IT1207288B - Electronic component handling mechanism - Google Patents
Electronic component handling mechanismInfo
- Publication number
- IT1207288B IT1207288B IT8519632A IT1963285A IT1207288B IT 1207288 B IT1207288 B IT 1207288B IT 8519632 A IT8519632 A IT 8519632A IT 1963285 A IT1963285 A IT 1963285A IT 1207288 B IT1207288 B IT 1207288B
- Authority
- IT
- Italy
- Prior art keywords
- substrate
- rest position
- working position
- duct
- mounting
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 4
- 230000008018 melting Effects 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The mechanism mounts or removes, electric components onto or from a substrate. The mounting and/or removed members comprise a heater with at least one duct for a flow medium. The heated medium is supplied from the duct to the substrate terminals for melting a solder layer etc., coating the terminal points. The mounting and/or removal members are driven between a first, working position and a second, rest position. In the working position they assist the solder melting. The rest position is spaced from the substrate. Both positions lie in a vertical plane, orthagonal to the substrate. The drive moves the washing members vertically for working position approach and retraction, while moving them horizontally near the rest position.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/583,218 US4605152A (en) | 1984-02-24 | 1984-02-24 | Device for attaching modular electronic components to or removing them from an insulative substrate |
US06/595,606 US4620659A (en) | 1984-04-02 | 1984-04-02 | Device for attaching modular electronic components to or removing them from an insulative substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8519632A0 IT8519632A0 (en) | 1985-02-22 |
IT1207288B true IT1207288B (en) | 1989-05-17 |
Family
ID=27078756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8519632A IT1207288B (en) | 1984-02-24 | 1985-02-22 | Electronic component handling mechanism |
Country Status (1)
Country | Link |
---|---|
IT (1) | IT1207288B (en) |
-
1985
- 1985-02-22 IT IT8519632A patent/IT1207288B/en active
Also Published As
Publication number | Publication date |
---|---|
IT8519632A0 (en) | 1985-02-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4270260A (en) | Method for the salvage and restoration of integrated circuits from a substrate | |
EP0193321A2 (en) | Mass soldering system | |
EP0804990B1 (en) | Method of mounting circuit components on a flexible substrate | |
DE3267420D1 (en) | Method of and device for positioning electrical and or electronic components on a substrate | |
JPS6413735A (en) | Method of mounting semiconductor device and mounted semiconductor device | |
CA1263896A (en) | Wave solder finger shield apparatus | |
DE69103807D1 (en) | Process for soldering metallized components to ceramic substrates. | |
GB1355292A (en) | Method of and device for mounting electric components on a mounting panel | |
DE3781596T2 (en) | METHOD FOR MOUNTING REFINED CONTACT SURFACES ON A SUBSTRATE AND SUBSTRATE PROVIDED WITH THESE CONTACT SURFACES. | |
US3053215A (en) | Apparatus for soldering printed sheets | |
US4774106A (en) | Method of applying particulate material to objects by using a liquid | |
US3616984A (en) | Automatic soldering machine having circuit board protection member | |
DE3868112D1 (en) | BASIC FOR CARRYING ELECTRIC RAILS AND / OR COMPONENTS. | |
IT1207288B (en) | Electronic component handling mechanism | |
IT8648143A0 (en) | HEATING COIL ASSEMBLY FOR ELECTRONIC COMPONENT SOLDERING/DESOLDERING DEVICES | |
GB8331348D0 (en) | Machine for placing electronic components on substrate | |
EP0568087B1 (en) | Reflow mounting of electronic component on mounting board | |
JPS5753948A (en) | Mounting method of semiconductor element | |
JP2509373B2 (en) | Reflow soldering method and device for printed circuit board | |
EP0214030A3 (en) | Surface mount technology automated repair system | |
KR910003702B1 (en) | Automatic soldering apparatus | |
JPS6024266A (en) | Method and device for automatic soldering | |
JPH0237492Y2 (en) | ||
JPS62203669A (en) | Reflow device for printed circuit board loading chip parts | |
JPS63204696A (en) | Method of mounting component on flexible printed circuit with solder |