IT957821B - Dispositivo di collegamento elet trico e complesso di circuito che lo comprende - Google Patents

Dispositivo di collegamento elet trico e complesso di circuito che lo comprende

Info

Publication number
IT957821B
IT957821B IT50202/72A IT5020272A IT957821B IT 957821 B IT957821 B IT 957821B IT 50202/72 A IT50202/72 A IT 50202/72A IT 5020272 A IT5020272 A IT 5020272A IT 957821 B IT957821 B IT 957821B
Authority
IT
Italy
Prior art keywords
electrical connection
connection device
circuit complex
complex
circuit
Prior art date
Application number
IT50202/72A
Other languages
English (en)
Original Assignee
Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd filed Critical Lucas Industries Ltd
Application granted granted Critical
Publication of IT957821B publication Critical patent/IT957821B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
IT50202/72A 1971-05-14 1972-05-12 Dispositivo di collegamento elet trico e complesso di circuito che lo comprende IT957821B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1503271A GB1379557A (en) 1971-05-14 1971-05-14 Wiring arrangement

Publications (1)

Publication Number Publication Date
IT957821B true IT957821B (it) 1973-10-20

Family

ID=10051852

Family Applications (1)

Application Number Title Priority Date Filing Date
IT50202/72A IT957821B (it) 1971-05-14 1972-05-12 Dispositivo di collegamento elet trico e complesso di circuito che lo comprende

Country Status (8)

Country Link
US (1) US3755717A (it)
AR (1) AR193399A1 (it)
BR (1) BR7203007D0 (it)
DE (1) DE2223582A1 (it)
ES (1) ES403057A1 (it)
FR (1) FR2138071B1 (it)
GB (1) GB1379557A (it)
IT (1) IT957821B (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4460224A (en) * 1982-05-21 1984-07-17 Burroughs Corporation Foldable circuit assembly
JPS59500441A (ja) * 1982-05-21 1984-03-15 バロ−ス・コ−ポレ−ション フレックス−パック相互連結装置
US6118072A (en) * 1997-12-03 2000-09-12 Teledyne Technologies Incorp. Device having a flexible circuit disposed within a conductive tube and method of making same
US6744637B2 (en) * 2001-11-30 2004-06-01 Alliant Techsystems Inc. Guided munitions electronics package and method
DE102005040036B4 (de) * 2005-08-23 2019-11-21 Deutsches Zentrum für Luft- und Raumfahrt e.V. Roboter-Hand
US7656236B2 (en) 2007-05-15 2010-02-02 Teledyne Wireless, Llc Noise canceling technique for frequency synthesizer
US8179045B2 (en) 2008-04-22 2012-05-15 Teledyne Wireless, Llc Slow wave structure having offset projections comprised of a metal-dielectric composite stack
KR101330770B1 (ko) * 2011-11-16 2013-11-18 엘지이노텍 주식회사 백라이트 유닛용 절곡 인쇄회로기판
US9202660B2 (en) 2013-03-13 2015-12-01 Teledyne Wireless, Llc Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1048021A (en) * 1963-02-04 1966-11-09 Nigel Archibald Walter Electrical circuit arrangements
US3505520A (en) * 1967-10-10 1970-04-07 Us Interior Measuring the incombustible content of mine dust using backscatter of low energy gamma rays
US3505570A (en) * 1968-03-08 1970-04-07 Edgar O Sprude Electrical apparatus and method of fabricating it
US3596139A (en) * 1969-10-22 1971-07-27 Ronald A Walsh Improved electronic component assembly cylindrical shell housing with inner peripheral radiating fin circuit board fastener means

Also Published As

Publication number Publication date
AR193399A1 (es) 1973-04-23
GB1379557A (en) 1975-01-02
FR2138071A1 (it) 1972-12-29
FR2138071B1 (it) 1974-07-26
BR7203007D0 (pt) 1973-06-07
US3755717A (en) 1973-08-28
ES403057A1 (es) 1975-04-16
DE2223582A1 (de) 1972-11-30

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