IT1223044B - Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto - Google Patents

Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto

Info

Publication number
IT1223044B
IT1223044B IT22491/87A IT2249187A IT1223044B IT 1223044 B IT1223044 B IT 1223044B IT 22491/87 A IT22491/87 A IT 22491/87A IT 2249187 A IT2249187 A IT 2249187A IT 1223044 B IT1223044 B IT 1223044B
Authority
IT
Italy
Prior art keywords
welding
procedure
support element
semiconductor component
semiconductor
Prior art date
Application number
IT22491/87A
Other languages
English (en)
Other versions
IT8722491A0 (it
Inventor
Francesco Blandano
Original Assignee
Italtel Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Italtel Spa filed Critical Italtel Spa
Priority to IT22491/87A priority Critical patent/IT1223044B/it
Publication of IT8722491A0 publication Critical patent/IT8722491A0/it
Priority to EP88202277A priority patent/EP0316026A1/en
Application granted granted Critical
Publication of IT1223044B publication Critical patent/IT1223044B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
IT22491/87A 1987-11-03 1987-11-03 Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto IT1223044B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT22491/87A IT1223044B (it) 1987-11-03 1987-11-03 Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto
EP88202277A EP0316026A1 (en) 1987-11-03 1988-10-12 Procedure for soldering a semiconductor component (chip) to a supporting unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT22491/87A IT1223044B (it) 1987-11-03 1987-11-03 Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto

Publications (2)

Publication Number Publication Date
IT8722491A0 IT8722491A0 (it) 1987-11-03
IT1223044B true IT1223044B (it) 1990-09-12

Family

ID=11196985

Family Applications (1)

Application Number Title Priority Date Filing Date
IT22491/87A IT1223044B (it) 1987-11-03 1987-11-03 Procedimento per la saldatura di un componente a semiconduttore ad un elemento di supporto

Country Status (2)

Country Link
EP (1) EP0316026A1 (it)
IT (1) IT1223044B (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2325080A (en) * 1997-05-07 1998-11-11 Mitel Semiconductor Ab Mountings for semiconductor light emitting devices
RU2636034C1 (ru) * 2016-05-25 2017-11-20 Акционерное общество "Научно-производственное предприятие "Пульсар" Способ пайки кристаллов дискретных полупроводниковых приборов к корпусу
RU2688037C1 (ru) * 2018-07-11 2019-05-17 Акционерное общество "Научно-производственное предприятие "Пульсар" Способ сборки гибридной фотоэлектрической схемы при непараллельном монтаже элементов

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1331980A (en) * 1970-12-15 1973-09-26 Mullard Ltd Mounting semiconductor bodies
GB2137131B (en) * 1983-03-15 1986-06-25 Standard Telephones Cables Ltd Bonding semiconductive bodies

Also Published As

Publication number Publication date
EP0316026A1 (en) 1989-05-17
IT8722491A0 (it) 1987-11-03

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19951116