IT1272243B - Procedimento e dispositivo per la frantumazione di materiale semiconduttore - Google Patents

Procedimento e dispositivo per la frantumazione di materiale semiconduttore

Info

Publication number
IT1272243B
IT1272243B ITRM940285A ITRM940285A IT1272243B IT 1272243 B IT1272243 B IT 1272243B IT RM940285 A ITRM940285 A IT RM940285A IT RM940285 A ITRM940285 A IT RM940285A IT 1272243 B IT1272243 B IT 1272243B
Authority
IT
Italy
Prior art keywords
crushing
procedure
semiconductive material
semiconductive
Prior art date
Application number
ITRM940285A
Other languages
English (en)
Inventor
Franz Koppl
Matthaus Schantz
Original Assignee
Franz Koppl
Matthaus Schantz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Franz Koppl, Matthaus Schantz filed Critical Franz Koppl
Publication of ITRM940285A0 publication Critical patent/ITRM940285A0/it
Publication of ITRM940285A1 publication Critical patent/ITRM940285A1/it
Application granted granted Critical
Publication of IT1272243B publication Critical patent/IT1272243B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C19/00—Other disintegrating devices or methods
    • B02C19/06—Jet mills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C19/00—Other disintegrating devices or methods
    • B02C19/0056—Other disintegrating devices or methods specially adapted for specific materials not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Food Science & Technology (AREA)
  • Disintegrating Or Milling (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
ITRM940285A 1993-05-18 1994-05-06 Procedimento e dispositivo per la frantumazione di materiale semiconduttore IT1272243B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4316626A DE4316626A1 (de) 1993-05-18 1993-05-18 Verfahren und Vorrichtung zur Zerkleinerung von Halbleitermaterial

Publications (3)

Publication Number Publication Date
ITRM940285A0 ITRM940285A0 (it) 1994-05-06
ITRM940285A1 ITRM940285A1 (it) 1995-11-06
IT1272243B true IT1272243B (it) 1997-06-16

Family

ID=6488391

Family Applications (1)

Application Number Title Priority Date Filing Date
ITRM940285A IT1272243B (it) 1993-05-18 1994-05-06 Procedimento e dispositivo per la frantumazione di materiale semiconduttore

Country Status (6)

Country Link
US (1) US5660335A (it)
JP (1) JPH078828A (it)
KR (1) KR0137336B1 (it)
CN (1) CN1033952C (it)
DE (1) DE4316626A1 (it)
IT (1) IT1272243B (it)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19618974A1 (de) * 1996-05-10 1997-11-13 Wacker Chemie Gmbh Verfahren zur Behandlung von Halbleitermaterial
US6129779A (en) * 1997-05-13 2000-10-10 First Solar, Llc Reclaiming metallic material from an article comprising a non-metallic friable substrate
DE19847100A1 (de) * 1998-10-13 2000-04-20 Wacker Chemie Gmbh Verfahren und Vorrichtung zur Zerkleinerung von Halbleitermaterial
DE19847098A1 (de) * 1998-10-13 2000-04-20 Wacker Chemie Gmbh Verfahren und Vorrichtung zur Bearbeitung von Halbleitermaterial
DE19849939A1 (de) * 1998-10-29 2000-05-11 Wacker Chemie Gmbh Verfahren und Vorrichtung zur Zerkleinerung von stabförmigem Halbleitermaterial
US20020054995A1 (en) * 1999-10-06 2002-05-09 Marian Mazurkiewicz Graphite platelet nanostructures
US6318649B1 (en) 1999-10-06 2001-11-20 Cornerstone Technologies, Llc Method of creating ultra-fine particles of materials using a high-pressure mill
US8021483B2 (en) * 2002-02-20 2011-09-20 Hemlock Semiconductor Corporation Flowable chips and methods for the preparation and use of same, and apparatus for use in the methods
US6874713B2 (en) 2002-08-22 2005-04-05 Dow Corning Corporation Method and apparatus for improving silicon processing efficiency
DE102004048948A1 (de) 2004-10-07 2006-04-20 Wacker Chemie Ag Vorrichtung und Verfahren zum kontaminationsarmen, automatischen Brechen von Siliciumbruch
DE102005019873B4 (de) 2005-04-28 2017-05-18 Wacker Chemie Ag Vorrichtung und Verfahren zum maschinellen Zerkleinern von Halbleitermaterialien
US8490901B2 (en) 2009-07-28 2013-07-23 Mitsubishi Materials Corporation Method of generating cracks in polycrystalline silicon rod and crack generating apparatus
CN102576749B (zh) * 2009-10-23 2015-03-25 松下电器产业株式会社 硅粉末的制造方法、多晶型太阳能电池板以及其制造方法
DE102012213565A1 (de) 2012-08-01 2014-02-06 Wacker Chemie Ag Vorrichtung und Verfahren zum Zerkleinern eines polykristallinen Siliciumstabs
CN108825175B (zh) * 2018-05-15 2020-06-16 西南石油大学 一种天然气水合物固态流化采掘破碎实验装置及实验方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3595486A (en) * 1969-11-24 1971-07-27 Fluid Energy Process Equip Treatment of granular solids by fluid energy mills
US3881660A (en) * 1973-09-13 1975-05-06 United States Steel Corp Mineral beneficiation by decompression scalping
US4323198A (en) * 1979-08-28 1982-04-06 The United States Of America As Represented By The United States Department Of Energy Method for fracturing silicon-carbide coatings on nuclear-fuel particles
US4723715A (en) * 1984-05-30 1988-02-09 The Curators Of The University Of Missouri Disintegration of wood
DE3811091A1 (de) * 1988-03-31 1989-10-12 Heliotronic Gmbh Verfahren zum kontaminationsarmen zerkleinern von massivem stueckigem silicium
US4986479A (en) * 1989-08-14 1991-01-22 Ingersoll-Rand Company Fluid jet shredder apparatus and method of use
US5123599A (en) * 1991-03-11 1992-06-23 Mardigian Henry C Apparatus and process for reclaiming wood from debris
KR940006017B1 (ko) * 1992-03-19 1994-07-02 재단법인 한국화학연구소 실리콘 입자의 제트분쇄방법
JPH06271309A (ja) * 1993-03-22 1994-09-27 Sumitomo Sitix Corp 多結晶シリコンの破砕方法

Also Published As

Publication number Publication date
KR940027044A (ko) 1994-12-10
ITRM940285A1 (it) 1995-11-06
ITRM940285A0 (it) 1994-05-06
JPH078828A (ja) 1995-01-13
CN1100671A (zh) 1995-03-29
US5660335A (en) 1997-08-26
KR0137336B1 (ko) 1998-04-25
CN1033952C (zh) 1997-02-05
DE4316626A1 (de) 1994-11-24

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970528