IT8121735A0 - Sorgente di polverizzazione intensificata magneticamente. - Google Patents

Sorgente di polverizzazione intensificata magneticamente.

Info

Publication number
IT8121735A0
IT8121735A0 IT8121735A IT2173581A IT8121735A0 IT 8121735 A0 IT8121735 A0 IT 8121735A0 IT 8121735 A IT8121735 A IT 8121735A IT 2173581 A IT2173581 A IT 2173581A IT 8121735 A0 IT8121735 A0 IT 8121735A0
Authority
IT
Italy
Prior art keywords
magnetically
spray source
intensified
intensified spray
source
Prior art date
Application number
IT8121735A
Other languages
English (en)
Other versions
IT1135813B (it
Inventor
Lawrence Turner Lamont Jr
Original Assignee
Varian Associates
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates filed Critical Varian Associates
Publication of IT8121735A0 publication Critical patent/IT8121735A0/it
Application granted granted Critical
Publication of IT1135813B publication Critical patent/IT1135813B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
IT21735/81A 1980-05-16 1981-05-15 Sorgente di polverizzazione intensificata magenticamente IT1135813B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/150,532 US4457825A (en) 1980-05-16 1980-05-16 Sputter target for use in a sputter coating source

Publications (2)

Publication Number Publication Date
IT8121735A0 true IT8121735A0 (it) 1981-05-15
IT1135813B IT1135813B (it) 1986-08-27

Family

ID=22534972

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21735/81A IT1135813B (it) 1980-05-16 1981-05-15 Sorgente di polverizzazione intensificata magenticamente

Country Status (6)

Country Link
US (1) US4457825A (it)
EP (2) EP0311697B1 (it)
JP (1) JPS5944387B2 (it)
DE (2) DE3177132D1 (it)
IT (1) IT1135813B (it)
WO (1) WO1981003345A1 (it)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4525264A (en) * 1981-12-07 1985-06-25 Ford Motor Company Cylindrical post magnetron sputtering system
JPS5976875A (ja) * 1982-10-22 1984-05-02 Hitachi Ltd マグネトロン型スパッタ装置とそれに用いるターゲット
US4515675A (en) * 1983-07-06 1985-05-07 Leybold-Heraeus Gmbh Magnetron cathode for cathodic evaportion apparatus
NL8402012A (nl) * 1983-07-19 1985-02-18 Varian Associates Magnetron spetter deklaag opbrengbron voor zowel magnetische als niet-magnetische trefplaatmaterialen.
US4500409A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Magnetron sputter coating source for both magnetic and non magnetic target materials
US4500408A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Apparatus for and method of controlling sputter coating
CH659484A5 (de) * 1984-04-19 1987-01-30 Balzers Hochvakuum Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.
US4606806A (en) * 1984-05-17 1986-08-19 Varian Associates, Inc. Magnetron sputter device having planar and curved targets
EP0163445B1 (en) * 1984-05-17 1991-01-30 Varian Associates, Inc. Magnetron sputter device having planar and concave targets
US4627904A (en) * 1984-05-17 1986-12-09 Varian Associates, Inc. Magnetron sputter device having separate confining magnetic fields to separate targets and magnetically enhanced R.F. bias
US4564435A (en) * 1985-05-23 1986-01-14 Varian Associates, Inc. Target assembly for sputtering magnetic material
US4855033A (en) * 1986-04-04 1989-08-08 Materials Research Corporation Cathode and target design for a sputter coating apparatus
US4842703A (en) * 1988-02-23 1989-06-27 Eaton Corporation Magnetron cathode and method for sputter coating
US4820397A (en) * 1988-04-04 1989-04-11 Tosoh Smd, Inc. Quick change sputter target assembly
US5032246A (en) * 1990-05-17 1991-07-16 Tosoh Smd, Inc. Sputtering target wrench and sputtering target design
US5009765A (en) * 1990-05-17 1991-04-23 Tosoh Smd, Inc. Sputter target design
US5490914A (en) * 1995-02-14 1996-02-13 Sony Corporation High utilization sputtering target for cathode assembly
US5147521A (en) * 1991-05-20 1992-09-15 Tosoh Smd, Inc. Quick change sputter target assembly
DE4123274C2 (de) * 1991-07-13 1996-12-19 Leybold Ag Vorrichtung zum Beschichten von Bauteilen bzw. Formteilen durch Kathodenzerstäubung
US5194131A (en) * 1991-08-16 1993-03-16 Varian Associates, Inc. Apparatus and method for multiple ring sputtering from a single target
US5269899A (en) * 1992-04-29 1993-12-14 Tosoh Smd, Inc. Cathode assembly for cathodic sputtering apparatus
US5342496A (en) * 1993-05-18 1994-08-30 Tosoh Smd, Inc. Method of welding sputtering target/backing plate assemblies
DE59400046D1 (de) * 1994-04-07 1995-12-21 Balzers Hochvakuum Magnetronzerstäubungsquelle und deren Verwendung.
EP0704878A1 (en) * 1994-09-27 1996-04-03 Applied Materials, Inc. Uniform film thickness deposition of sputtered materials
DE19648390A1 (de) * 1995-09-27 1998-05-28 Leybold Materials Gmbh Target für die Sputterkathode einer Vakuumbeschichtungsanlage
CH691643A5 (de) * 1995-10-06 2001-08-31 Unaxis Balzers Ag Magnetronzerstäubungsquelle und deren Verwendung.
US5658442A (en) * 1996-03-07 1997-08-19 Applied Materials, Inc. Target and dark space shield for a physical vapor deposition system
US6042706A (en) * 1997-01-14 2000-03-28 Applied Materials, Inc. Ionized PVD source to produce uniform low-particle deposition
US5985115A (en) * 1997-04-11 1999-11-16 Novellus Systems, Inc. Internally cooled target assembly for magnetron sputtering
US5855745A (en) * 1997-04-23 1999-01-05 Sierra Applied Sciences, Inc. Plasma processing system utilizing combined anode/ ion source
AU9410498A (en) * 1997-11-26 1999-06-17 Vapor Technologies, Inc. Apparatus for sputtering or arc evaporation
US6217716B1 (en) 1998-05-06 2001-04-17 Novellus Systems, Inc. Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
US6620296B2 (en) 2000-07-17 2003-09-16 Applied Materials, Inc. Target sidewall design to reduce particle generation during magnetron sputtering
US20040244949A1 (en) * 2003-05-30 2004-12-09 Tokyo Electron Limited Temperature controlled shield ring
US7303996B2 (en) * 2003-10-01 2007-12-04 Taiwan Semiconductor Manufacturing Co., Ltd. High-K gate dielectric stack plasma treatment to adjust threshold voltage characteristics
US10347473B2 (en) * 2009-09-24 2019-07-09 The United States Of America, As Represented By The Secretary Of The Navy Synthesis of high-purity bulk copper indium gallium selenide materials
CN103132038A (zh) * 2013-02-27 2013-06-05 蚌埠玻璃工业设计研究院 一种消除阴极背面辉光放电装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3282815A (en) * 1963-07-01 1966-11-01 Ibm Magnetic control of film deposition
US3616450A (en) * 1968-11-07 1971-10-26 Peter J Clark Sputtering apparatus
US3711398A (en) * 1971-02-18 1973-01-16 P Clarke Sputtering apparatus
US3829373A (en) * 1973-01-12 1974-08-13 Coulter Information Systems Thin film deposition apparatus using segmented target means
US3878085A (en) * 1973-07-05 1975-04-15 Sloan Technology Corp Cathode sputtering apparatus
US4060470A (en) * 1974-12-06 1977-11-29 Clarke Peter J Sputtering apparatus and method
US4046660A (en) * 1975-12-29 1977-09-06 Bell Telephone Laboratories, Incorporated Sputter coating with charged particle flux control
US4155825A (en) * 1977-05-02 1979-05-22 Fournier Paul R Integrated sputtering apparatus and method
US4100055A (en) * 1977-06-10 1978-07-11 Varian Associates, Inc. Target profile for sputtering apparatus
US4166783A (en) * 1978-04-17 1979-09-04 Varian Associates, Inc. Deposition rate regulation by computer control of sputtering systems
US4162954A (en) * 1978-08-21 1979-07-31 Vac-Tec Systems, Inc. Planar magnetron sputtering device
US4265729A (en) * 1978-09-27 1981-05-05 Vac-Tec Systems, Inc. Magnetically enhanced sputtering device
US4180450A (en) * 1978-08-21 1979-12-25 Vac-Tec Systems, Inc. Planar magnetron sputtering device
US4198283A (en) * 1978-11-06 1980-04-15 Materials Research Corporation Magnetron sputtering target and cathode assembly
HU179482B (en) * 1979-02-19 1982-10-28 Mikroelektronikai Valalat Penning pulverizel source
US4204936A (en) * 1979-03-29 1980-05-27 The Perkin-Elmer Corporation Method and apparatus for attaching a target to the cathode of a sputtering system
GB2051877B (en) * 1979-04-09 1983-03-02 Vac Tec Syst Magnetically enhanced sputtering device and method
US4239611A (en) * 1979-06-11 1980-12-16 Vac-Tec Systems, Inc. Magnetron sputtering devices
DE3004541C2 (de) * 1980-02-07 1982-03-04 Siemens AG, 1000 Berlin und 8000 München Mehrkanaliges, schreibendes Meßgerät

Also Published As

Publication number Publication date
JPS57500615A (it) 1982-04-08
DE3177132D1 (de) 1990-01-18
WO1981003345A1 (en) 1981-11-26
DE3177309D1 (de) 1994-03-31
EP0311697A2 (en) 1989-04-19
EP0311697A3 (en) 1990-01-17
EP0051635B1 (en) 1989-12-13
DE3177309T2 (de) 1994-05-26
EP0051635A4 (en) 1983-09-26
IT1135813B (it) 1986-08-27
JPS5944387B2 (ja) 1984-10-29
EP0051635A1 (en) 1982-05-19
US4457825A (en) 1984-07-03
EP0311697B1 (en) 1994-02-23

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19940527