IT950007B - Pacco di transistor a radiofre quenza - Google Patents

Pacco di transistor a radiofre quenza

Info

Publication number
IT950007B
IT950007B IT21593/72A IT2159372A IT950007B IT 950007 B IT950007 B IT 950007B IT 21593/72 A IT21593/72 A IT 21593/72A IT 2159372 A IT2159372 A IT 2159372A IT 950007 B IT950007 B IT 950007B
Authority
IT
Italy
Prior art keywords
radiofree
quenza
transistor package
transistor
package
Prior art date
Application number
IT21593/72A
Other languages
English (en)
Inventor
D Duncan
Original Assignee
Communications Transistor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Communications Transistor Corp filed Critical Communications Transistor Corp
Application granted granted Critical
Publication of IT950007B publication Critical patent/IT950007B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02B—INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
    • F02B3/00—Engines characterised by air compression and subsequent fuel addition
    • F02B3/06—Engines characterised by air compression and subsequent fuel addition with compression ignition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
IT21593/72A 1971-03-08 1972-03-08 Pacco di transistor a radiofre quenza IT950007B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12190871A 1971-03-08 1971-03-08

Publications (1)

Publication Number Publication Date
IT950007B true IT950007B (it) 1973-06-20

Family

ID=22399477

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21593/72A IT950007B (it) 1971-03-08 1972-03-08 Pacco di transistor a radiofre quenza

Country Status (4)

Country Link
US (1) US3683241A (it)
GB (1) GB1362136A (it)
IT (1) IT950007B (it)
NL (1) NL7203032A (it)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2250918C2 (de) * 1971-10-27 1982-02-04 Westinghouse Electric Corp., 15222 Pittsburgh, Pa. Chipträger für Mikrowellen-Leistungstransistoren und Verfahren zu seiner Herstellung
US3801938A (en) * 1972-05-31 1974-04-02 Trw Inc Package for microwave semiconductor device
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
JPS5834755Y2 (ja) * 1978-09-18 1983-08-04 富士通株式会社 半導体装置
FR2476960A1 (fr) * 1980-02-26 1981-08-28 Thomson Csf Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede
GB2132413A (en) * 1982-12-24 1984-07-04 Plessey Co Plc Microwave device package
EP0117434A1 (en) * 1983-01-28 1984-09-05 Microwave Semiconductor Corp. Hybrid microwave subsystem
US4649416A (en) * 1984-01-03 1987-03-10 Raytheon Company Microwave transistor package
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
KR900008995B1 (ko) * 1986-12-19 1990-12-17 페어차일드 세미콘덕터 코포레이션 고주파 반도체 소자용 세라믹 패키지
US4839717A (en) * 1986-12-19 1989-06-13 Fairchild Semiconductor Corporation Ceramic package for high frequency semiconductor devices
DE69326318T2 (de) * 1992-07-17 2000-02-03 Vlt Corp., San Antonio Verpackung für elektronische komponenten
US5644103A (en) * 1994-11-10 1997-07-01 Vlt Corporation Packaging electrical components having a scallop formed in an edge of a circuit board
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
US6031726A (en) * 1995-11-06 2000-02-29 Vlt Corporation Low profile mounting of power converters with the converter body in an aperture
JP2933036B2 (ja) * 1996-11-29 1999-08-09 日本電気株式会社 中空パッケージ
EP0874415B1 (en) * 1997-04-25 2006-08-23 Kyocera Corporation High-frequency package
US6234842B1 (en) 1998-11-20 2001-05-22 Vlt Corporation Power converter connector assembly
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6434005B1 (en) 2000-10-27 2002-08-13 Vlt Corporation Power converter packaging
USD510906S1 (en) 2000-10-27 2005-10-25 Vlt, Inc. Power converter
US6985341B2 (en) * 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
USD520947S1 (en) 2001-11-01 2006-05-16 Vlt, Inc. Power converter body
EP1975993A1 (de) * 2007-03-29 2008-10-01 ABB Technology AG Lötstoppmittel
US10770415B2 (en) * 2018-12-04 2020-09-08 Cree, Inc. Packaged transistor devices with input-output isolation and methods of forming packaged transistor devices with input-output isolation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408542A (en) * 1963-03-29 1968-10-29 Nat Semiconductor Corp Semiconductor chopper amplifier with twin emitters
US3265982A (en) * 1963-10-24 1966-08-09 Hazeltine Research Inc Common emitter transistor amplifier including a heat sink
US3312771A (en) * 1964-08-07 1967-04-04 Nat Beryllia Corp Microelectronic package
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method

Also Published As

Publication number Publication date
US3683241A (en) 1972-08-08
NL7203032A (it) 1972-09-12
GB1362136A (en) 1974-07-30

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