FR2419588A1 - ENCAPSULATION BOX BASE, ITS MANUFACTURING PROCESS, AND ELECTRICAL DEVICE THUS ENCAPSULATED - Google Patents

ENCAPSULATION BOX BASE, ITS MANUFACTURING PROCESS, AND ELECTRICAL DEVICE THUS ENCAPSULATED

Info

Publication number
FR2419588A1
FR2419588A1 FR7806433A FR7806433A FR2419588A1 FR 2419588 A1 FR2419588 A1 FR 2419588A1 FR 7806433 A FR7806433 A FR 7806433A FR 7806433 A FR7806433 A FR 7806433A FR 2419588 A1 FR2419588 A1 FR 2419588A1
Authority
FR
France
Prior art keywords
encapsulated
manufacturing process
electrical device
box base
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7806433A
Other languages
French (fr)
Other versions
FR2419588B1 (en
Inventor
Jean-Claude Taverdet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROP COMPOSANTS ELECTRON
Original Assignee
EUROP COMPOSANTS ELECTRON
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROP COMPOSANTS ELECTRON filed Critical EUROP COMPOSANTS ELECTRON
Priority to FR7806433A priority Critical patent/FR2419588A1/en
Priority to GB7907929A priority patent/GB2018020B/en
Priority to IT48222/79A priority patent/IT1114575B/en
Priority to DE19792908850 priority patent/DE2908850A1/en
Publication of FR2419588A1 publication Critical patent/FR2419588A1/en
Application granted granted Critical
Publication of FR2419588B1 publication Critical patent/FR2419588B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

La présente invention concerne les boîtiers d'encapsulation de composants en électronique, et plus particulièrement les boîtiers d'encapsulation de quartz. L'invention prévoit de réaliser simultanément un support de fixation pour le composant, situé sur une face principale de l'embase, et une cavité de fixation d'une connexion à la masse, sur l'autre face principale de l'embase. Le support de fixation est obtenu par matriçage, sans perforation de l'embase, le métal de la cavité étant, dans cette région, repoussé de Application aux boîtiers d'encapsulation, notamment de quartz destinés aux filtres en téléphonie.The present invention relates to encapsulation packages for electronic components, and more particularly to quartz encapsulation packages. The invention provides for simultaneously producing a fixing support for the component, located on a main face of the base, and a fixing cavity for a connection to the ground, on the other main face of the base. The fixing support is obtained by stamping, without perforation of the base, the metal of the cavity being, in this region, repelled from Application to encapsulation boxes, in particular of quartz intended for telephony filters.

FR7806433A 1978-03-07 1978-03-07 ENCAPSULATION BOX BASE, ITS MANUFACTURING PROCESS, AND ELECTRICAL DEVICE THUS ENCAPSULATED Granted FR2419588A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR7806433A FR2419588A1 (en) 1978-03-07 1978-03-07 ENCAPSULATION BOX BASE, ITS MANUFACTURING PROCESS, AND ELECTRICAL DEVICE THUS ENCAPSULATED
GB7907929A GB2018020B (en) 1978-03-07 1979-03-06 Base for sealed case of piezoelectric crystal or other electronic component
IT48222/79A IT1114575B (en) 1978-03-07 1979-03-06 SEAT OF ENCAPSULATION BOX ON ITS MANUFACTURING PROCEDURE AND ELECTRICAL DEVICE SO ENCAPSULATED
DE19792908850 DE2908850A1 (en) 1978-03-07 1979-03-07 ENCLOSURE BASE, METHOD OF MANUFACTURING IT, AND ELECTRICAL DEVICE ENCLOSED THEREOF

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7806433A FR2419588A1 (en) 1978-03-07 1978-03-07 ENCAPSULATION BOX BASE, ITS MANUFACTURING PROCESS, AND ELECTRICAL DEVICE THUS ENCAPSULATED

Publications (2)

Publication Number Publication Date
FR2419588A1 true FR2419588A1 (en) 1979-10-05
FR2419588B1 FR2419588B1 (en) 1982-02-26

Family

ID=9205431

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7806433A Granted FR2419588A1 (en) 1978-03-07 1978-03-07 ENCAPSULATION BOX BASE, ITS MANUFACTURING PROCESS, AND ELECTRICAL DEVICE THUS ENCAPSULATED

Country Status (4)

Country Link
DE (1) DE2908850A1 (en)
FR (1) FR2419588A1 (en)
GB (1) GB2018020B (en)
IT (1) IT1114575B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2838722A (en) * 1957-06-04 1958-06-10 Ballou & Co B A Semiconductor device
US2905873A (en) * 1956-09-17 1959-09-22 Rca Corp Semiconductor power devices and method of manufacture
US3242555A (en) * 1961-06-08 1966-03-29 Gen Motors Corp Method of making a semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2905873A (en) * 1956-09-17 1959-09-22 Rca Corp Semiconductor power devices and method of manufacture
US2838722A (en) * 1957-06-04 1958-06-10 Ballou & Co B A Semiconductor device
US3242555A (en) * 1961-06-08 1966-03-29 Gen Motors Corp Method of making a semiconductor package

Also Published As

Publication number Publication date
GB2018020A (en) 1979-10-10
IT1114575B (en) 1986-01-27
IT7948222A0 (en) 1979-03-06
FR2419588B1 (en) 1982-02-26
GB2018020B (en) 1982-10-27
DE2908850A1 (en) 1979-09-13

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Legal Events

Date Code Title Description
ST Notification of lapse