IT1197581B - Nastro adesivo elettricamente conduttore - Google Patents

Nastro adesivo elettricamente conduttore

Info

Publication number
IT1197581B
IT1197581B IT8347758A IT4775883A IT1197581B IT 1197581 B IT1197581 B IT 1197581B IT 8347758 A IT8347758 A IT 8347758A IT 4775883 A IT4775883 A IT 4775883A IT 1197581 B IT1197581 B IT 1197581B
Authority
IT
Italy
Prior art keywords
electrically conductive
adhesive tape
conductive adhesive
tape
electrically
Prior art date
Application number
IT8347758A
Other languages
English (en)
Other versions
IT8347758A0 (it
Inventor
Toshiharu Konishi
Yutaka Hori
Zenzo Honda
Yukio Shimizu
Hideyuki Okada
Original Assignee
Nitto Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Ind Co filed Critical Nitto Electric Ind Co
Publication of IT8347758A0 publication Critical patent/IT8347758A0/it
Application granted granted Critical
Publication of IT1197581B publication Critical patent/IT1197581B/it

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28Metal sheet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02Single bars, rods, wires, or strips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/08Flat or ribbon cables
    • H01B7/0815Flat or ribbon cables covered with gluten for wall-fixing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/04Punching, slitting or perforating
    • B32B2038/042Punching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00Adhesive articles, e.g. adhesive tapes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1028Thin metal strips as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/906Roll or coil
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322Composite web or sheet
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322Composite web or sheet
    • Y10T428/24331Composite web or sheet including nonapertured component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628Nonplanar uniform thickness material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804Next to metal
IT8347758A 1982-02-24 1983-02-22 Nastro adesivo elettricamente conduttore IT1197581B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982025940U JPS58128509U (ja) 1982-02-24 1982-02-24 導電性接着テ−プ又はシ−ト

Publications (2)

Publication Number Publication Date
IT8347758A0 IT8347758A0 (it) 1983-02-22
IT1197581B true IT1197581B (it) 1988-12-06

Family

ID=12179748

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8347758A IT1197581B (it) 1982-02-24 1983-02-22 Nastro adesivo elettricamente conduttore

Country Status (8)

Country Link
US (1) US4456652A (it)
JP (1) JPS58128509U (it)
BE (1) BE895975A (it)
DE (1) DE3306493C2 (it)
FR (1) FR2522186B1 (it)
GB (1) GB2118863B (it)
IT (1) IT1197581B (it)
SE (1) SE460236B (it)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4769269A (en) * 1983-12-05 1988-09-06 E. I. Du Pont De Nemours And Company Article containing conductive through-holes
JPH0339860Y2 (it) * 1984-12-05 1991-08-22
US4859813A (en) * 1987-09-04 1989-08-22 Calcomp Inc. Digitizer tablet having electrical interconnect components on the writing substrate
US5008490A (en) * 1990-01-19 1991-04-16 Thomas & Betts Corporation Strippable electrically shielded cable
US5665473A (en) * 1994-09-16 1997-09-09 Tokuyama Corporation Package for mounting a semiconductor device
DE19740722B4 (de) * 1997-09-16 2008-02-07 CCS Technology, Inc., Wilmington Elektrisches Kabel mit einem überlappten Außenleiter
TW442554B (en) * 1999-04-05 2001-06-23 Four Pillars Entpr Co Ltd Multi-functional electrically and thermally conductive adhesive tape
JP2006140052A (ja) * 2004-11-12 2006-06-01 Three M Innovative Properties Co 熱硬化性接着フィルム付きコネクタ及びそれを用いた接続方法
DE102006026688A1 (de) * 2006-06-08 2007-12-13 Trw Automotive Gmbh Fahrzeuginsassen-Schutzvorrichtung mit einer elektrisch betriebenen Einrichtung und Gasgenerator für eine Fahrzeuginsassen-Schutzvorrichtung
US20110214735A1 (en) 2008-11-07 2011-09-08 3M Innovative Properities Company Conductive laminated assembly
JP2010278119A (ja) * 2009-05-27 2010-12-09 Dainippon Printing Co Ltd 電磁波遮蔽材
JP5248460B2 (ja) * 2009-10-22 2013-07-31 日東電工株式会社 導電性粘着テープ
JP2011153190A (ja) 2010-01-26 2011-08-11 Nitto Denko Corp 導電性粘着テープ
EP2543709A1 (en) * 2010-03-03 2013-01-09 Nitto Denko Corporation Electrically conductive adhesive tape
JP5581163B2 (ja) * 2010-09-30 2014-08-27 日東電工株式会社 ワイヤレス電力伝送用電磁波シールドシート
JP5952078B2 (ja) * 2011-06-23 2016-07-13 日東電工株式会社 導電性熱硬化型接着テープ
JP2013049764A (ja) * 2011-08-30 2013-03-14 Nitto Denko Corp 導電性粘着テープ
WO2013031499A1 (ja) * 2011-08-30 2013-03-07 日東電工株式会社 導電性粘着テープ
JP2013049763A (ja) * 2011-08-30 2013-03-14 Nitto Denko Corp 導電性粘着テープ
DE102015107032A1 (de) * 2015-05-06 2016-11-10 Ccl Design Gmbh Verfahren zur Herstellung eines Stanzbauteils

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2852423A (en) * 1955-03-18 1958-09-16 Bassett Res Corp Shielding adhesive tape
US3311696A (en) * 1965-06-18 1967-03-28 Donald A Melnick Electrically and thermally conductive shield
US3497383A (en) * 1967-08-22 1970-02-24 Minnesota Mining & Mfg Electrically conductive adhesive tape

Also Published As

Publication number Publication date
SE8301003D0 (sv) 1983-02-23
FR2522186B1 (fr) 1987-08-07
US4456652A (en) 1984-06-26
JPS6346980Y2 (it) 1988-12-05
SE460236B (sv) 1989-09-18
SE8301003L (sv) 1983-08-25
IT8347758A0 (it) 1983-02-22
GB8305170D0 (en) 1983-03-30
GB2118863B (en) 1985-06-19
FR2522186A1 (fr) 1983-08-26
JPS58128509U (ja) 1983-08-31
DE3306493A1 (de) 1983-09-01
GB2118863A (en) 1983-11-09
BE895975A (fr) 1983-06-16
DE3306493C2 (de) 1985-03-21

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