IT201900024436A1 - PROCEDURE FOR CUTTING SEMICONDUCTOR SUBSTRATES AND CORRESPONDING SEMICONDUCTOR PRODUCT - Google Patents

PROCEDURE FOR CUTTING SEMICONDUCTOR SUBSTRATES AND CORRESPONDING SEMICONDUCTOR PRODUCT

Info

Publication number
IT201900024436A1
IT201900024436A1 IT102019000024436A IT201900024436A IT201900024436A1 IT 201900024436 A1 IT201900024436 A1 IT 201900024436A1 IT 102019000024436 A IT102019000024436 A IT 102019000024436A IT 201900024436 A IT201900024436 A IT 201900024436A IT 201900024436 A1 IT201900024436 A1 IT 201900024436A1
Authority
IT
Italy
Prior art keywords
procedure
cutting
semiconductor
product
substrates
Prior art date
Application number
IT102019000024436A
Other languages
Italian (it)
Inventor
Antonio Bellizzi
Michele Derai
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT102019000024436A priority Critical patent/IT201900024436A1/en
Priority to US17/121,184 priority patent/US20210187663A1/en
Priority to CN202011503403.XA priority patent/CN113013097A/en
Priority to CN202023052410.0U priority patent/CN215266256U/en
Publication of IT201900024436A1 publication Critical patent/IT201900024436A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
IT102019000024436A 2019-12-18 2019-12-18 PROCEDURE FOR CUTTING SEMICONDUCTOR SUBSTRATES AND CORRESPONDING SEMICONDUCTOR PRODUCT IT201900024436A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT102019000024436A IT201900024436A1 (en) 2019-12-18 2019-12-18 PROCEDURE FOR CUTTING SEMICONDUCTOR SUBSTRATES AND CORRESPONDING SEMICONDUCTOR PRODUCT
US17/121,184 US20210187663A1 (en) 2019-12-18 2020-12-14 Method of cutting semiconductor substrates and corresponding semiconductor product
CN202011503403.XA CN113013097A (en) 2019-12-18 2020-12-17 Method for cutting semiconductor substrate and corresponding semiconductor product
CN202023052410.0U CN215266256U (en) 2019-12-18 2020-12-17 Semiconductor product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102019000024436A IT201900024436A1 (en) 2019-12-18 2019-12-18 PROCEDURE FOR CUTTING SEMICONDUCTOR SUBSTRATES AND CORRESPONDING SEMICONDUCTOR PRODUCT

Publications (1)

Publication Number Publication Date
IT201900024436A1 true IT201900024436A1 (en) 2021-06-18

Family

ID=70009310

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102019000024436A IT201900024436A1 (en) 2019-12-18 2019-12-18 PROCEDURE FOR CUTTING SEMICONDUCTOR SUBSTRATES AND CORRESPONDING SEMICONDUCTOR PRODUCT

Country Status (3)

Country Link
US (1) US20210187663A1 (en)
CN (2) CN113013097A (en)
IT (1) IT201900024436A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050282360A1 (en) * 2004-06-22 2005-12-22 Nec Electronics Corporation Semiconductor wafer and manufacturing process for semiconductor device
US20080277806A1 (en) * 2007-05-08 2008-11-13 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer with assisting dicing structure and dicing method thereof
US20100081255A1 (en) * 2008-09-29 2010-04-01 Erasenthiran Poonjolai Methods for reducing defects through selective laser scribing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050282360A1 (en) * 2004-06-22 2005-12-22 Nec Electronics Corporation Semiconductor wafer and manufacturing process for semiconductor device
US20080277806A1 (en) * 2007-05-08 2008-11-13 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer with assisting dicing structure and dicing method thereof
US20100081255A1 (en) * 2008-09-29 2010-04-01 Erasenthiran Poonjolai Methods for reducing defects through selective laser scribing

Also Published As

Publication number Publication date
US20210187663A1 (en) 2021-06-24
CN113013097A (en) 2021-06-22
CN215266256U (en) 2021-12-21

Similar Documents

Publication Publication Date Title
IT201700055987A1 (en) PROCEDURE FOR MANUFACTURING SEMICONDUCTOR AND CORRESPONDING PRODUCT DEVICES
EP3696925A4 (en) Semiconductor laser
EP3886161A4 (en) Semiconductor package substrate and method for producing same
EP3366817A4 (en) Base substrate, method for manufacturing base substrate, and method for manufacturing group 13 nitride crystal
EP3687537A4 (en) Novel usp7 inhibitors for treating multiple myeloma
SG10201907085QA (en) Semiconductor substrate processing method
EP3794631A4 (en) Methods for forming large area diamond substrates
EP3640973A4 (en) Wide-gap semiconductor substrate, apparatus for manufacturing wide-gap semiconductor substrate, and method for manufacturing wide-gap semiconductor substrate
SG10201906893VA (en) Package substrate processing method
EP3427044A4 (en) Sound-assisted crack propagation for semiconductor wafering
IT201900025093A1 (en) PROCEDURE FOR A LASER PROCESSING
EP3904567A4 (en) Compound semiconductor substrate
EP3751023A4 (en) Semiconductor wafer
TWI799507B (en) Adhesive tape for semiconductor processing
IT201900024436A1 (en) PROCEDURE FOR CUTTING SEMICONDUCTOR SUBSTRATES AND CORRESPONDING SEMICONDUCTOR PRODUCT
EP3863388A4 (en) Semiconductor package
IT201900025009A1 (en) LEADFRAME FOR SEMICONDUCTOR DEVICES, SEMICONDUCTOR PRODUCT AND CORRESPONDING PROCEDURE
EP4027381A4 (en) Semiconductor laser device
EP4006975A4 (en) Semiconductor package
EP4020541A4 (en) Semiconductor package
IT201900023463A1 (en) Packaging line
GB201905864D0 (en) Cutting devices
EP3855484A4 (en) Substrate for semiconductor device
EP3573090A4 (en) Semiconductor wafer cleaning method
EP3442008A4 (en) Protective film forming method for semiconductor substrate