IT950007B - Pacco di transistor a radiofre quenza - Google Patents
Pacco di transistor a radiofre quenzaInfo
- Publication number
- IT950007B IT950007B IT21593/72A IT2159372A IT950007B IT 950007 B IT950007 B IT 950007B IT 21593/72 A IT21593/72 A IT 21593/72A IT 2159372 A IT2159372 A IT 2159372A IT 950007 B IT950007 B IT 950007B
- Authority
- IT
- Italy
- Prior art keywords
- radiofree
- quenza
- transistor package
- transistor
- package
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02B—INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
- F02B3/00—Engines characterised by air compression and subsequent fuel addition
- F02B3/06—Engines characterised by air compression and subsequent fuel addition with compression ignition
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01006—Carbon [C]
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- H01L2924/01019—Potassium [K]
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- H01L2924/01029—Copper [Cu]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01039—Yttrium [Y]
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- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/01052—Tellurium [Te]
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
- H01L2924/30111—Impedance matching
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microwave Amplifiers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12190871A | 1971-03-08 | 1971-03-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT950007B true IT950007B (it) | 1973-06-20 |
Family
ID=22399477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT21593/72A IT950007B (it) | 1971-03-08 | 1972-03-08 | Pacco di transistor a radiofre quenza |
Country Status (4)
Country | Link |
---|---|
US (1) | US3683241A (it) |
GB (1) | GB1362136A (it) |
IT (1) | IT950007B (it) |
NL (1) | NL7203032A (it) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2250918C2 (de) * | 1971-10-27 | 1982-02-04 | Westinghouse Electric Corp., 15222 Pittsburgh, Pa. | Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung |
US3801938A (en) * | 1972-05-31 | 1974-04-02 | Trw Inc | Package for microwave semiconductor device |
US3872583A (en) * | 1972-07-10 | 1975-03-25 | Amdahl Corp | LSI chip package and method |
US3784884A (en) * | 1972-11-03 | 1974-01-08 | Motorola Inc | Low parasitic microwave package |
JPS5834755Y2 (ja) * | 1978-09-18 | 1983-08-04 | 富士通株式会社 | 半導体装置 |
FR2476960A1 (fr) * | 1980-02-26 | 1981-08-28 | Thomson Csf | Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede |
GB2132413A (en) * | 1982-12-24 | 1984-07-04 | Plessey Co Plc | Microwave device package |
EP0117434A1 (en) * | 1983-01-28 | 1984-09-05 | Microwave Semiconductor Corp. | Hybrid microwave subsystem |
US4649416A (en) * | 1984-01-03 | 1987-03-10 | Raytheon Company | Microwave transistor package |
US4701573A (en) * | 1985-09-26 | 1987-10-20 | Itt Gallium Arsenide Technology Center | Semiconductor chip housing |
US4839717A (en) * | 1986-12-19 | 1989-06-13 | Fairchild Semiconductor Corporation | Ceramic package for high frequency semiconductor devices |
KR900008995B1 (ko) * | 1986-12-19 | 1990-12-17 | 페어차일드 세미콘덕터 코포레이션 | 고주파 반도체 소자용 세라믹 패키지 |
EP0605712B1 (en) * | 1992-07-17 | 1999-09-08 | Vlt Corporation | Packaging electrical components |
US5876859A (en) * | 1994-11-10 | 1999-03-02 | Vlt Corporation | Direct metal bonding |
US5906310A (en) * | 1994-11-10 | 1999-05-25 | Vlt Corporation | Packaging electrical circuits |
US5644103A (en) * | 1994-11-10 | 1997-07-01 | Vlt Corporation | Packaging electrical components having a scallop formed in an edge of a circuit board |
US5728600A (en) * | 1994-11-15 | 1998-03-17 | Vlt Corporation | Circuit encapsulation process |
US5945130A (en) * | 1994-11-15 | 1999-08-31 | Vlt Corporation | Apparatus for circuit encapsulation |
JP2732823B2 (ja) * | 1995-02-02 | 1998-03-30 | ヴィエルティー コーポレーション | はんだ付け方法 |
US6031726A (en) * | 1995-11-06 | 2000-02-29 | Vlt Corporation | Low profile mounting of power converters with the converter body in an aperture |
JP2933036B2 (ja) * | 1996-11-29 | 1999-08-09 | 日本電気株式会社 | 中空パッケージ |
EP0874415B1 (en) * | 1997-04-25 | 2006-08-23 | Kyocera Corporation | High-frequency package |
US6234842B1 (en) | 1998-11-20 | 2001-05-22 | Vlt Corporation | Power converter connector assembly |
US6316737B1 (en) | 1999-09-09 | 2001-11-13 | Vlt Corporation | Making a connection between a component and a circuit board |
US6434005B1 (en) | 2000-10-27 | 2002-08-13 | Vlt Corporation | Power converter packaging |
US6985341B2 (en) * | 2001-04-24 | 2006-01-10 | Vlt, Inc. | Components having actively controlled circuit elements |
US7443229B1 (en) | 2001-04-24 | 2008-10-28 | Picor Corporation | Active filtering |
EP1975993A1 (de) * | 2007-03-29 | 2008-10-01 | ABB Technology AG | Lötstoppmittel |
US10770415B2 (en) * | 2018-12-04 | 2020-09-08 | Cree, Inc. | Packaged transistor devices with input-output isolation and methods of forming packaged transistor devices with input-output isolation |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3408542A (en) * | 1963-03-29 | 1968-10-29 | Nat Semiconductor Corp | Semiconductor chopper amplifier with twin emitters |
US3265982A (en) * | 1963-10-24 | 1966-08-09 | Hazeltine Research Inc | Common emitter transistor amplifier including a heat sink |
US3312771A (en) * | 1964-08-07 | 1967-04-04 | Nat Beryllia Corp | Microelectronic package |
US3544857A (en) * | 1966-08-16 | 1970-12-01 | Signetics Corp | Integrated circuit assembly with lead structure and method |
-
1971
- 1971-03-08 US US121908A patent/US3683241A/en not_active Expired - Lifetime
-
1972
- 1972-03-03 GB GB1003872A patent/GB1362136A/en not_active Expired
- 1972-03-07 NL NL7203032A patent/NL7203032A/xx unknown
- 1972-03-08 IT IT21593/72A patent/IT950007B/it active
Also Published As
Publication number | Publication date |
---|---|
US3683241A (en) | 1972-08-08 |
GB1362136A (en) | 1974-07-30 |
NL7203032A (it) | 1972-09-12 |
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