IT1243969B - Supporto di fotorivelatore e modulo di fotorivelatore avente tale supporto. - Google Patents
Supporto di fotorivelatore e modulo di fotorivelatore avente tale supporto.Info
- Publication number
- IT1243969B IT1243969B IT02228990A IT2228990A IT1243969B IT 1243969 B IT1243969 B IT 1243969B IT 02228990 A IT02228990 A IT 02228990A IT 2228990 A IT2228990 A IT 2228990A IT 1243969 B IT1243969 B IT 1243969B
- Authority
- IT
- Italy
- Prior art keywords
- photodetector
- support
- photo detector
- carrier
- module
- Prior art date
Links
- 239000002184 metal Substances 0.000 abstract 2
- 238000005219 brazing Methods 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000013307 optical fiber Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1317583A JP2503282B2 (ja) | 1989-12-08 | 1989-12-08 | 受光素子キャリア及び該キャリアを有する受光モジュ―ル |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| IT9022289A0 IT9022289A0 (it) | 1990-12-04 |
| IT9022289A1 IT9022289A1 (it) | 1991-06-09 |
| IT1243969B true IT1243969B (it) | 1994-06-28 |
Family
ID=18089857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT02228990A IT1243969B (it) | 1989-12-08 | 1990-12-04 | Supporto di fotorivelatore e modulo di fotorivelatore avente tale supporto. |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5200612A (it) |
| JP (1) | JP2503282B2 (it) |
| IT (1) | IT1243969B (it) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003134051A (ja) * | 2001-10-25 | 2003-05-09 | Opnext Japan Inc | 光受信モジュール、光受信器及び光ファイバ通信機器 |
| JP4166471B2 (ja) * | 2001-12-28 | 2008-10-15 | 三菱電機株式会社 | 光モジュール |
| KR100506216B1 (ko) * | 2003-06-11 | 2005-08-05 | 삼성전자주식회사 | 방향성 결합기를 구비하는 광도파로 소자 |
| DE102012201935A1 (de) * | 2012-02-09 | 2013-08-14 | Robert Bosch Gmbh | Verbindungsanordnung eines elektrischen und/oder elektronischen Bauelements |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3908185A (en) * | 1974-03-06 | 1975-09-23 | Rca Corp | High frequency semiconductor device having improved metallized patterns |
| US3996603A (en) * | 1974-10-18 | 1976-12-07 | Motorola, Inc. | RF power semiconductor package and method of manufacture |
| US4259684A (en) * | 1978-10-13 | 1981-03-31 | The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland | Packages for microwave integrated circuits |
| GB8508280D0 (en) * | 1985-03-29 | 1985-05-09 | British Telecomm | Optical component mounting |
-
1989
- 1989-12-08 JP JP1317583A patent/JP2503282B2/ja not_active Expired - Lifetime
-
1990
- 1990-12-03 US US07/620,830 patent/US5200612A/en not_active Expired - Fee Related
- 1990-12-04 IT IT02228990A patent/IT1243969B/it active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| US5200612A (en) | 1993-04-06 |
| JP2503282B2 (ja) | 1996-06-05 |
| IT9022289A1 (it) | 1991-06-09 |
| JPH03179307A (ja) | 1991-08-05 |
| IT9022289A0 (it) | 1990-12-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 0001 | Granted | ||
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19960626 |