IT941183B - Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazione - Google Patents
Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazioneInfo
- Publication number
- IT941183B IT941183B IT3125271A IT3125271A IT941183B IT 941183 B IT941183 B IT 941183B IT 3125271 A IT3125271 A IT 3125271A IT 3125271 A IT3125271 A IT 3125271A IT 941183 B IT941183 B IT 941183B
- Authority
- IT
- Italy
- Prior art keywords
- aluminum
- integrated circuits
- preparation process
- cantilever
- connections
- Prior art date
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title 1
- 229910052782 aluminium Inorganic materials 0.000 title 1
- 238000002360 preparation method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Weting (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT3125271A IT941183B (it) | 1971-11-18 | 1971-11-18 | Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazione |
| JP47113580A JPS4860578A (it) | 1971-11-18 | 1972-11-14 | |
| FR7240552A FR2160492B1 (it) | 1971-11-18 | 1972-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT3125271A IT941183B (it) | 1971-11-18 | 1971-11-18 | Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazione |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT941183B true IT941183B (it) | 1973-03-01 |
Family
ID=11233334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT3125271A IT941183B (it) | 1971-11-18 | 1971-11-18 | Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazione |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS4860578A (it) |
| FR (1) | FR2160492B1 (it) |
| IT (1) | IT941183B (it) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2505091A1 (fr) * | 1981-04-30 | 1982-11-05 | Cii Honeywell Bull | Dispositif de protection des circuits electroniques tels que des circuits integres a l'encontre des charges electrostatiques |
-
1971
- 1971-11-18 IT IT3125271A patent/IT941183B/it active
-
1972
- 1972-11-14 JP JP47113580A patent/JPS4860578A/ja active Pending
- 1972-11-15 FR FR7240552A patent/FR2160492B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2160492B1 (it) | 1976-10-29 |
| JPS4860578A (it) | 1973-08-24 |
| FR2160492A1 (it) | 1973-06-29 |
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