IT1400493B1 - Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento. - Google Patents

Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento.

Info

Publication number
IT1400493B1
IT1400493B1 ITMI2010A001024A ITMI20101024A IT1400493B1 IT 1400493 B1 IT1400493 B1 IT 1400493B1 IT MI2010A001024 A ITMI2010A001024 A IT MI2010A001024A IT MI20101024 A ITMI20101024 A IT MI20101024A IT 1400493 B1 IT1400493 B1 IT 1400493B1
Authority
IT
Italy
Prior art keywords
positioning
precisely
positioning seat
miniaturized piece
miniaturized
Prior art date
Application number
ITMI2010A001024A
Other languages
English (en)
Inventor
Danilo Cambiaghi
Gianluigi Frigerio
Original Assignee
Mec Di Prec E G3 Di Gamba Walter & C S N C Off
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mec Di Prec E G3 Di Gamba Walter & C S N C Off filed Critical Mec Di Prec E G3 Di Gamba Walter & C S N C Off
Priority to ITMI2010A001024A priority Critical patent/IT1400493B1/it
Publication of ITMI20101024A1 publication Critical patent/ITMI20101024A1/it
Application granted granted Critical
Publication of IT1400493B1 publication Critical patent/IT1400493B1/it

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
ITMI2010A001024A 2010-06-09 2010-06-09 Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento. IT1400493B1 (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ITMI2010A001024A IT1400493B1 (it) 2010-06-09 2010-06-09 Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI2010A001024A IT1400493B1 (it) 2010-06-09 2010-06-09 Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento.

Publications (2)

Publication Number Publication Date
ITMI20101024A1 ITMI20101024A1 (it) 2011-12-10
IT1400493B1 true IT1400493B1 (it) 2013-06-11

Family

ID=43587096

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2010A001024A IT1400493B1 (it) 2010-06-09 2010-06-09 Dispositivo e metodo per il posizionamento preciso di un pezzo miniaturizzato in una sede di posizionamento.

Country Status (1)

Country Link
IT (1) IT1400493B1 (it)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3160443A (en) * 1962-10-23 1964-12-08 Western Electric Co Apparatus for pneumatically conveying articles
JPS57139937A (en) * 1981-02-23 1982-08-30 Fujitsu Ltd Alignment device for discoid body with orientation flat section
JPS5884311A (ja) * 1981-11-12 1983-05-20 Seiko Instr & Electronics Ltd 矩形板片の位置決め装置
JPS5957448A (ja) * 1982-09-27 1984-04-03 Fujitsu Ltd 半導体装置の製造機器
JPS59121226A (ja) * 1982-12-27 1984-07-13 Fujitsu Ltd エアベアリング
US4543970A (en) * 1983-02-21 1985-10-01 Tokyo Shibaura Denki Kabushiki Kaisha Automatic set-up system
US4573830A (en) * 1984-06-21 1986-03-04 International Business Machines Corporation Chip decelerator
US4676699A (en) * 1985-04-11 1987-06-30 Intel Corporation Semiconductor wafer guides
US6781684B1 (en) * 2000-11-07 2004-08-24 Donald L. Ekhoff Workpiece levitation using alternating positive and negative pressure flows
TWI222423B (en) * 2001-12-27 2004-10-21 Orbotech Ltd System and methods for conveying and transporting levitated articles
US7513716B2 (en) * 2006-03-09 2009-04-07 Seiko Epson Corporation Workpiece conveyor and method of conveying workpiece
WO2008062831A1 (fr) * 2006-11-22 2008-05-29 Sinfonia Technology Co., Ltd. Dispositif de transport par aéroflottaison et procédé de transport à l'aide de l'air
US7764076B2 (en) * 2007-02-20 2010-07-27 Centipede Systems, Inc. Method and apparatus for aligning and/or leveling a test head

Also Published As

Publication number Publication date
ITMI20101024A1 (it) 2011-12-10

Similar Documents

Publication Publication Date Title
EP2736425A4 (en) INTRAVASCULAR THROMBLEBLEKTOMY DEVICE AND METHOD THEREFOR
EP2688102A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
EP2637212A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
BR112012011910A2 (pt) dispositivo e método
EP2789420A4 (en) METHOD FOR PRODUCING A SOLID OXIDE AND DEVICE THEREFOR
EP2739235A4 (en) OPERATION SUPPORT DEVICE AND ITS ASSEMBLY METHOD
EP2688206A4 (en) PIEZOELECTRIC DEVICE AND METHOD FOR PRODUCING THE PIEZOELECTRIC DEVICE
EP2698537A4 (en) ACTUATOR SUPPORT STRUCTURE AND PUMP DEVICE
EP2540337A4 (en) MICRO NEEDLE DEVICE AND METHOD FOR PREPARING THE SAME
BR112012031232A2 (pt) método, dispositivo e uso
EP2579657A4 (en) POSITIONING DEVICE AND METHOD
KR101090782B9 (ko) 계단 겸용 수직형 리프트장치 및 그 작동방법
ITMI20121521A1 (it) Dispositivo e procedimento per il funzionamento di un veicolo
EP2790216A4 (en) SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD FOR A SEMICONDUCTOR COMPONENT
EP2637198A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
FI20105532A0 (fi) Istuinjärjestely
EP2770540A4 (en) METHOD FOR LINKING SEMICONDUCTOR ELEMENTS AND LINK STRUCTURE
BR112014011371A2 (pt) mecanismo motor e método
EP2592654A4 (en) IMAGING DEVICE AND METHOD FOR MANUFACTURING IMAGING DEVICE
EP2799323A4 (en) DEVICE FOR PROVIDING VOICE INFORMATION
EP2637213A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
EP2624451A4 (en) PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE
EP2695681A4 (en) METHOD FOR PRODUCING A DEVICE FOR GENERATING ULTRASONIC WAVES, METHOD FOR PRODUCING A DEVICE FOR PROCESSING ULTRASONIC SHAFTS, DEVICE FOR PRODUCING ULTRASONIC SHAFTS AND DEVICE FOR PROCESSING ULTRASONIC SHAFTS
BRPI1014442A2 (pt) dispensador e método
EP2750187A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE