IT1400493B1 - Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento. - Google Patents
Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento.Info
- Publication number
- IT1400493B1 IT1400493B1 ITMI2010A001024A ITMI20101024A IT1400493B1 IT 1400493 B1 IT1400493 B1 IT 1400493B1 IT MI2010A001024 A ITMI2010A001024 A IT MI2010A001024A IT MI20101024 A ITMI20101024 A IT MI20101024A IT 1400493 B1 IT1400493 B1 IT 1400493B1
- Authority
- IT
- Italy
- Prior art keywords
- positioning
- precisely
- positioning seat
- miniaturized piece
- miniaturized
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2010A001024A IT1400493B1 (it) | 2010-06-09 | 2010-06-09 | Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2010A001024A IT1400493B1 (it) | 2010-06-09 | 2010-06-09 | Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento. |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20101024A1 ITMI20101024A1 (it) | 2011-12-10 |
IT1400493B1 true IT1400493B1 (it) | 2013-06-11 |
Family
ID=43587096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI2010A001024A IT1400493B1 (it) | 2010-06-09 | 2010-06-09 | Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento. |
Country Status (1)
Country | Link |
---|---|
IT (1) | IT1400493B1 (it) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3160443A (en) * | 1962-10-23 | 1964-12-08 | Western Electric Co | Apparatus for pneumatically conveying articles |
JPS57139937A (en) * | 1981-02-23 | 1982-08-30 | Fujitsu Ltd | Alignment device for discoid body with orientation flat section |
JPS5884311A (ja) * | 1981-11-12 | 1983-05-20 | Seiko Instr & Electronics Ltd | 矩形板片の位置決め装置 |
JPS5957448A (ja) * | 1982-09-27 | 1984-04-03 | Fujitsu Ltd | 半導体装置の製造機器 |
JPS59121226A (ja) * | 1982-12-27 | 1984-07-13 | Fujitsu Ltd | エアベアリング |
US4543970A (en) * | 1983-02-21 | 1985-10-01 | Tokyo Shibaura Denki Kabushiki Kaisha | Automatic set-up system |
US4573830A (en) * | 1984-06-21 | 1986-03-04 | International Business Machines Corporation | Chip decelerator |
US4676699A (en) * | 1985-04-11 | 1987-06-30 | Intel Corporation | Semiconductor wafer guides |
US6781684B1 (en) * | 2000-11-07 | 2004-08-24 | Donald L. Ekhoff | Workpiece levitation using alternating positive and negative pressure flows |
TWI222423B (en) * | 2001-12-27 | 2004-10-21 | Orbotech Ltd | System and methods for conveying and transporting levitated articles |
US7513716B2 (en) * | 2006-03-09 | 2009-04-07 | Seiko Epson Corporation | Workpiece conveyor and method of conveying workpiece |
WO2008062831A1 (fr) * | 2006-11-22 | 2008-05-29 | Sinfonia Technology Co., Ltd. | Dispositif de transport par aéroflottaison et procédé de transport à l'aide de l'air |
US7764076B2 (en) * | 2007-02-20 | 2010-07-27 | Centipede Systems, Inc. | Method and apparatus for aligning and/or leveling a test head |
-
2010
- 2010-06-09 IT ITMI2010A001024A patent/IT1400493B1/it active
Also Published As
Publication number | Publication date |
---|---|
ITMI20101024A1 (it) | 2011-12-10 |
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