IT970459B - ARRANGEMENT SUITABLE FOR COMBINING CIRCUITAL COMPONENTS FOR HEAT DISSIPATION TO THERMAL DISCHARGERS BY ADE SION AND METHOD FOR THE PRODUCTION OF THE SAME - Google Patents

ARRANGEMENT SUITABLE FOR COMBINING CIRCUITAL COMPONENTS FOR HEAT DISSIPATION TO THERMAL DISCHARGERS BY ADE SION AND METHOD FOR THE PRODUCTION OF THE SAME

Info

Publication number
IT970459B
IT970459B IT3161272A IT3161272A IT970459B IT 970459 B IT970459 B IT 970459B IT 3161272 A IT3161272 A IT 3161272A IT 3161272 A IT3161272 A IT 3161272A IT 970459 B IT970459 B IT 970459B
Authority
IT
Italy
Prior art keywords
dischargers
ade
sion
combining
thermal
Prior art date
Application number
IT3161272A
Other languages
Italian (it)
Original Assignee
Itt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AT987371A external-priority patent/AT335517B/en
Application filed by Itt filed Critical Itt
Application granted granted Critical
Publication of IT970459B publication Critical patent/IT970459B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT3161272A 1971-11-16 1972-11-14 ARRANGEMENT SUITABLE FOR COMBINING CIRCUITAL COMPONENTS FOR HEAT DISSIPATION TO THERMAL DISCHARGERS BY ADE SION AND METHOD FOR THE PRODUCTION OF THE SAME IT970459B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT987371A AT335517B (en) 1971-11-16 1971-11-16 METHOD FOR CREATING A DETACHABLE CONNECTION BETWEEN SWITCHING ELEMENTS EMITING HEAT AND A COOLING ELEMENT BY ADHESIVE
AT987471 1971-11-16

Publications (1)

Publication Number Publication Date
IT970459B true IT970459B (en) 1974-04-10

Family

ID=25605804

Family Applications (1)

Application Number Title Priority Date Filing Date
IT3161272A IT970459B (en) 1971-11-16 1972-11-14 ARRANGEMENT SUITABLE FOR COMBINING CIRCUITAL COMPONENTS FOR HEAT DISSIPATION TO THERMAL DISCHARGERS BY ADE SION AND METHOD FOR THE PRODUCTION OF THE SAME

Country Status (5)

Country Link
BE (1) BE791418A (en)
CH (1) CH547550A (en)
DE (1) DE2255151C3 (en)
GB (1) GB1338729A (en)
IT (1) IT970459B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2638909A1 (en) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau SEMI-CONDUCTOR ARRANGEMENT

Also Published As

Publication number Publication date
DE2255151B2 (en) 1974-08-15
DE2255151C3 (en) 1975-04-17
BE791418A (en) 1973-05-16
DE2255151A1 (en) 1973-06-20
CH547550A (en) 1974-03-29
GB1338729A (en) 1973-11-28

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