IT1169243B - Composizione e procedimento per rimouvere metallo - Google Patents
Composizione e procedimento per rimouvere metalloInfo
- Publication number
- IT1169243B IT1169243B IT21191/81A IT2119181A IT1169243B IT 1169243 B IT1169243 B IT 1169243B IT 21191/81 A IT21191/81 A IT 21191/81A IT 2119181 A IT2119181 A IT 2119181A IT 1169243 B IT1169243 B IT 1169243B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- composition
- remove metal
- remove
- metal
- Prior art date
Links
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Detergent Compositions (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/141,013 US4297257A (en) | 1980-04-17 | 1980-04-17 | Metal stripping composition and method |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8121191A0 IT8121191A0 (it) | 1981-04-15 |
IT1169243B true IT1169243B (it) | 1987-05-27 |
Family
ID=22493763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT21191/81A IT1169243B (it) | 1980-04-17 | 1981-04-15 | Composizione e procedimento per rimouvere metallo |
Country Status (12)
Country | Link |
---|---|
US (1) | US4297257A (it) |
JP (1) | JPS56158875A (it) |
KR (1) | KR880001457B1 (it) |
CA (1) | CA1130181A (it) |
CH (1) | CH660029A5 (it) |
DE (1) | DE3115323A1 (it) |
FR (1) | FR2480793A1 (it) |
GB (1) | GB2074103B (it) |
IT (1) | IT1169243B (it) |
MX (1) | MX154651A (it) |
MY (1) | MY8600343A (it) |
NL (1) | NL8101830A (it) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57164984A (en) * | 1981-04-06 | 1982-10-09 | Metsuku Kk | Exfoliating solution for tin or tin alloy |
USRE32555E (en) * | 1982-09-20 | 1987-12-08 | Circuit Chemistry Corporation | Solder stripping solution |
US4397753A (en) * | 1982-09-20 | 1983-08-09 | Circuit Chemistry Corporation | Solder stripping solution |
CA1221896A (en) * | 1983-06-06 | 1987-05-19 | Norvell J. Nelson | Aqueous process for etching copper and other metals |
US4632727A (en) * | 1985-08-12 | 1986-12-30 | Psi Star | Copper etching process and solution |
JPS62218585A (ja) * | 1985-10-31 | 1987-09-25 | Hoya Corp | フオトマスクの製造方法 |
US4713144A (en) * | 1986-08-01 | 1987-12-15 | Ardrox Inc. | Composition and method for stripping films from printed circuit boards |
DE3738307A1 (de) * | 1987-11-11 | 1989-05-24 | Ruwel Werke Gmbh | Badloesungen und verfahren zum entfernen von blei/zinn-, blei- bzw. zinnschichten auf kupfer- oder nickeloberflaechen |
US4957653A (en) * | 1989-04-07 | 1990-09-18 | Macdermid, Incorporated | Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy |
US4944851A (en) * | 1989-06-05 | 1990-07-31 | Macdermid, Incorporated | Electrolytic method for regenerating tin or tin-lead alloy stripping compositions |
US4921571A (en) * | 1989-07-28 | 1990-05-01 | Macdermid, Incorporated | Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces |
US5017267A (en) * | 1990-07-17 | 1991-05-21 | Macdermid, Incorporated | Composition and method for stripping tin or tin-lead alloy from copper surfaces |
US5741432A (en) * | 1995-01-17 | 1998-04-21 | The Dexter Corporation | Stabilized nitric acid compositions |
US5663474A (en) * | 1996-03-07 | 1997-09-02 | Alliedsignal Inc. | Alkylation process using hydrogen fluoride-containing alkylation catalysts |
US5705717A (en) * | 1996-03-07 | 1998-01-06 | Alliedsignal Inc. | Fluorination process using hydrogen fluoride-containing fluorinating agents |
US6177058B1 (en) | 1996-03-07 | 2001-01-23 | Alliedsignal Inc. | Hydrogen fluoride compositions |
US5632966A (en) * | 1996-03-07 | 1997-05-27 | Alliedsignal Inc. | Process for hydrogen fluoride separation |
US6238743B1 (en) * | 2000-01-20 | 2001-05-29 | General Electric Company | Method of removing a thermal barrier coating |
US6960370B2 (en) | 2003-03-27 | 2005-11-01 | Scimed Life Systems, Inc. | Methods of forming medical devices |
CN109652806B (zh) * | 2019-01-29 | 2020-12-25 | 鹤壁市正华有色金属有限公司 | 一种以紫铜或黄铜为基材的亮锡汽车零部件的退镀液和退镀工艺 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1133382A (en) * | 1965-06-17 | 1968-11-13 | W E Zimmie A G | Method of preventing corrosion in water systems |
US3898037A (en) * | 1972-06-01 | 1975-08-05 | Betz Laboratories | Acrylamido-sulfonic acid polymers and their use |
US3888778A (en) * | 1973-03-13 | 1975-06-10 | Merton Beckwith | Bright dip composition for tin/lead |
US3926699A (en) * | 1974-06-17 | 1975-12-16 | Rbp Chemical Corp | Method of preparing printed circuit boards with terminal tabs |
US4004956A (en) * | 1974-08-14 | 1977-01-25 | Enthone, Incorporated | Selectively stripping tin or tin-lead alloys from copper substrates |
US3990982A (en) * | 1974-12-18 | 1976-11-09 | Rbp Chemical Corporation | Composition for stripping lead-tin solder |
US4009299A (en) * | 1975-10-22 | 1977-02-22 | Motorola, Inc. | Tin strip formulation for metal to glass seal diodes |
-
1980
- 1980-04-17 US US06/141,013 patent/US4297257A/en not_active Expired - Lifetime
-
1981
- 1981-02-27 CA CA371,880A patent/CA1130181A/en not_active Expired
- 1981-03-17 GB GB8108302A patent/GB2074103B/en not_active Expired
- 1981-03-25 FR FR8105971A patent/FR2480793A1/fr active Granted
- 1981-03-30 MX MX186595A patent/MX154651A/es unknown
- 1981-04-03 CH CH2289/81A patent/CH660029A5/de not_active IP Right Cessation
- 1981-04-07 JP JP5129181A patent/JPS56158875A/ja active Granted
- 1981-04-13 KR KR1019810001248A patent/KR880001457B1/ko active
- 1981-04-14 NL NL8101830A patent/NL8101830A/nl not_active Application Discontinuation
- 1981-04-15 IT IT21191/81A patent/IT1169243B/it active
- 1981-04-15 DE DE19813115323 patent/DE3115323A1/de active Granted
-
1986
- 1986-12-30 MY MY343/86A patent/MY8600343A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
MY8600343A (en) | 1986-12-31 |
NL8101830A (nl) | 1981-11-16 |
MX154651A (es) | 1987-11-12 |
GB2074103B (en) | 1984-02-15 |
FR2480793B1 (it) | 1984-02-24 |
JPS56158875A (en) | 1981-12-07 |
KR830005394A (ko) | 1983-08-13 |
FR2480793A1 (fr) | 1981-10-23 |
KR880001457B1 (ko) | 1988-08-10 |
CH660029A5 (de) | 1987-03-13 |
GB2074103A (en) | 1981-10-28 |
US4297257A (en) | 1981-10-27 |
DE3115323C2 (it) | 1990-10-04 |
CA1130181A (en) | 1982-08-24 |
DE3115323A1 (de) | 1982-02-04 |
IT8121191A0 (it) | 1981-04-15 |
JPS6354077B2 (it) | 1988-10-26 |
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