IT7924852A0 - Sistema di adesivi conduttori che comprende un componente che fa aumentare la conducibilita'. - Google Patents
Sistema di adesivi conduttori che comprende un componente che fa aumentare la conducibilita'.Info
- Publication number
- IT7924852A0 IT7924852A0 IT7924852A IT2485279A IT7924852A0 IT 7924852 A0 IT7924852 A0 IT 7924852A0 IT 7924852 A IT7924852 A IT 7924852A IT 2485279 A IT2485279 A IT 2485279A IT 7924852 A0 IT7924852 A0 IT 7924852A0
- Authority
- IT
- Italy
- Prior art keywords
- component
- conductive adhesive
- adhesive system
- increases conductivity
- conductivity
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H01L2924/01005—Boron [B]
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/01029—Copper [Cu]
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- H01L2924/01047—Silver [Ag]
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- H01L2924/01057—Lanthanum [La]
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- H01L2924/01075—Rhenium [Re]
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US93115978A | 1978-08-04 | 1978-08-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7924852A0 true IT7924852A0 (it) | 1979-08-01 |
IT1122392B IT1122392B (it) | 1986-04-23 |
Family
ID=25460307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT24852/79A IT1122392B (it) | 1978-08-04 | 1979-08-01 | Sistema di adesivi conduttori che comprende un componente che fa aumentare la conducibilita' |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS5524397A (it) |
BE (1) | BE878072A (it) |
CA (1) | CA1141528A (it) |
DE (1) | DE2931634A1 (it) |
FR (1) | FR2432543A1 (it) |
GB (1) | GB2028828B (it) |
IT (1) | IT1122392B (it) |
NL (1) | NL7905932A (it) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56114302A (en) * | 1980-02-04 | 1981-09-08 | Rte Corp | Arrester block assembly |
JPS57111034A (en) * | 1980-12-10 | 1982-07-10 | Hitachi Ltd | Semiconductor device and its manufacture |
JPS57185316A (en) * | 1981-05-11 | 1982-11-15 | Sumitomo Metal Mining Co Ltd | Electrically conductive resin paste |
JP2833111B2 (ja) * | 1989-03-09 | 1998-12-09 | 日立化成工業株式会社 | 回路の接続方法及びそれに用いる接着剤フィルム |
JPH07123179B2 (ja) * | 1990-10-05 | 1995-12-25 | 信越ポリマー株式会社 | 異方導電接着剤による回路基板の接続構造 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE460345A (it) * | 1939-07-27 | |||
FR1538385A (fr) * | 1967-06-22 | 1968-09-06 | Nii R I Latexnykh Izdely | Procédé de réalisation d'un contact électrique |
US3686139A (en) * | 1970-03-10 | 1972-08-22 | Globe Union Inc | Resistive coating compositions and resistor elements produced therefrom |
-
1979
- 1979-07-26 GB GB7926042A patent/GB2028828B/en not_active Expired
- 1979-07-26 CA CA000332609A patent/CA1141528A/en not_active Expired
- 1979-08-01 NL NL7905932A patent/NL7905932A/nl not_active Application Discontinuation
- 1979-08-01 FR FR7919801A patent/FR2432543A1/fr active Granted
- 1979-08-01 IT IT24852/79A patent/IT1122392B/it active
- 1979-08-03 DE DE19792931634 patent/DE2931634A1/de not_active Withdrawn
- 1979-08-03 BE BE0/196597A patent/BE878072A/xx not_active IP Right Cessation
- 1979-08-04 JP JP9914179A patent/JPS5524397A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2432543B1 (it) | 1983-10-28 |
GB2028828B (en) | 1982-09-22 |
BE878072A (fr) | 1979-12-03 |
FR2432543A1 (fr) | 1980-02-29 |
DE2931634A1 (de) | 1980-02-28 |
JPS5524397A (en) | 1980-02-21 |
NL7905932A (nl) | 1980-02-06 |
CA1141528A (en) | 1983-02-22 |
IT1122392B (it) | 1986-04-23 |
GB2028828A (en) | 1980-03-12 |
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