IT7849996A0 - PREFABRICATED METALLIC PLATE HEAT TRANSMITTING COMPOUND - Google Patents

PREFABRICATED METALLIC PLATE HEAT TRANSMITTING COMPOUND

Info

Publication number
IT7849996A0
IT7849996A0 IT7849996A IT4999678A IT7849996A0 IT 7849996 A0 IT7849996 A0 IT 7849996A0 IT 7849996 A IT7849996 A IT 7849996A IT 4999678 A IT4999678 A IT 4999678A IT 7849996 A0 IT7849996 A0 IT 7849996A0
Authority
IT
Italy
Prior art keywords
metallic plate
plate heat
heat transmitting
transmitting compound
prefabricated metallic
Prior art date
Application number
IT7849996A
Other languages
Italian (it)
Other versions
IT1105422B (en
Original Assignee
Semi Alloys Inc Societa Dello
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semi Alloys Inc Societa Dello filed Critical Semi Alloys Inc Societa Dello
Publication of IT7849996A0 publication Critical patent/IT7849996A0/en
Application granted granted Critical
Publication of IT1105422B publication Critical patent/IT1105422B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT49996/78A 1977-06-29 1978-06-22 METAL PREFABRICATED PLATE TRANSMITTER COMPOSITE HEAT IT1105422B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81108477A 1977-06-29 1977-06-29

Publications (2)

Publication Number Publication Date
IT7849996A0 true IT7849996A0 (en) 1978-06-22
IT1105422B IT1105422B (en) 1985-11-04

Family

ID=25205506

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49996/78A IT1105422B (en) 1977-06-29 1978-06-22 METAL PREFABRICATED PLATE TRANSMITTER COMPOSITE HEAT

Country Status (7)

Country Link
JP (1) JPS5412569A (en)
CA (1) CA1083263A (en)
DE (1) DE2826252A1 (en)
FR (1) FR2396263A1 (en)
GB (1) GB1588477A (en)
IT (1) IT1105422B (en)
NL (1) NL7806751A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4283464A (en) * 1979-05-08 1981-08-11 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit
SE420964B (en) * 1980-03-27 1981-11-09 Asea Ab COMPOSITION MATERIAL AND SET FOR ITS MANUFACTURING
US4427993A (en) * 1980-11-21 1984-01-24 General Electric Company Thermal stress relieving bimetallic plate
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
FR2511193A1 (en) * 1981-08-07 1983-02-11 Thomson Csf Laminated support for cooling semiconductor - has three metal layers including one rigid layer to avoid bi-metallic bending with changing temp.
US5039335A (en) * 1988-10-21 1991-08-13 Texas Instruments Incorporated Composite material for a circuit system and method of making
CA1316303C (en) * 1988-12-23 1993-04-20 Thijs Eerkes Composite structure
JPH02231751A (en) * 1989-03-03 1990-09-13 Sumitomo Special Metals Co Ltd Material for lead frame
US5310520A (en) * 1993-01-29 1994-05-10 Texas Instruments Incorporated Circuit system, a composite material for use therein, and a method of making the material
KR960000706B1 (en) * 1993-07-12 1996-01-11 한국전기통신공사 Power-device type plastic package structure and the
WO1998020549A1 (en) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. Use of variable perforation density in copper layer to control cte

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL183243C (en) * 1953-11-30 Metallgesellschaft Ag PROCEDURE FOR APPLYING PHOSPHATE COATINGS ON METAL SURFACES.
US3296501A (en) * 1962-11-07 1967-01-03 Westinghouse Electric Corp Metallic ceramic composite contacts for semiconductor devices
GB1004020A (en) * 1964-04-24 1965-09-08 Standard Telephones Cables Ltd Improvements in or relating to the mounting of electrical components
US3368112A (en) * 1964-12-18 1968-02-06 Navy Usa Shielding of electrical circuits by metal deposition
US3928907A (en) * 1971-11-18 1975-12-30 John Chisholm Method of making thermal attachment to porous metal surfaces
JPS5039065A (en) * 1973-08-08 1975-04-10
FR2305025A1 (en) * 1975-03-21 1976-10-15 Thomson Csf Mount and heat sink for semiconductor - has low thermal resistance and is sandwich of molybdenum, beryllium oxide, beryllium, and gold

Also Published As

Publication number Publication date
NL7806751A (en) 1979-01-03
JPS5412569A (en) 1979-01-30
CA1083263A (en) 1980-08-05
FR2396263A1 (en) 1979-01-26
GB1588477A (en) 1981-04-23
DE2826252A1 (en) 1979-01-04
IT1105422B (en) 1985-11-04
FR2396263B1 (en) 1984-04-13

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