag Halbleiterbauelement mit einem Druckkontakt und Ronde für einen Druckkontakt eines Halbleiterbauelements
DE102004059389B4 (de) * 2004-12-09 2012-02-23 Infineon Technologies Ag Halbleiterbauelement mit Ausgleichsmetallisierung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS413220Y1 (de) * 1965-01-02 1966-02-23

Also Published As

Publication number Publication date
CH541869A (de) 1973-09-15
NL7217019A (de) 1973-08-02
GB1397430A (en) 1975-06-11
DE2204490A1 (de) 1973-08-09
FR2169819A1 (de) 1973-09-14
FR2169819B1 (de) 1977-12-30
JPS4885079A (de) 1973-11-12

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