IT1092397B - Metodo di fabbricazione di oggetti che parzialmente o completamente sono costituiti da materiale termoplastico espanso,oggetti fabbricati in conformita' a tale metodo,e apparato per realizzare il metodo stesso - Google Patents

Metodo di fabbricazione di oggetti che parzialmente o completamente sono costituiti da materiale termoplastico espanso,oggetti fabbricati in conformita' a tale metodo,e apparato per realizzare il metodo stesso

Info

Publication number
IT1092397B
IT1092397B IT19996/78A IT1999678A IT1092397B IT 1092397 B IT1092397 B IT 1092397B IT 19996/78 A IT19996/78 A IT 19996/78A IT 1999678 A IT1999678 A IT 1999678A IT 1092397 B IT1092397 B IT 1092397B
Authority
IT
Italy
Prior art keywords
objects
compliance
manufacture
partially
thermoplastic material
Prior art date
Application number
IT19996/78A
Other languages
English (en)
Other versions
IT7819996A0 (it
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of IT7819996A0 publication Critical patent/IT7819996A0/it
Application granted granted Critical
Publication of IT1092397B publication Critical patent/IT1092397B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C2045/0475—Injection moulding apparatus using movable moulds or mould halves continuously movable moulds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04—Polysulfides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Molding Of Porous Articles (AREA)
IT19996/78A 1977-02-08 1978-02-03 Metodo di fabbricazione di oggetti che parzialmente o completamente sono costituiti da materiale termoplastico espanso,oggetti fabbricati in conformita' a tale metodo,e apparato per realizzare il metodo stesso IT1092397B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7701283A NL7701283A (nl) 1977-02-08 1977-02-08 Werkwijze voor het vervaardigen van geheel of ge- deeltelijk uit geschuimd thermoplastisch materiaal bestaande voorwerpen, voorwerpen vervaardigd volgens die werkwijze en inrichting voor het uitvoeren van de werkwijze.

Publications (2)

Publication Number Publication Date
IT7819996A0 IT7819996A0 (it) 1978-02-03
IT1092397B true IT1092397B (it) 1985-07-12

Family

ID=19827940

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19996/78A IT1092397B (it) 1977-02-08 1978-02-03 Metodo di fabbricazione di oggetti che parzialmente o completamente sono costituiti da materiale termoplastico espanso,oggetti fabbricati in conformita' a tale metodo,e apparato per realizzare il metodo stesso

Country Status (14)

Country Link
JP (1) JPS5398368A (it)
AR (1) AR216935A1 (it)
AU (1) AU3303978A (it)
BE (1) BE863694A (it)
BR (1) BR7800707A (it)
CH (1) CH626565A5 (it)
DE (1) DE2803571A1 (it)
ES (2) ES466674A1 (it)
FR (1) FR2379370A1 (it)
GB (1) GB1600427A (it)
IN (1) IN147437B (it)
IT (1) IT1092397B (it)
NL (1) NL7701283A (it)
SE (1) SE7801324L (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2545653B1 (fr) * 1983-05-04 1986-06-06 Pichot Michel Procede et dispositif d'encapsulation de circuits integres
DE3922038A1 (de) * 1989-07-05 1991-01-17 Bayer Ag Verwendung von polyarylensulfiden zur herstellung eines hochtemperaturbestaendigen tsg schaumes, verfahren zur herstellung dieses schaumes sowie damit erhaeltliche formkoerper

Also Published As

Publication number Publication date
SE7801324L (sv) 1978-08-09
ES466674A1 (es) 1978-10-16
CH626565A5 (en) 1981-11-30
GB1600427A (en) 1981-10-14
IT7819996A0 (it) 1978-02-03
ES470079A1 (es) 1979-02-01
JPS5398368A (en) 1978-08-28
NL7701283A (nl) 1978-08-10
DE2803571A1 (de) 1978-08-10
AR216935A1 (es) 1980-02-15
FR2379370A1 (fr) 1978-09-01
IN147437B (it) 1980-02-23
BR7800707A (pt) 1978-10-03
AU3303978A (en) 1979-08-16
BE863694A (fr) 1978-08-07

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