IT1393015B1 - Dissipatore di calore per componenti elettronici di potenza - Google Patents

Dissipatore di calore per componenti elettronici di potenza

Info

Publication number
IT1393015B1
IT1393015B1 ITBO2009A000069A ITBO20090069A IT1393015B1 IT 1393015 B1 IT1393015 B1 IT 1393015B1 IT BO2009A000069 A ITBO2009A000069 A IT BO2009A000069A IT BO20090069 A ITBO20090069 A IT BO20090069A IT 1393015 B1 IT1393015 B1 IT 1393015B1
Authority
IT
Italy
Prior art keywords
heat sink
electronic power
power components
components
electronic
Prior art date
Application number
ITBO2009A000069A
Other languages
English (en)
Inventor
Leonardo Busi
Original Assignee
Elenos S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elenos S R L filed Critical Elenos S R L
Priority to ITBO2009A000069A priority Critical patent/IT1393015B1/it
Publication of ITBO20090069A1 publication Critical patent/ITBO20090069A1/it
Application granted granted Critical
Publication of IT1393015B1 publication Critical patent/IT1393015B1/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
ITBO2009A000069A 2009-02-11 2009-02-11 Dissipatore di calore per componenti elettronici di potenza IT1393015B1 (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ITBO2009A000069A IT1393015B1 (it) 2009-02-11 2009-02-11 Dissipatore di calore per componenti elettronici di potenza

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITBO2009A000069A IT1393015B1 (it) 2009-02-11 2009-02-11 Dissipatore di calore per componenti elettronici di potenza

Publications (2)

Publication Number Publication Date
ITBO20090069A1 ITBO20090069A1 (it) 2010-08-12
IT1393015B1 true IT1393015B1 (it) 2012-04-11

Family

ID=41354593

Family Applications (1)

Application Number Title Priority Date Filing Date
ITBO2009A000069A IT1393015B1 (it) 2009-02-11 2009-02-11 Dissipatore di calore per componenti elettronici di potenza

Country Status (1)

Country Link
IT (1) IT1393015B1 (it)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2332330A (en) * 1941-12-15 1943-10-19 Gen Electric Method for joining aluminum structures
JPH0750494A (ja) * 1993-08-06 1995-02-21 Mitsubishi Electric Corp 冷却装置
US5562146A (en) * 1995-02-24 1996-10-08 Wakefield Engineering, Inc. Method of and apparatus for forming a unitary heat sink body
US6085830A (en) * 1997-03-24 2000-07-11 Fujikura Ltd. Heat sink, and process and apparatus for manufacturing the same
DE19841911A1 (de) * 1998-09-14 2000-03-16 Joachim Glueck Kühlkörper für im wesentlichen L-förmige oder T-förmige Kühlrippen
KR20020015261A (ko) * 2001-03-26 2002-02-27 이종만 휜의 인서트 사출을 이용한 방열판 제조방법
US7537151B2 (en) * 2004-01-21 2009-05-26 Delphi Technologies, Inc. Method of making high performance heat sinks
US7286352B2 (en) * 2005-04-15 2007-10-23 Hewlett-Packard Development Company, L.P. Thermally expanding base of heatsink to receive fins
DE102006019376A1 (de) * 2006-04-24 2007-10-25 Bombardier Transportation Gmbh Leistungskühler für Stromrichterbaugruppen und Stromrichter, insbesondere für Schienen- und Hybridfahrzeuge

Also Published As

Publication number Publication date
ITBO20090069A1 (it) 2010-08-12

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