IT1400159B1 - Metodo di fotolitografia ad elevata risoluzione per la realizzazione di nanostrutture, in particolare nella fabbricazione di dispositivi elettronici integrati - Google Patents
Metodo di fotolitografia ad elevata risoluzione per la realizzazione di nanostrutture, in particolare nella fabbricazione di dispositivi elettronici integratiInfo
- Publication number
- IT1400159B1 IT1400159B1 ITTO2010A000193A ITTO20100193A IT1400159B1 IT 1400159 B1 IT1400159 B1 IT 1400159B1 IT TO2010A000193 A ITTO2010A000193 A IT TO2010A000193A IT TO20100193 A ITTO20100193 A IT TO20100193A IT 1400159 B1 IT1400159 B1 IT 1400159B1
- Authority
- IT
- Italy
- Prior art keywords
- photolytography
- nanostructures
- resolution
- manufacture
- construction
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/093—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antistatic means, e.g. for charge depletion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/167—Coating processes; Apparatus therefor from the gas phase, by plasma deposition
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITTO2010A000193A IT1400159B1 (it) | 2010-03-15 | 2010-03-15 | Metodo di fotolitografia ad elevata risoluzione per la realizzazione di nanostrutture, in particolare nella fabbricazione di dispositivi elettronici integrati |
US13/047,320 US8715915B2 (en) | 2010-03-15 | 2011-03-14 | High-resolution photolithographic method for forming nanostructures, in particular in the manufacture of integrated electronic devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITTO2010A000193A IT1400159B1 (it) | 2010-03-15 | 2010-03-15 | Metodo di fotolitografia ad elevata risoluzione per la realizzazione di nanostrutture, in particolare nella fabbricazione di dispositivi elettronici integrati |
Publications (2)
Publication Number | Publication Date |
---|---|
ITTO20100193A1 ITTO20100193A1 (it) | 2011-09-16 |
IT1400159B1 true IT1400159B1 (it) | 2013-05-17 |
Family
ID=42829482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITTO2010A000193A IT1400159B1 (it) | 2010-03-15 | 2010-03-15 | Metodo di fotolitografia ad elevata risoluzione per la realizzazione di nanostrutture, in particolare nella fabbricazione di dispositivi elettronici integrati |
Country Status (2)
Country | Link |
---|---|
US (1) | US8715915B2 (it) |
IT (1) | IT1400159B1 (it) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014216240A1 (de) * | 2014-08-15 | 2016-02-18 | Carl Zeiss Smt Gmbh | Reflektives optisches Element |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100801820B1 (ko) * | 2002-11-19 | 2008-02-11 | 삼성전자주식회사 | 표면수식된 탄소나노튜브를 이용한 패턴 형성방법 |
US20050233263A1 (en) * | 2004-04-20 | 2005-10-20 | Applied Materials, Inc. | Growth of carbon nanotubes at low temperature |
US7990037B2 (en) * | 2005-11-28 | 2011-08-02 | Megica Corporation | Carbon nanotube circuit component structure |
JP2007156111A (ja) * | 2005-12-05 | 2007-06-21 | Fujifilm Corp | 感光性組成物、パターン形成材料、感光性積層体、及びパターン形成方法 |
WO2007116434A1 (ja) * | 2006-03-30 | 2007-10-18 | Fujitsu Limited | カーボンナノチューブの製造方法 |
KR100811266B1 (ko) * | 2006-09-01 | 2008-03-07 | 주식회사 하이닉스반도체 | 하드 마스크를 이용한 선택적 식각 방법 및 이를 이용한메모리 소자의 소자분리 형성 방법 |
US7956345B2 (en) * | 2007-01-24 | 2011-06-07 | Stmicroelectronics Asia Pacific Pte. Ltd. | CNT devices, low-temperature fabrication of CNT and CNT photo-resists |
-
2010
- 2010-03-15 IT ITTO2010A000193A patent/IT1400159B1/it active
-
2011
- 2011-03-14 US US13/047,320 patent/US8715915B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20110287363A1 (en) | 2011-11-24 |
US8715915B2 (en) | 2014-05-06 |
ITTO20100193A1 (it) | 2011-09-16 |
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