IT1397232B1 - Condensatore integrato a piatti invertiti - Google Patents

Condensatore integrato a piatti invertiti

Info

Publication number
IT1397232B1
IT1397232B1 ITMI2009A002354A ITMI20092354A IT1397232B1 IT 1397232 B1 IT1397232 B1 IT 1397232B1 IT MI2009A002354 A ITMI2009A002354 A IT MI2009A002354A IT MI20092354 A ITMI20092354 A IT MI20092354A IT 1397232 B1 IT1397232 B1 IT 1397232B1
Authority
IT
Italy
Prior art keywords
condenser integrated
dishes
inverted
inverted dishes
condenser
Prior art date
Application number
ITMI2009A002354A
Other languages
English (en)
Inventor
Alessandro Dundulachi
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITMI2009A002354A priority Critical patent/IT1397232B1/it
Priority to US12/972,613 priority patent/US8701283B2/en
Publication of ITMI20092354A1 publication Critical patent/ITMI20092354A1/it
Application granted granted Critical
Publication of IT1397232B1 publication Critical patent/IT1397232B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
    • H01L28/86—Electrodes with an enlarged surface, e.g. formed by texturisation having horizontal extensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Washing And Drying Of Tableware (AREA)
  • Table Devices Or Equipment (AREA)
ITMI2009A002354A 2009-12-30 2009-12-30 Condensatore integrato a piatti invertiti IT1397232B1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITMI2009A002354A IT1397232B1 (it) 2009-12-30 2009-12-30 Condensatore integrato a piatti invertiti
US12/972,613 US8701283B2 (en) 2009-12-30 2010-12-20 Integrated capacitor having reversed plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI2009A002354A IT1397232B1 (it) 2009-12-30 2009-12-30 Condensatore integrato a piatti invertiti

Publications (2)

Publication Number Publication Date
ITMI20092354A1 ITMI20092354A1 (it) 2011-06-30
IT1397232B1 true IT1397232B1 (it) 2013-01-04

Family

ID=42262049

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2009A002354A IT1397232B1 (it) 2009-12-30 2009-12-30 Condensatore integrato a piatti invertiti

Country Status (2)

Country Link
US (1) US8701283B2 (it)
IT (1) IT1397232B1 (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9577025B2 (en) * 2014-01-31 2017-02-21 Qualcomm Incorporated Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6441419B1 (en) * 1998-03-31 2002-08-27 Lsi Logic Corporation Encapsulated-metal vertical-interdigitated capacitor and damascene method of manufacturing same
US6281142B1 (en) * 1999-06-04 2001-08-28 Micron Technology, Inc. Dielectric cure for reducing oxygen vacancies
US20060014384A1 (en) * 2002-06-05 2006-01-19 Jong-Cheol Lee Method of forming a layer and forming a capacitor of a semiconductor device having the same layer
JP2004165559A (ja) * 2002-11-15 2004-06-10 Toshiba Corp 半導体装置
JP2005210076A (ja) * 2003-12-25 2005-08-04 Semiconductor Leading Edge Technologies Inc 窒化珪素膜の成膜方法及びこの方法を使用する半導体装置の製造方法
US7160772B2 (en) * 2005-02-23 2007-01-09 International Business Machines Corporation Structure and method for integrating MIM capacitor in BEOL wiring levels
KR100698089B1 (ko) * 2005-12-29 2007-03-23 동부일렉트로닉스 주식회사 커패시터를 갖는 반도체 소자 및 이의 제조방법
KR20080018685A (ko) * 2006-08-25 2008-02-28 삼성전자주식회사 반도체 배선 구조, 커패시터를 포함하는 반도체 소자 및 그제조방법

Also Published As

Publication number Publication date
US20110157777A1 (en) 2011-06-30
US8701283B2 (en) 2014-04-22
ITMI20092354A1 (it) 2011-06-30

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