IT1170271B - Metodo per predeterminare la resistenza allo spelamento all'interfaccia tra rame e alluminio - Google Patents
Metodo per predeterminare la resistenza allo spelamento all'interfaccia tra rame e alluminioInfo
- Publication number
- IT1170271B IT1170271B IT24327/83A IT2432783A IT1170271B IT 1170271 B IT1170271 B IT 1170271B IT 24327/83 A IT24327/83 A IT 24327/83A IT 2432783 A IT2432783 A IT 2432783A IT 1170271 B IT1170271 B IT 1170271B
- Authority
- IT
- Italy
- Prior art keywords
- predeting
- copper
- aluminum
- interface
- strength resistance
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5893—Mixing of deposited material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/459,748 US4427716A (en) | 1983-01-21 | 1983-01-21 | Method for predetermining peel strength at copper/aluminum interface |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8324327A0 IT8324327A0 (it) | 1983-12-22 |
IT1170271B true IT1170271B (it) | 1987-06-03 |
Family
ID=23825998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT24327/83A IT1170271B (it) | 1983-01-21 | 1983-12-22 | Metodo per predeterminare la resistenza allo spelamento all'interfaccia tra rame e alluminio |
Country Status (6)
Country | Link |
---|---|
US (1) | US4427716A (it) |
JP (1) | JPS59150680A (it) |
DE (1) | DE3400879A1 (it) |
FR (1) | FR2542669B1 (it) |
GB (1) | GB2133808B (it) |
IT (1) | IT1170271B (it) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6110443A (ja) * | 1984-06-25 | 1986-01-17 | コニカ株式会社 | 導電性積層体 |
US4678692A (en) * | 1985-04-29 | 1987-07-07 | Julian Porter | Multilayer protection system |
DE3711403A1 (de) * | 1987-04-04 | 1988-10-20 | Bayer Ag | Verfahren zur herstellung gedruckter schaltungen |
JPH0259337A (ja) * | 1988-08-25 | 1990-02-28 | Mitsubishi Gas Chem Co Inc | 簿銅箔張回路基板の製造法 |
US4934580A (en) * | 1988-12-27 | 1990-06-19 | Barnes Group, Inc. | Method of making superplastically formed and diffusion bonded articles and the articles so made |
US5139887A (en) * | 1988-12-27 | 1992-08-18 | Barnes Group, Inc. | Superplastically formed cellular article |
JPH0757540B2 (ja) * | 1989-02-17 | 1995-06-21 | チッソ株式会社 | フレキシブルプリント基板の製造法 |
DE102008027916B3 (de) * | 2008-06-12 | 2009-08-06 | Benteler Automobiltechnik Gmbh | Verfahren zum Aufbringen einer festhaftenden metallischen Beschichtung auf ein Stahlblechprodukt |
WO2013023101A1 (en) * | 2011-08-10 | 2013-02-14 | Cac, Inc. | Multiple layer z-axis interconnect apparatus and method of use |
JP5403129B2 (ja) * | 2012-03-30 | 2014-01-29 | 三菱マテリアル株式会社 | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、及びパワーモジュール用基板の製造方法 |
JP6273992B2 (ja) * | 2014-04-18 | 2018-02-07 | 株式会社村田製作所 | 金属積層体、金属積層体の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3984598A (en) | 1974-02-08 | 1976-10-05 | Universal Oil Products Company | Metal-clad laminates |
JPS5165039A (ja) * | 1974-12-03 | 1976-06-05 | Seiko Instr & Electronics | Metsukihoho |
US3969199A (en) | 1975-07-07 | 1976-07-13 | Gould Inc. | Coating aluminum with a strippable copper deposit |
US4028684A (en) * | 1975-10-16 | 1977-06-07 | Bell Telephone Laboratories, Incorporated | Memory patching circuit with repatching capability |
US4357395A (en) | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
US4383003A (en) * | 1980-09-22 | 1983-05-10 | General Electric Company | Transfer lamination of copper thin sheets and films, method and product |
GB2091634B (en) * | 1981-01-22 | 1984-12-05 | Gen Electric | Transfer lamination of vapour deposited copper thin sheets and films |
-
1983
- 1983-01-21 US US06/459,748 patent/US4427716A/en not_active Expired - Fee Related
- 1983-08-19 GB GB08322371A patent/GB2133808B/en not_active Expired
- 1983-12-22 IT IT24327/83A patent/IT1170271B/it active
-
1984
- 1984-01-10 FR FR8400256A patent/FR2542669B1/fr not_active Expired
- 1984-01-12 DE DE19843400879 patent/DE3400879A1/de not_active Ceased
- 1984-01-19 JP JP59007904A patent/JPS59150680A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2542669A1 (fr) | 1984-09-21 |
GB2133808A (en) | 1984-08-01 |
IT8324327A0 (it) | 1983-12-22 |
GB8322371D0 (en) | 1983-09-21 |
JPS59150680A (ja) | 1984-08-28 |
FR2542669B1 (fr) | 1988-12-02 |
GB2133808B (en) | 1986-04-30 |
US4427716A (en) | 1984-01-24 |
DE3400879A1 (de) | 1984-07-26 |
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