IT958329B - Apparecchio e metodo di galvano stegia a tampone - Google Patents
Apparecchio e metodo di galvano stegia a tamponeInfo
- Publication number
- IT958329B IT958329B IT50834/72A IT5083472A IT958329B IT 958329 B IT958329 B IT 958329B IT 50834/72 A IT50834/72 A IT 50834/72A IT 5083472 A IT5083472 A IT 5083472A IT 958329 B IT958329 B IT 958329B
- Authority
- IT
- Italy
- Prior art keywords
- tampone
- stegia
- galvano
- galvano stegia
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15280271A | 1971-06-14 | 1971-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT958329B true IT958329B (it) | 1973-10-20 |
Family
ID=22544515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT50834/72A IT958329B (it) | 1971-06-14 | 1972-06-12 | Apparecchio e metodo di galvano stegia a tampone |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3751343A (it) |
| BR (1) | BR7203794D0 (it) |
| DE (1) | DE2228811A1 (it) |
| FR (1) | FR2141928A1 (it) |
| IT (1) | IT958329B (it) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4202739A (en) * | 1977-04-25 | 1980-05-13 | The United States of America as represented by the United Stated Department of Energy | Electrochemical removal of material from metallic work |
| US4098664A (en) * | 1977-07-25 | 1978-07-04 | Butler Richard E | Rotating vertical plating table |
| BE867736A (nl) * | 1978-06-02 | 1978-12-04 | Vera Paul J J | Elektrolysefolie |
| US4220504A (en) * | 1979-04-16 | 1980-09-02 | Burton Silverplating Company | Selective electroplating |
| US4452684A (en) * | 1983-03-11 | 1984-06-05 | The Carolinch Company | Apparatus for selective electrolytic plating |
| DE3343396A1 (de) * | 1983-11-30 | 1985-06-05 | Kraftwerk Union AG, 4330 Mülheim | Verfahren zum dekontaminieren metallischer komponenten einer kerntechnischen anlage |
| FI834686A0 (fi) * | 1983-12-20 | 1983-12-20 | Niinivaara Ensi Kyoesti Juhani | Foerfarande foer undervattensrening och -belaeggning |
| DE3507927A1 (de) * | 1985-03-06 | 1986-09-11 | Dr.Ing.H.C. F. Porsche Ag, 7000 Stuttgart | Verfahren und handgeraet zum halbmechanischen verzinken von blechoberflaechen |
| JPS62211396A (ja) * | 1985-11-11 | 1987-09-17 | Electroplating Eng Of Japan Co | コネクタ−端子の微小部分のメツキ装置 |
| FR2592895B1 (fr) * | 1986-01-16 | 1990-11-16 | Selectrons France | Installation pour la realisation de traitements electrolytiques localises de surfaces. |
| GB8617675D0 (en) * | 1986-07-19 | 1986-08-28 | Ae Plc | Deposition of bearing alloys |
| US4738756A (en) * | 1987-07-28 | 1988-04-19 | The Boeing Company | Method of brush chrome plating using tank chrome plating solutions |
| US4786389A (en) * | 1987-09-25 | 1988-11-22 | Amp Incorporated | Electroplating apparatus |
| EP0424590A1 (fr) * | 1989-10-23 | 1991-05-02 | Elga Sa | Appareil galvanoplastie |
| US5277785A (en) * | 1992-07-16 | 1994-01-11 | Anglen Erik S Van | Method and apparatus for depositing hard chrome coatings by brush plating |
| US5453174A (en) * | 1992-07-16 | 1995-09-26 | Electroplating Technologies Ltd. | Method and apparatus for depositing hard chrome coatings by brush plating |
| US5324406A (en) * | 1992-09-10 | 1994-06-28 | Tosoh Smd, Inc. | Automatic brush plating machine |
| US5776330A (en) * | 1996-05-08 | 1998-07-07 | Corpex Technologies, Inc. | Electrolytic decontamination methods and apparatus |
| US5772012A (en) * | 1996-05-08 | 1998-06-30 | Corpex Technologies, Inc. | Flexible decontamination apparatus |
| DE19844832A1 (de) * | 1998-09-30 | 2000-04-13 | Kai Greising | Verfahren und Vorrichtung zum Reinigen von Metalloberflächen |
| US7449098B1 (en) | 1999-10-05 | 2008-11-11 | Novellus Systems, Inc. | Method for planar electroplating |
| US7531079B1 (en) | 1998-10-26 | 2009-05-12 | Novellus Systems, Inc. | Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation |
| US6372118B1 (en) | 1999-04-12 | 2002-04-16 | Wen Hua Hui | Ni-Fe-Co electroplating bath |
| US20030234181A1 (en) * | 2002-06-25 | 2003-12-25 | Gino Palumbo | Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
| AU2003212164A1 (en) * | 2002-06-25 | 2004-01-06 | Integran Technologies Inc. | Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
| US7799200B1 (en) | 2002-07-29 | 2010-09-21 | Novellus Systems, Inc. | Selective electrochemical accelerator removal |
| US20050230267A1 (en) * | 2003-07-10 | 2005-10-20 | Veatch Bradley D | Electro-decontamination of contaminated surfaces |
| US8158532B2 (en) | 2003-10-20 | 2012-04-17 | Novellus Systems, Inc. | Topography reduction and control by selective accelerator removal |
| US8530359B2 (en) | 2003-10-20 | 2013-09-10 | Novellus Systems, Inc. | Modulated metal removal using localized wet etching |
| US7563348B2 (en) * | 2004-06-28 | 2009-07-21 | Lam Research Corporation | Electroplating head and method for operating the same |
| US8168540B1 (en) | 2009-12-29 | 2012-05-01 | Novellus Systems, Inc. | Methods and apparatus for depositing copper on tungsten |
| TWM522954U (zh) * | 2015-12-03 | 2016-06-01 | 財團法人工業技術研究院 | 電沉積設備 |
| CN107083561B (zh) * | 2017-05-06 | 2019-01-01 | 滁州普立惠技术服务有限公司 | 一种电刷镀装置 |
| US11352710B2 (en) * | 2019-09-30 | 2022-06-07 | Abdurrahman Ildeniz | Leak free brush electroplating system |
| CN113430605B (zh) * | 2021-06-11 | 2023-03-14 | 重庆金美新材料科技有限公司 | 一种用于柔性薄膜基材表面电镀加工的水电镀设备及方法 |
-
1971
- 1971-06-14 US US00152802A patent/US3751343A/en not_active Expired - Lifetime
-
1972
- 1972-06-12 IT IT50834/72A patent/IT958329B/it active
- 1972-06-13 DE DE19722228811 patent/DE2228811A1/de active Pending
- 1972-06-13 BR BR003794/72A patent/BR7203794D0/pt unknown
- 1972-06-14 FR FR7221446A patent/FR2141928A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE2228811A1 (de) | 1972-12-21 |
| FR2141928A1 (it) | 1973-01-26 |
| BR7203794D0 (pt) | 1973-05-10 |
| US3751343A (en) | 1973-08-07 |
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