IT943856B - Organo strutturale di circuito stratiforme e procedimento per la sua fabbricazione - Google Patents

Organo strutturale di circuito stratiforme e procedimento per la sua fabbricazione

Info

Publication number
IT943856B
IT943856B IT32263/71A IT3226371A IT943856B IT 943856 B IT943856 B IT 943856B IT 32263/71 A IT32263/71 A IT 32263/71A IT 3226371 A IT3226371 A IT 3226371A IT 943856 B IT943856 B IT 943856B
Authority
IT
Italy
Prior art keywords
stratiform
procedure
manufacturing
structural body
circuit structural
Prior art date
Application number
IT32263/71A
Other languages
English (en)
Italian (it)
Original Assignee
Bunker Ramo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo filed Critical Bunker Ramo
Application granted granted Critical
Publication of IT943856B publication Critical patent/IT943856B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
IT32263/71A 1970-12-11 1971-12-10 Organo strutturale di circuito stratiforme e procedimento per la sua fabbricazione IT943856B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9720470A 1970-12-11 1970-12-11

Publications (1)

Publication Number Publication Date
IT943856B true IT943856B (it) 1973-04-10

Family

ID=22262026

Family Applications (1)

Application Number Title Priority Date Filing Date
IT32263/71A IT943856B (it) 1970-12-11 1971-12-10 Organo strutturale di circuito stratiforme e procedimento per la sua fabbricazione

Country Status (8)

Country Link
CA (1) CA954634A (enExample)
CH (1) CH536589A (enExample)
DE (1) DE2159672A1 (enExample)
FR (1) FR2117644A5 (enExample)
GB (1) GB1348015A (enExample)
IT (1) IT943856B (enExample)
NL (1) NL7116703A (enExample)
ZA (1) ZA717709B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4606787A (en) * 1982-03-04 1986-08-19 Etd Technology, Inc. Method and apparatus for manufacturing multi layer printed circuit boards

Also Published As

Publication number Publication date
FR2117644A5 (enExample) 1972-07-21
CH536589A (de) 1973-04-30
NL7116703A (enExample) 1972-06-13
DE2159672A1 (de) 1972-06-29
CA954634A (en) 1974-09-10
AU3581571A (en) 1973-05-24
GB1348015A (en) 1974-03-13
ZA717709B (en) 1972-08-30

Similar Documents

Publication Publication Date Title
IT944412B (it) Struttura a circuito integrato e procedimento per la sua fabbrica zione
IT988010B (it) Perfezionamento negli assorbenti igienici e procedimento di fabbricazione
BE754242A (fr) Diamino-s-triazines et dinitro-s-triazines
IT980547B (it) Transistore ripolare e procedimento per la sua fabbricazione
IT983948B (it) Metodo per la fabbricazione di strutture a circuito integrato e struttura risultante
IT1030011B (it) Prodotto commestibile incarsulato e procedimento per la sua fabbricazione
IT975882B (it) Dispositivo elettroluminescente e procedimento per la sua fabbricazio ne
IT977791B (it) Convettore e procedimento per la sua fabbricazione
IT943605B (it) Procedimento e dispositivo per la fabbricazione continuativa di sapone
TR17695A (tr) Dinamo ve imaline mahsus usul
IT1004517B (it) Lievito e procedimento per la sua preparazione
BE764996A (fr) Confiseries
IT991684B (it) Procedimento e dispositivo per la fabbricazione di fiale particolar mente fiale doppie
IT942249B (it) Procedimento per la preparazione di alcoli bivalenti
TR16951A (tr) Urea istihsali icin usul
CA969411A (en) Photographic element and process
IT962345B (it) Dispositivo di visualizzazione e metodo per la fabbricazione del lo stesso
BE772644A (nl) Hoekverbinding
IT943856B (it) Organo strutturale di circuito stratiforme e procedimento per la sua fabbricazione
TR17869A (tr) Civa istihsali icin usul
CA918300A (en) Semiconductor device and method of manufacturing the device
IT1044944B (it) Unita di semiconduttori e procedimento per la sua produzione
IT939953B (it) Procedimento e dispositivo per la preparazione di miscele acetilene etilene
AR193226A1 (es) Fregadero y procedimiento de fabricacion de dicho fregadero
AT318798B (de) Krankenbett