IT1121447B - Metodo additivo per l'ottenimento di configurazioni metalliche su substrati di resina sintetica - Google Patents

Metodo additivo per l'ottenimento di configurazioni metalliche su substrati di resina sintetica

Info

Publication number
IT1121447B
IT1121447B IT23743/79A IT2374379A IT1121447B IT 1121447 B IT1121447 B IT 1121447B IT 23743/79 A IT23743/79 A IT 23743/79A IT 2374379 A IT2374379 A IT 2374379A IT 1121447 B IT1121447 B IT 1121447B
Authority
IT
Italy
Prior art keywords
synthetic resin
additive method
resin substrates
obtaining metallic
configurations
Prior art date
Application number
IT23743/79A
Other languages
English (en)
Other versions
IT7923743A0 (it
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of IT7923743A0 publication Critical patent/IT7923743A0/it
Application granted granted Critical
Publication of IT1121447B publication Critical patent/IT1121447B/it

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
IT23743/79A 1978-06-23 1979-06-20 Metodo additivo per l'ottenimento di configurazioni metalliche su substrati di resina sintetica IT1121447B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7806773A NL7806773A (nl) 1978-06-23 1978-06-23 Additieve werkwijze voor het vervaardigen van metaal- patronen op kunststofsubstraten.

Publications (2)

Publication Number Publication Date
IT7923743A0 IT7923743A0 (it) 1979-06-20
IT1121447B true IT1121447B (it) 1986-04-02

Family

ID=19831102

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23743/79A IT1121447B (it) 1978-06-23 1979-06-20 Metodo additivo per l'ottenimento di configurazioni metalliche su substrati di resina sintetica

Country Status (9)

Country Link
US (1) US4259435A (it)
JP (1) JPS554997A (it)
CA (1) CA1141224A (it)
DE (1) DE2924745A1 (it)
FR (1) FR2429540A1 (it)
GB (1) GB2024442B (it)
IT (1) IT1121447B (it)
NL (1) NL7806773A (it)
SE (1) SE7905411L (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6035988U (ja) * 1983-08-17 1985-03-12 株式会社　栗本鉄工所 ダクト継手
US5215867A (en) * 1983-09-16 1993-06-01 At&T Bell Laboratories Method with gas functionalized plasma developed layer
JPS6148570A (ja) * 1984-08-10 1986-03-10 Mitsubishi Electric Corp 樹脂への導体層形成方法
JPH0684543B2 (ja) * 1985-12-18 1994-10-26 呉羽化学工業株式会社 選択的化学メッキ法
US4948707A (en) * 1988-02-16 1990-08-14 International Business Machines Corporation Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
US6277539B1 (en) * 1998-05-22 2001-08-21 The United States Of America As Represented By The United States Department Of Energy Enhanced adhesion for LIGA microfabrication by using a buffer layer
US10281303B2 (en) 2015-03-23 2019-05-07 Rosemount Aerospace, Inc. Air data probe with improved performance at angle of attack operation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562005A (en) * 1968-04-09 1971-02-09 Western Electric Co Method of generating precious metal-reducing patterns
US3562038A (en) * 1968-05-15 1971-02-09 Shipley Co Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited
DE1910021B1 (de) * 1969-02-27 1970-10-01 Siemens Ag Verfahren zur Herstellung von elektrischen Leiterplatten
US3772078A (en) * 1971-07-29 1973-11-13 Kollmorgen Photocircuits Process for the formation of real images and products produced thereby
US3801320A (en) * 1971-10-18 1974-04-02 Monsanto Co Photoimaging in presence of oxygen
CA1053994A (en) * 1974-07-03 1979-05-08 Amp Incorporated Sensitization of polyimide polymer for electroless metal deposition

Also Published As

Publication number Publication date
NL7806773A (nl) 1979-12-28
GB2024442A (en) 1980-01-09
CA1141224A (en) 1983-02-15
SE7905411L (sv) 1979-12-24
US4259435A (en) 1981-03-31
JPS554997A (en) 1980-01-14
DE2924745A1 (de) 1980-01-10
FR2429540B1 (it) 1985-01-18
IT7923743A0 (it) 1979-06-20
FR2429540A1 (fr) 1980-01-18
GB2024442B (en) 1982-09-08

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