IT970459B - Disposizione atta ad unire per ade sione componenti circuitali di dis sipazione del calore a scaricatori termici e metodo per la produzione della stessa - Google Patents

Disposizione atta ad unire per ade sione componenti circuitali di dis sipazione del calore a scaricatori termici e metodo per la produzione della stessa

Info

Publication number
IT970459B
IT970459B IT3161272A IT3161272A IT970459B IT 970459 B IT970459 B IT 970459B IT 3161272 A IT3161272 A IT 3161272A IT 3161272 A IT3161272 A IT 3161272A IT 970459 B IT970459 B IT 970459B
Authority
IT
Italy
Prior art keywords
dischargers
ade
sion
combining
thermal
Prior art date
Application number
IT3161272A
Other languages
English (en)
Italian (it)
Original Assignee
Itt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AT987371A external-priority patent/AT335517B/de
Application filed by Itt filed Critical Itt
Application granted granted Critical
Publication of IT970459B publication Critical patent/IT970459B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT3161272A 1971-11-16 1972-11-14 Disposizione atta ad unire per ade sione componenti circuitali di dis sipazione del calore a scaricatori termici e metodo per la produzione della stessa IT970459B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT987471 1971-11-16
AT987371A AT335517B (de) 1971-11-16 1971-11-16 Verfahren zur herstellung einer losbaren verbindung zwischen verlustwarme abgebenden schaltelementen und einem kuhlelement durch kleben

Publications (1)

Publication Number Publication Date
IT970459B true IT970459B (it) 1974-04-10

Family

ID=25605804

Family Applications (1)

Application Number Title Priority Date Filing Date
IT3161272A IT970459B (it) 1971-11-16 1972-11-14 Disposizione atta ad unire per ade sione componenti circuitali di dis sipazione del calore a scaricatori termici e metodo per la produzione della stessa

Country Status (5)

Country Link
BE (1) BE791418A (zh)
CH (1) CH547550A (zh)
DE (1) DE2255151C3 (zh)
GB (1) GB1338729A (zh)
IT (1) IT970459B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2638909A1 (de) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau Halbleiteranordnung

Also Published As

Publication number Publication date
CH547550A (de) 1974-03-29
DE2255151C3 (de) 1975-04-17
GB1338729A (en) 1973-11-28
BE791418A (zh) 1973-05-16
DE2255151B2 (de) 1974-08-15
DE2255151A1 (de) 1973-06-20

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