IT941183B - Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazione - Google Patents

Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazione

Info

Publication number
IT941183B
IT941183B IT31252/71A IT3125271A IT941183B IT 941183 B IT941183 B IT 941183B IT 31252/71 A IT31252/71 A IT 31252/71A IT 3125271 A IT3125271 A IT 3125271A IT 941183 B IT941183 B IT 941183B
Authority
IT
Italy
Prior art keywords
aluminum
integrated circuits
preparation process
cantilever
connections
Prior art date
Application number
IT31252/71A
Other languages
English (en)
Inventor
A Gmitaneo
A Puzone
Original Assignee
Honeywell Inf Systems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inf Systems filed Critical Honeywell Inf Systems
Priority to IT31252/71A priority Critical patent/IT941183B/it
Priority to JP47113580A priority patent/JPS4860578A/ja
Priority to FR7240552A priority patent/FR2160492B1/fr
Application granted granted Critical
Publication of IT941183B publication Critical patent/IT941183B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
IT31252/71A 1971-11-18 1971-11-18 Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazione IT941183B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT31252/71A IT941183B (it) 1971-11-18 1971-11-18 Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazione
JP47113580A JPS4860578A (it) 1971-11-18 1972-11-14
FR7240552A FR2160492B1 (it) 1971-11-18 1972-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT31252/71A IT941183B (it) 1971-11-18 1971-11-18 Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazione

Publications (1)

Publication Number Publication Date
IT941183B true IT941183B (it) 1973-03-01

Family

ID=11233334

Family Applications (1)

Application Number Title Priority Date Filing Date
IT31252/71A IT941183B (it) 1971-11-18 1971-11-18 Collegamenti a sbalzo di allumi nio per circuiti integrati e lo ro processo di preparazione

Country Status (3)

Country Link
JP (1) JPS4860578A (it)
FR (1) FR2160492B1 (it)
IT (1) IT941183B (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2505091A1 (fr) * 1981-04-30 1982-11-05 Cii Honeywell Bull Dispositif de protection des circuits electroniques tels que des circuits integres a l'encontre des charges electrostatiques

Also Published As

Publication number Publication date
FR2160492A1 (it) 1973-06-29
FR2160492B1 (it) 1976-10-29
JPS4860578A (it) 1973-08-24

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