IT1114575B - SEAT OF ENCAPSULATION BOX ON ITS MANUFACTURING PROCEDURE AND ELECTRICAL DEVICE SO ENCAPSULATED - Google Patents

SEAT OF ENCAPSULATION BOX ON ITS MANUFACTURING PROCEDURE AND ELECTRICAL DEVICE SO ENCAPSULATED

Info

Publication number
IT1114575B
IT1114575B IT48222/79A IT4822279A IT1114575B IT 1114575 B IT1114575 B IT 1114575B IT 48222/79 A IT48222/79 A IT 48222/79A IT 4822279 A IT4822279 A IT 4822279A IT 1114575 B IT1114575 B IT 1114575B
Authority
IT
Italy
Prior art keywords
encapsulated
seat
electrical device
manufacturing procedure
encapsulation box
Prior art date
Application number
IT48222/79A
Other languages
Italian (it)
Other versions
IT7948222A0 (en
Original Assignee
Europ Composants Electron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Europ Composants Electron filed Critical Europ Composants Electron
Publication of IT7948222A0 publication Critical patent/IT7948222A0/en
Application granted granted Critical
Publication of IT1114575B publication Critical patent/IT1114575B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
IT48222/79A 1978-03-07 1979-03-06 SEAT OF ENCAPSULATION BOX ON ITS MANUFACTURING PROCEDURE AND ELECTRICAL DEVICE SO ENCAPSULATED IT1114575B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7806433A FR2419588A1 (en) 1978-03-07 1978-03-07 ENCAPSULATION BOX BASE, ITS MANUFACTURING PROCESS, AND ELECTRICAL DEVICE THUS ENCAPSULATED

Publications (2)

Publication Number Publication Date
IT7948222A0 IT7948222A0 (en) 1979-03-06
IT1114575B true IT1114575B (en) 1986-01-27

Family

ID=9205431

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48222/79A IT1114575B (en) 1978-03-07 1979-03-06 SEAT OF ENCAPSULATION BOX ON ITS MANUFACTURING PROCEDURE AND ELECTRICAL DEVICE SO ENCAPSULATED

Country Status (4)

Country Link
DE (1) DE2908850A1 (en)
FR (1) FR2419588A1 (en)
GB (1) GB2018020B (en)
IT (1) IT1114575B (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2905873A (en) * 1956-09-17 1959-09-22 Rca Corp Semiconductor power devices and method of manufacture
US2838722A (en) * 1957-06-04 1958-06-10 Ballou & Co B A Semiconductor device
US3242555A (en) * 1961-06-08 1966-03-29 Gen Motors Corp Method of making a semiconductor package

Also Published As

Publication number Publication date
FR2419588B1 (en) 1982-02-26
DE2908850A1 (en) 1979-09-13
FR2419588A1 (en) 1979-10-05
GB2018020A (en) 1979-10-10
IT7948222A0 (en) 1979-03-06
GB2018020B (en) 1982-10-27

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