IT1125541B - Confezione di materiale di saldatura e metodo per fabbricarla - Google Patents

Confezione di materiale di saldatura e metodo per fabbricarla

Info

Publication number
IT1125541B
IT1125541B IT26682/79A IT2668279A IT1125541B IT 1125541 B IT1125541 B IT 1125541B IT 26682/79 A IT26682/79 A IT 26682/79A IT 2668279 A IT2668279 A IT 2668279A IT 1125541 B IT1125541 B IT 1125541B
Authority
IT
Italy
Prior art keywords
manufacturing
welding material
material packaging
packaging
welding
Prior art date
Application number
IT26682/79A
Other languages
English (en)
Other versions
IT7926682A0 (it
Inventor
John W Dyce
Ronald F Buczak
Original Assignee
Bendix Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bendix Corp filed Critical Bendix Corp
Publication of IT7926682A0 publication Critical patent/IT7926682A0/it
Application granted granted Critical
Publication of IT1125541B publication Critical patent/IT1125541B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49938—Radially expanding part in cavity, aperture, or hollow body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Punching Or Piercing (AREA)
IT26682/79A 1978-10-24 1979-10-22 Confezione di materiale di saldatura e metodo per fabbricarla IT1125541B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/954,267 US4209893A (en) 1978-10-24 1978-10-24 Solder pack and method of manufacture thereof

Publications (2)

Publication Number Publication Date
IT7926682A0 IT7926682A0 (it) 1979-10-22
IT1125541B true IT1125541B (it) 1986-05-14

Family

ID=25495189

Family Applications (1)

Application Number Title Priority Date Filing Date
IT26682/79A IT1125541B (it) 1978-10-24 1979-10-22 Confezione di materiale di saldatura e metodo per fabbricarla

Country Status (8)

Country Link
US (1) US4209893A (it)
JP (1) JPS5557373A (it)
CA (1) CA1119894A (it)
DE (1) DE2942997A1 (it)
FR (1) FR2439644A1 (it)
GB (1) GB2033283B (it)
IN (1) IN153235B (it)
IT (1) IT1125541B (it)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US4774760A (en) * 1986-05-05 1988-10-04 International Business Machines Corporation Method of making a multipad solder preform
JPS63304636A (ja) * 1987-06-05 1988-12-12 Hitachi Ltd はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法
JPH0795554B2 (ja) * 1987-09-14 1995-10-11 株式会社日立製作所 はんだ球整列装置
US4887981A (en) * 1987-11-25 1989-12-19 Augat Inc. Electronic socket carrier system
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
US5205896A (en) * 1992-02-03 1993-04-27 Hughes Aircraft Company Component and solder preform placement device and method of placement
US5303824A (en) * 1992-12-04 1994-04-19 International Business Machines Corporations Solder preform carrier and use
JPH07122594A (ja) * 1993-10-28 1995-05-12 Hitachi Ltd 導電性バンプの形成方法
US5447264A (en) * 1994-07-01 1995-09-05 Mcnc Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5551216A (en) * 1994-09-14 1996-09-03 Vanguard Automation, Inc. Method and apparatus for filling a ball grid array
US5762258A (en) * 1996-07-23 1998-06-09 International Business Machines Corporation Method of making an electronic package having spacer elements
US6202918B1 (en) 1997-01-28 2001-03-20 Eric Hertz Method and apparatus for placing conductive preforms
US6230963B1 (en) 1997-01-28 2001-05-15 Eric L. Hertz Method and apparatus using colored foils for placing conductive preforms
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6182356B1 (en) * 1997-11-24 2001-02-06 International Business Machines Corporation Apparatus for solder ball mold loading
US6268275B1 (en) * 1998-10-08 2001-07-31 Micron Technology, Inc. Method of locating conductive spheres utilizing screen and hopper of solder balls
US6345718B1 (en) * 2000-02-09 2002-02-12 Fry's Metals, Inc. Method and apparatus for immobilizing solder spheres
US6710454B1 (en) * 2000-02-16 2004-03-23 Micron Technology, Inc. Adhesive layer for an electronic apparatus having multiple semiconductor devices
US7600667B2 (en) * 2006-09-29 2009-10-13 Intel Corporation Method of assembling carbon nanotube reinforced solder caps
CN109148311B (zh) * 2018-08-22 2020-05-12 重庆市嘉凌新科技有限公司 芯片焊接装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3396894A (en) * 1965-05-11 1968-08-13 Raychem Corp Solder device
NL6613526A (it) * 1966-09-26 1968-03-27
US3569607A (en) * 1969-08-01 1971-03-09 Ibm Resolderable connector
US3744129A (en) * 1972-02-09 1973-07-10 Rogers Corp Method of forming a bus bar
GB1456378A (en) * 1973-12-21 1976-11-24 Post Office Electrical circuit artwork
US4099615A (en) * 1974-08-22 1978-07-11 Amp, Incorporated Carrier strip mounted electrical components
US4070744A (en) * 1976-07-16 1978-01-31 The United States Of America As Represented By The Secretary Of The Army Washer aligning and placing tool
US4142286A (en) * 1978-03-15 1979-03-06 Burroughs Corporation Apparatus and method for inserting solder preforms on selected circuit board back plane pins

Also Published As

Publication number Publication date
FR2439644A1 (fr) 1980-05-23
DE2942997A1 (de) 1980-05-08
JPS5557373A (en) 1980-04-28
GB2033283A (en) 1980-05-21
US4209893A (en) 1980-07-01
CA1119894A (en) 1982-03-16
GB2033283B (en) 1982-12-22
IN153235B (it) 1984-06-16
IT7926682A0 (it) 1979-10-22

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