IT7920456A0 - Procedimento per stabilire collegamenti, con continuita' dimateriale, su piastre circuitali. - Google Patents
Procedimento per stabilire collegamenti, con continuita' dimateriale, su piastre circuitali.Info
- Publication number
- IT7920456A0 IT7920456A0 IT7920456A IT2045679A IT7920456A0 IT 7920456 A0 IT7920456 A0 IT 7920456A0 IT 7920456 A IT7920456 A IT 7920456A IT 2045679 A IT2045679 A IT 2045679A IT 7920456 A0 IT7920456 A0 IT 7920456A0
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- establishing connections
- circuit plates
- material continuity
- continuity
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0004—Resistance soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/101—Using electrical induction, e.g. for heating during soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Multi-Conductor Connections (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Connection Of Plates (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19782809288 DE2809288A1 (de) | 1978-03-01 | 1978-03-01 | Verfahren zur stoffschluessigen verbindung auf leiterplatten |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7920456A0 true IT7920456A0 (it) | 1979-02-23 |
IT1111863B IT1111863B (it) | 1986-01-13 |
Family
ID=6033520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT20456/79A IT1111863B (it) | 1978-03-01 | 1979-02-23 | Procedimento per stabilire collegamenti,con continuita' di materiale,su piastre circuitali |
Country Status (9)
Country | Link |
---|---|
BE (1) | BE874479A (it) |
DE (1) | DE2809288A1 (it) |
DK (1) | DK53579A (it) |
FR (1) | FR2418991A1 (it) |
GB (1) | GB2015405A (it) |
IE (1) | IE790296L (it) |
IT (1) | IT1111863B (it) |
LU (1) | LU80700A1 (it) |
NL (1) | NL7900112A (it) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3008285A1 (de) * | 1980-03-04 | 1981-09-17 | Kurt-Åke Vallentuna Wallberg | Einrichtung zum herstellen einer dichten verbindung zwischen zwei metallischen gliedern |
GB8404342D0 (en) * | 1984-02-18 | 1984-03-21 | Lucas Ind Plc | Manufacture of armature winding conductors |
CN110303213A (zh) * | 2019-07-05 | 2019-10-08 | 深圳市集银科技有限公司 | 一种背光模组fpc焊接用钢丝压板技术 |
-
1978
- 1978-03-01 DE DE19782809288 patent/DE2809288A1/de active Pending
- 1978-12-22 LU LU80700A patent/LU80700A1/de unknown
-
1979
- 1979-01-05 NL NL7900112A patent/NL7900112A/xx not_active Application Discontinuation
- 1979-02-08 GB GB7904447A patent/GB2015405A/en not_active Withdrawn
- 1979-02-09 DK DK53579A patent/DK53579A/da unknown
- 1979-02-15 IE IE790296A patent/IE790296L/xx unknown
- 1979-02-23 IT IT20456/79A patent/IT1111863B/it active
- 1979-02-27 BE BE193719A patent/BE874479A/xx unknown
- 1979-02-28 FR FR7905293A patent/FR2418991A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DK53579A (da) | 1979-09-02 |
LU80700A1 (de) | 1979-04-13 |
IT1111863B (it) | 1986-01-13 |
DE2809288A1 (de) | 1979-09-06 |
BE874479A (fr) | 1979-06-18 |
GB2015405A (en) | 1979-09-12 |
NL7900112A (nl) | 1979-09-04 |
IE790296L (en) | 1979-09-01 |
FR2418991A1 (fr) | 1979-09-28 |
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