IT1393015B1 - Dissipatore di calore per componenti elettronici di potenza - Google Patents
Dissipatore di calore per componenti elettronici di potenzaInfo
- Publication number
- IT1393015B1 IT1393015B1 ITBO2009A000069A ITBO20090069A IT1393015B1 IT 1393015 B1 IT1393015 B1 IT 1393015B1 IT BO2009A000069 A ITBO2009A000069 A IT BO2009A000069A IT BO20090069 A ITBO20090069 A IT BO20090069A IT 1393015 B1 IT1393015 B1 IT 1393015B1
- Authority
- IT
- Italy
- Prior art keywords
- heat sink
- electronic power
- power components
- components
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITBO2009A000069A IT1393015B1 (it) | 2009-02-11 | 2009-02-11 | Dissipatore di calore per componenti elettronici di potenza |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITBO2009A000069A IT1393015B1 (it) | 2009-02-11 | 2009-02-11 | Dissipatore di calore per componenti elettronici di potenza |
Publications (2)
Publication Number | Publication Date |
---|---|
ITBO20090069A1 ITBO20090069A1 (it) | 2010-08-12 |
IT1393015B1 true IT1393015B1 (it) | 2012-04-11 |
Family
ID=41354593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITBO2009A000069A IT1393015B1 (it) | 2009-02-11 | 2009-02-11 | Dissipatore di calore per componenti elettronici di potenza |
Country Status (1)
Country | Link |
---|---|
IT (1) | IT1393015B1 (it) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2332330A (en) * | 1941-12-15 | 1943-10-19 | Gen Electric | Method for joining aluminum structures |
JPH0750494A (ja) * | 1993-08-06 | 1995-02-21 | Mitsubishi Electric Corp | 冷却装置 |
US5562146A (en) * | 1995-02-24 | 1996-10-08 | Wakefield Engineering, Inc. | Method of and apparatus for forming a unitary heat sink body |
US6085830A (en) * | 1997-03-24 | 2000-07-11 | Fujikura Ltd. | Heat sink, and process and apparatus for manufacturing the same |
DE19841911A1 (de) * | 1998-09-14 | 2000-03-16 | Joachim Glueck | Kühlkörper für im wesentlichen L-förmige oder T-förmige Kühlrippen |
KR20020015261A (ko) * | 2001-03-26 | 2002-02-27 | 이종만 | 휜의 인서트 사출을 이용한 방열판 제조방법 |
US7537151B2 (en) * | 2004-01-21 | 2009-05-26 | Delphi Technologies, Inc. | Method of making high performance heat sinks |
US7286352B2 (en) * | 2005-04-15 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Thermally expanding base of heatsink to receive fins |
DE102006019376A1 (de) * | 2006-04-24 | 2007-10-25 | Bombardier Transportation Gmbh | Leistungskühler für Stromrichterbaugruppen und Stromrichter, insbesondere für Schienen- und Hybridfahrzeuge |
-
2009
- 2009-02-11 IT ITBO2009A000069A patent/IT1393015B1/it active
Also Published As
Publication number | Publication date |
---|---|
ITBO20090069A1 (it) | 2010-08-12 |
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